Patents by Inventor Takahito Kagoshima

Takahito Kagoshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing apparatus, information processing system, polishing method, and computer-readable storage medium
    Patent number: 11897078
    Abstract: A polishing apparatus that is capable of referring to a storage in which a machine learning model is stored, the machine learning model being learned using learning data in which a feature amount of a signal regarding a frictional force between a polishing member and a substrate in polishing or a feature amount of a temperature of the polishing member or the substrate in polishing is input, and data regarding a film thickness of the polished substrate or a parameter related to yield of a product included in the polished substrate is output, the device including: a polishing table provided with the polishing member and configured to be rotatable; a polishing head facing the polishing table and configured to be rotatable, wherein the substrate is attachable to a surface facing the polishing table; a control unit configured to perform control to polish the substrate by pressing the substrate against the polishing member while rotating the polishing table and the polishing head having the substrate attached there
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: February 13, 2024
    Assignee: EBARA CORPORATION
    Inventors: Akira Nakamura, Tsuneo Torikoshi, Yuta Suzuki, Hisanori Matsuo, Takahito Kagoshima
  • POLISHING APPARATUS, INFORMATION PROCESSING SYSTEM, POLISHING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM
    Publication number: 20210291312
    Abstract: A polishing apparatus that is capable of referring to a storage in which a machine learning model is stored, the machine learning model being learned using learning data in which a feature amount of a signal regarding a frictional force between a polishing member and a substrate in polishing or a feature amount of a temperature of the polishing member or the substrate in polishing is input, and data regarding a film thickness of the polished substrate or a parameter related to yield of a product included in the polished substrate is output, the device including: a polishing table provided with the polishing member and configured to be rotatable; a polishing head facing the polishing table and configured to be rotatable, wherein the substrate is attachable to a surface facing the polishing table; a control unit configured to perform control to polish the substrate by pressing the substrate against the polishing member while rotating the polishing table and the polishing head having the substrate attached there
    Type: Application
    Filed: March 18, 2021
    Publication date: September 23, 2021
    Inventors: Akira Nakamura, Tsuneo Torikoshi, Yuta Suzuki, Hisanori Matsuo, Takahito Kagoshima