Abstract: A license authentication device includes a memory that stores a license file including a license expiration date of an application that adjusts a parameter of a semiconductor manufacturing apparatus in a semiconductor factory; and a processor coupled to the memory. The processor acquires log data when the semiconductor manufacturing apparatus executes a processing; and determines whether or not a time included in the log data has passed the license expiration date stored in the license information storage.

Abstract: A control device includes a reception unit configured to receive a film characteristic at a plurality of positions of a film formed on a substrate by a film forming processing based on a processing recipe, an optimization processing unit configured to execute an optimization calculation of the processing recipe based on the film characteristic, a diagnosis unit configured to diagnose a validity of an in-plane shape of the film characteristic based on the film characteristic, and a determination unit configured to determine whether or not to notify a user of an encouraging action based on a diagnosis result by the diagnosis unit.

Abstract: A license authentication device includes a memory that stores a license file including a license expiration date of an application that adjusts a parameter of a semiconductor manufacturing apparatus in a semiconductor factory; and a processor coupled to the memory. The processor acquires log data when the semiconductor manufacturing apparatus executes a processing; and determines whether or not a time included in the log data has passed the license expiration date stored in the license information storage.

Abstract: Provided is a control device for controlling an operation of a substrate processing apparatus that forms a predetermined film on a substrate and operations of a plurality of measurement devices that measure a characteristic of the predetermined film. The control device includes: an individual difference information storing unit that stores individual difference information representing a relationship between information allocated to each of the plurality of measurement devices to specify each measurement device and an individual difference of the measurement device; and a controller that corrects a measurement value of the characteristic of the predetermined film measured by the measurement device based on information specifying the measurement device that has measured the characteristic of the predetermined film and the individual difference information stored in the individual difference information storing unit.

Abstract: Disclosed is a substrate processing system that includes a substrate processing apparatus configured to perform a predetermined processing on a substrate accommodated in a processing container. The substrate processing system includes: a processing execution unit configured to execute a film deposition processing on the substrate; a characteristic acquiring unit configured to acquire the characteristic of the film deposited on the substrate by the film deposition processing; and an abnormality determination unit configured to determine whether the characteristic of the film includes an abnormal value based on the characteristic of the film acquired by the characteristic acquiring unit.

Abstract: Disclosed is a substrate processing system that performs a film deposition on plural substrates in a processing container using a film deposition condition calculated based on a characteristic of a film deposited on at least one of the substrates. The substrate processing system includes: a storage unit storing surface state information and arrangement state information that represent influences of a surface state of the one substrate and an arrangement state of the plural substrates on the characteristic of the film deposited on the one substrate, respectively; a calculation unit calculating information that represents an influence of the plural substrates on the characteristic of the film on the one substrate based on the surface state information and the arrangement state information stored in the storage unit; and a correction unit correcting the characteristic of the film deposited on the one substrate based on the information calculated by the calculation unit.

Abstract: Disclosed is a control device that controls an operation of a substrate processing apparatus that forms a laminated film by forming a first film on a substrate and then forming a second film. The control device includes a recipe memory unit storing first and second film formation conditions to form the first and second films, a model memory storing first and second process models that represent the effects of the first film formation conditions on the properties of the first and second films, and a controller configured to: adjust the second film formation condition based on a measured value of a property of the laminated film formed by the first and second film formation conditions, and the second process model stored in the model memory unit; and determine whether or not to adjust the first film formation condition based on an expected value of the property of the laminated film.

Abstract: Disclosed is a substrate processing system that performs a film deposition on plural substrates in a processing container using a film deposition condition calculated based on a characteristic of a film deposited on at least one of the substrates. The substrate processing system includes: a storage unit storing surface state information and arrangement state information that represent influences of a surface state of the one substrate and an arrangement state of the plural substrates on the characteristic of the film deposited on the one substrate, respectively; a calculation unit calculating information that represents an influence of the plural substrates on the characteristic of the film on the one substrate based on the surface state information and the arrangement state information stored in the storage unit; and a correction unit correcting the characteristic of the film deposited on the one substrate based on the information calculated by the calculation unit.

Abstract: Disclosed is a substrate processing system that includes a substrate processing apparatus configured to perform a predetermined processing on a substrate accommodated in a processing container. The substrate processing system includes: a processing execution unit configured to execute a film deposition processing on the substrate; a characteristic acquiring unit configured to acquire the characteristic of the film deposited on the substrate by the film deposition processing; and an abnormality determination unit configured to determine whether the characteristic of the film includes an abnormal value based on the characteristic of the film acquired by the characteristic acquiring unit.

Abstract: Disclosed is a control device that controls an operation of a substrate processing apparatus. The control device includes a recipe memory unit that stores a film formation condition according to a type of the film, a model memory unit that stores a process model that represents an effect of the film formation condition on a property of the film, a log memory unit that stores an actual measurement value of the film formation condition during film formation, and a controller that calculates a film formation condition that satisfies a target property of the film based on a measured result of the property of the film formed based on the film formation condition stored in the recipe memory unit, the process model stored in the model memory unit, and the actual measurement value of the film formation condition stored in the log memory unit.

Abstract: Disclosed is a control device that controls an operation of a substrate processing apparatus that forms a laminated film by forming a first film on a substrate and then forming a second film. The control device includes a recipe memory unit storing first and second film formation conditions to form the first and second films, a model memory storing first and second process models that represent the effects of the first film formation conditions on the properties of the first and second films, and a controller configured to: adjust the second film formation condition based on a measured value of a property of the laminated film formed by the first and second film formation conditions, and the second process model stored in the model memory unit; and determine whether or not to adjust the first film formation condition based on an expected value of the property of the laminated film.

Abstract: Provided is a control device for controlling an operation of a substrate processing apparatus that performs a predetermined processing on a substrate. The control device includes: a recipe storing unit that stores conditions of the predetermined processing including a first condition and a second condition different from the first condition; and a controller that determines, in a first processing performed on the substrate under the first condition and a second processing performed on the substrate under the second condition after the first processing, whether a result of the first processing or a result of the second processing is abnormal based on the result of the second processing and a result predicted from a relationship between the first condition and the second condition.

Abstract: Provided is a control device for controlling an operation of a substrate processing apparatus that forms a predetermined film on a substrate and operations of a plurality of measurement devices that measure a characteristic of the predetermined film. The control device includes: an individual difference information storing unit that stores individual difference information representing a relationship between information allocated to each of the plurality of measurement devices to specify each measurement device and an individual difference of the measurement device; and a controller that corrects a measurement value of the characteristic of the predetermined film measured by the measurement device based on information specifying the measurement device that has measured the characteristic of the predetermined film and the individual difference information stored in the individual difference information storing unit.

Abstract: The heat treatment apparatus that increases a temperature of a processing object and performs a heat treatment in a constant temperature, the heat treatment apparatus includes: a processing chamber which accommodates the processing object; a heating unit which heats the processing object accommodated in the processing chamber; a memory unit which stores two or more temperature control models that are previously created, a temperature controller which controls a temperature of the heating unit; and an apparatus controller which controls the temperature controller and the memory unit, wherein the apparatus controller selects a temperature control model among the two or more temperature control models according to desired heat treatment conditions, and wherein the temperature controller reads out the selected temperature control model from the memory unit to control the heating unit.

Abstract: In accordance with a set temperature profile including: a first step in which a temperature is varied from a first temperature to a second temperature during a first time period; a second step in which the temperature is maintained at the second temperature during a second time period; and a third step in which the temperature is varied from the second temperature to a third temperature; a substrate is subjected to a film deposition process. The first temperature, the second temperature, and the third temperature are determined based on the first relationship between temperature and film thickness, the measured film thicknesses at the plurality of positions, and a predetermined target film thickness. There are calculated expected film thicknesses at a plurality of positions on a substrate to be actually processed in accordance with the set temperature profile corresponding to the determined first temperature, the determined second temperature, and the determined third temperature.