Abstract: A management system for managing a substrate manufacturing process includes agent units configured to monitor a state of a substrate processing device that performs the substrate manufacturing process and detect a predetermined event, and transmission paths configured to, when a predetermined event is detected in any one of the agent units, transmit and receive information between the agent units based on the detected event, wherein the one agent unit derives an instruction to the substrate processing device based on the information transmitted and received via the transmission paths so that an index value of the substrate manufacturing process is optimized.

Abstract: A mechanism of predicting a change in process values with respect to a control target and using a prediction result is provided. A management apparatus includes a prediction model unit, with respect to which an input-output relationship between multivariate control values at a time T with respect to a control target and multivariate process values at a time T+?T with respect to the control target has been learned; and an optimization model unit configured to seek multivariate control values of the time T that minimize respective differences between the multivariate process values at the time T+?T output from the prediction model unit and corresponding target values, and control the control target using the multivariate control values of the time T that have been sought.

Abstract: A data collection system includes: a first substrate processing apparatus having a first processing space, a second substrate processing apparatus having a second processing space, and a data collection apparatus connected to the first substrate processing apparatus and the second substrate processing apparatus. The data collection apparatus is configured to compare observed data observed when substrates having the same or similar shapes are processed under the same processing conditions in the first processing space and the second processing space, respectively, and calculate a correction amount for correcting the observed data observed when being processed in the second processing space, and correct the observed data observed when being processed in the second processing space based on the correction amount, and collect corrected observed data, when searching for a processing condition by processing substrates while changing the processing condition in the second processing space.

Abstract: There is provided a wafer inspecting apparatus which reduces a preheating time of a probe, and prevents the probe and a wafer from being damaged.

Abstract: There is provided a wafer inspecting apparatus which reduces a preheating time of a probe, and prevents the probe and a wafer from being damaged.

Abstract: A semiconductor processing apparatus includes a tester for inspecting a semiconductor device, a display unit 25, a control unit 21, an IC tag reader 29 and an auxiliary storage unit 23 for storing an authority allowed to each operator. The control unit 21 reads an ID from an IC tag possessed by an operator approaching the IC tag reader 29. The control unit 21 refers to the auxiliary storage unit 23 and determines the authority of the operator based on the read ID. Further, the control unit 21 allows an instruction to be inputted within the determined authority range, and composes a manipulation screen allowing a processing status to be viewed, and displays the manipulation screen on the display unit 25. When the operator moves away from the apparatus and the ID cannot be read any longer, the control unit 21 turns on a screen saver to hide the display.