Abstract: A polygon mirror includes: a base body having a plurality of side surfaces, a first surface adjacent to the plurality of side surfaces, and a second surface adjacent to the plurality of side surfaces and opposite to the first surface; and a film formed on the plurality of side surfaces and extending from the plurality of side surfaces over the first surface and the second surface, wherein the film includes: a first region formed on the first surface along the plurality of side surfaces; a second region formed on the second surface along the plurality of side surfaces, and wherein a first volume of the first region and a second volume of the second region are different from each other.

Abstract: A film comprises an amorphous transition metal oxide as a main component, and 1.0 at % or more of hydrogen.

Abstract: A polygon mirror includes: a base body having a plurality of side surfaces, a first surface adjacent to the plurality of side surfaces, and a second surface adjacent to the plurality of side surfaces and opposite to the first surface; and a film formed on the plurality of side surfaces and extending from the plurality of side surfaces over the first surface and the second surface, wherein the film includes: a first region formed on the first surface along the plurality of side surfaces; a second region formed on the second surface along the plurality of side surfaces, and wherein a first volume of the first region and a second volume of the second region are different from each other.

Abstract: In order to provide a polygon mirror which can reduce a light amount difference among respective image heights on a scanned surface with suppressing an increase in size in a light scanning apparatus, the polygon mirror according to the present invention includes a plurality of rectangular reflecting surfaces in which the following condition is satisfied: 0.02<|1?B/A|<0.10 where A represents a reflectivity at a center of the reflecting surface with respect to a light flux which is incident at a predetermined incident angle, and B represents the reflectivity at a predetermined point between the center and an end in the longitudinal direction of the reflecting surface with respect to the light flux which is incident at the predetermined incident angle.

Abstract: The present invention provides an exposure apparatus which includes a projection optical system that projects a pattern of a reticle onto a substrate, and exposes the substrate through the projection optical system and a liquid, the apparatus including a recovery unit which includes a recovery path connected to a recovery port, and is configured to reduce a pressure in the recovery path to recover the liquid, supplied to a space between the projection optical system and the substrate, through the recovery port and the recovery path, and a heating unit which is disposed in the recovery path, and configured to heat the liquid recovered through the recovery port and the recovery path.

Abstract: The present invention provides an exposure apparatus which includes a projection optical system that projects a pattern of a reticle onto a substrate, and exposes the substrate through the projection optical system and a liquid, the apparatus including a recovery unit which includes a recovery path connected to a recovery port, and is configured to reduce a pressure in the recovery path to recover the liquid, supplied to a space between the projection optical system and the substrate, through the recovery port and the recovery path, and a heating unit which is disposed in the recovery path, and configured to heat the liquid recovered through the recovery port and the recovery path.

Abstract: An exposure apparatus for measuring a position of a stage, configured to hold a substrate, using a laser interferometer, and exposing the substrate through an original, and an optical element opposite to the substrate with a gap between the optical element and the substrate filled with liquid. A first supply nozzle is arranged around the optical element, which supplies the liquid to the gap, a first recovery nozzle arranged around the first supply nozzle recovers the liquid from the gap, a second supply nozzle supplies a gas outside the first recovery nozzle, a controller controls an amount of the liquid supplied from the first supply nozzle and an amount of the liquid and gas recovered from the first recovery nozzle, and a wall portion is arranged around the optical element and substantially parallel to a surface of the substrate.

Abstract: An exposure apparatus that exposes a substrate through liquid includes a projection optical system that projects a pattern of an original onto the substrate; a supply port that supplies the liquid; a recovery port that recovers the liquid; and a plurality of pressure resistance portions arranged at a passage of at least one of the supply port and the recovery port, to apply pressure resistances to the liquid passing through the passage. The pressure resistance portions surround a final surface of the projection optical system and are distant from each other in a direction in which the liquid flows through the passage. One the plurality of pressure resistance portions, which is nearest to the substrate, faces the substrate.

Abstract: An exposure apparatus includes a projection optical system for projecting a pattern of an original onto a substrate, a stage for holding the substrate, a cover for substantially surrounding an exposure light path, from an end portion of the projection optical system, at a side facing the stage, to the stage, a first supply port provided inside the cover, for supplying a purge gas into a space surrounded by the cover, and a first exhaust port provided in an end portion of the cover at a side facing the stage, for exhausting the gas.

Abstract: An exposure apparatus of the present invention is configured to flow liquid in an area between an optical element 5 of a projection optical system and a wafer and to expose a pattern on a reticle onto the wafer via the projection optical system. The exposure apparatus includes a supply port 12 configured to supply the liquid 18 to the area, a recovery port 13 configured to recover the liquid 18 from the area, a plane plate 22 configured to be movably positioned, a suction port 23 which is provided on the plane plate 22 and is configured to suction at least one of the liquid 18 and a gas, and a drive unit 27 configured to move a position of the suction port 23 by driving the plane plate 22 in parallel to a surface of the plane plate when the suction port 23 suctions at least one of the liquid 18 and the gas. The drive unit 27 drives the plane plate 22 to move the suction port 23 in a range broader than an exposure area.

Abstract: An exposure apparatus having a stage configured to hold a substrate and to be moved, and a projection optical system configured to project light from a reticle to the substrate held by the stage, and exposing the substrate to light via liquid filled in a gap between the substrate and a final surface of the projection optical system is disclosed. The apparatus comprises a first nozzle configured to supply liquid to the gap; a second nozzle configured to selectively perform recovery of liquid from the gap and supply of liquid to a gap between the stage and the final surface of the projection optical system; and a third nozzle configured to recover liquid supplied via at least the second nozzle.

Abstract: An immersion exposure apparatus for exposing a substrate via liquid is disclosed. The apparatus comprises a projection optical system configured to project an image of a pattern of a reticle onto the substrate, a first recovery nozzle arranged at a periphery of a final optical element of the projection optical system and configured to recover liquid from a gap between the final optical element and the substrate, and a detector configured to detect a foreign particle in the liquid recovered via the first recovery nozzle.

Abstract: An exposure apparatus includes a projection optical system for projecting a pattern of an original onto a substrate, a stage for holding the substrate, a cover for substantially surrounding an exposure light path, from an end portion of the projection optical system, at a side facing the stage, to the stage, a first supply port provided inside the cover, for supplying a purge gas into a space surrounded by the cover, and a first exhaust port provided in an end portion of the cover at a side facing the stage, for exhausting the gas.

Abstract: Disclosed is an exposure apparatus including a projection optical system for projecting a pattern of an original onto a substrate, a stage for holding the substrate, a cover for substantially surrounding an exposure light path, from an end portion of the projection optical system, at a side facing the stage, to the stage, a first supply port provided inside the cover, for supplying a purge gas into a space surrounded by the cover, and a first exhaust port provided in an end portion of said cover at a side facing the stage, for exhausting the gas.

Abstract: An exposure apparatus comprises a projection optical system configured to project light from a reticle onto a substrate, wherein the apparatus is configured to expose the substrate to the light with a gap between the projection optical system and the substrate filled with liquid; a first supply nozzle arranged around a final optical element of the projection optical system and configured to supply the liquid to the gap; a first recovery nozzle arranged around the first supply nozzle and configured to recover the liquid from the gap; and a second supply nozzle arranged in at least a part of a region around the first recovery nozzle and configured to supply a gas so as to form a gas curtain, wherein letting Q1 be a flow rate of the liquid supplied from the first supply nozzle, and Q2 be a sum of flow rates of the liquid and gas recovered from the first recovery nozzle, the apparatus is configured to satisfy a relationship Q1<Q2.

Abstract: An exposure apparatus for exposing a substrate to light via a mask. The apparatus includes a projection optical system configured to project a pattern of the mask onto the substrate, a cover configured to surround a path of light from the projection optical system toward the substrate, a first supply port arranged inside the cover and configured to supply inert gas inside the cover, a first recovery port arranged inside the cover and configured to recover gas inside the cover, a second supply port arranged outside the cover and configured to supply gas outside the cover, and a second recovery port arranged outside the cover and configured to recover gas outside the cover. The first direction from the first supply port to the first recovery port and a second direction from the second supply port to the second recovery port oppose each other at an angle not greater than 90°.

Abstract: Disclosed is an exposure apparatus including a projection optical system for projecting a pattern of an original onto a substrate, a stage for holding the substrate, a cover for substantially surrounding an exposure light path, from an end portion of the projection optical system, at a side facing the stage, to the stage, a first supply port provided inside the cover, for supplying a purge gas into a space surrounded by the cover, and a first exhaust port provided in an end portion of said cover at a side facing the stage, for exhausting the gas.

Abstract: An exposure apparatus for irradiating a photosensitive substrate arranged on a wafer stage with exposure light through a projection optical system includes a cover which extends from a wafer-side end of the projection optical system toward a vicinity of the wafer stage to surround an exposure optical path, a supply port through which purge gas formed of inert gas blows out to inside the cover, and a recovery port through which the purge gas supplied through the supply port is drawn by suction. The purge gas blows out through the supply port and is recovered through the recovery port, to form a purge gas flow inside the cover. At this time, control operation is performed such that the flow rate of the purge gas recovered through the recovery port is smaller than the flow rate of the purge gas supplied through the supply port.