Abstract: A method for producing poly(dimethyl vinylphosphonate) from a monomer component mainly containing dimethyl vinylphosphonate by anionic polymerization in the presence of an anionic polymerization initiator, the method being characterized in that an aliphatic ether is used as a polymerization solvent, and a method for producing poly(vinylphosphonic acid) characterized in that the poly(dimethyl vinylphosphonate) obtained by the former method is hydrolyzed in the presence of an acid are provided. The methods make it possible to easily produce a poly(dimethyl vinylphosphonate) which has a high molecular weight and in which the molecular weight is controlled, and make it possible to produce a poly(vinylphosphonic acid) which has a high molecular weight and in which the molecular weight is controlled corresponding to the poly(dimethyl vinylphosphonate).

Abstract: A method for producing poly(dimethyl vinylphosphonate) from a monomer component mainly containing dimethyl vinylphosphonate by anionic polymerization in the presence of an anionic polymerization initiator, the method being characterized in that an aliphatic ether is used as a polymerization solvent, and a method for producing poly(vinylphosphonic acid) characterized in that the poly(dimethyl vinylphosphonate) obtained by the former method is hydrolyzed in the presence of an acid are provided. The methods make it possible to easily produce a poly(dimethyl vinylphosphonate) which has a high molecular weight and in which the molecular weight is controlled, and make it possible to produce a poly(vinylphosphonic acid) which has a high molecular weight and in which the molecular weight is controlled corresponding to the poly(dimethyl vinylphosphonate).

Abstract: A cyclic-olefin-based thermoplastic resin for thermal imprint to be used in the production of a sheet or a film which contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]<30. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved.

Abstract: A cyclic-olefin-based thermoplastic resin for thermal imprint to be used in the production of a sheet or a film which contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]<30. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved.

Abstract: A resin for thermal imprint include a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. Tg(° C.

Abstract: To provide a novel ABA-type triblock copolymer of vinyl ether series, comprising polyvinyl ether and an oxystyrene-series unit, and a process of producing the ABA-type copolymer at a series of steps. The invention relates to a novel ABA-type triblock copolymer comprising Segment A comprising an oxystyrene-series repeat unit (a) and Segment B comprising a vinyl ether-series repeat unit (b), in which the Segment A and the Segment B are bonded together with a single bond, and to a simple process of producing the same. The triblock copolymer can be produced at a series of steps in a simple manner, comprising living cationic polymerization of a vinyl ether-series monomer such as ethyl vinyl ether in the presence of a bifunctional initiator and a Lewis acid, and subsequently adding an oxystyrene-series monomer such as p-hydroxystyrene for living cationic polymerization.

Abstract: A resin for thermal imprint including a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. Tg (° C.

Abstract: To provide a novel ABA-type triblock copolymer of vinyl ether series, comprising polyvinyl ether and an oxystyrene-series unit, and a process of producing the ABA-type copolymer at a series of steps. The invention relates to a novel ABA-type triblock copolymer comprising Segment A comprising an oxystyrene-series repeat unit (a) and Segment B comprising a vinyl ether-series repeat unit (b), in which the Segment A and the Segment B are bonded together with a single bond, and to a simple process of producing the same. The triblock copolymer can be produced at a series of steps in a simple manner, comprising living cationic polymerization of a vinyl ether-series monomer such as ethyl vinyl ether in the presence of a bifunctional initiator and a Lewis acid, and subsequently adding an oxystyrene-series monomer such as p-hydroxystyrene for living cationic polymerization.

Abstract: A cyclic-olefin-based thermoplastic resin for thermal imprint to be used in the production of a sheet or a film which contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]<30. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. Tg(° C.

Abstract: A resin for thermal imprint comprises a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260 ° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. Tg (° C.

Abstract: The positive photosensitive resin of the present invention has an acid-labile protecting group and the structure represented by the following general formula (1): (wherein X1 and X2 may be the sake or different and each independently a straight or branched chain hydrocarbon group, having 1 to 30 carbon atoms, an alicyclic hydrocarbon group or a heterocyclic group, which may substituted with straight or branched chain hydrocarbon of 1 to 6 carbon atoms or —O— hydrocarbon; Y1 and Y2 may be the same or different and are each independently a hydrogen atom, a straight or branched chain hydrocarbon group having 1 to 6 carbon atoms, a sulfur-containing hydrocarbon group, or an aromatic hydrocarbon group which may have a substituent; and two Zs may be the same or different and each independently an oxygen atom or a sulfur atom).

Abstract: By resolving objections in the prior art, provided are a novel copolymer suitable as a coating polymers which is excellent in adhesion to a substrate and can be used suitably as the polymer for the coating film having durability against pattern collapse in the finer pattern formation for progressed lithography technology and a method for producing the copolymer, as well as a novel thiol compound useful as a chain transfer agent in the production of the copolymer. The novel thiol compound of the present invention has the structure represented by the formula (1); wherein R1 is a bivalent substituent selected from linear, branched or cyclic saturated hydrocarbon having 1 to 15 carbon atoms.

Abstract: By resolving objections in the prior art, provided are a novel copolymer suitable as a coating polymers which is excellent in adhesion to a substrate and can be used suitably as the polymer for the coating film having durability against pattern collapse in the finer pattern formation for progressed lithography technology and a method for producing the copolymer, as well as a novel thiol compound useful as a chain transfer agent in the production of the copolymer. The novel thiol compound of the present invention has the structure represented by the formula (1); wherein R1 is a bivalent substituent selected from linear, branched or cyclic saturated hydrocarbon having 1 to 15 carbon atoms.

Abstract: By resolving objections in the prior art, provided are a novel copolymer suitable as a coating polymers which is excellent in adhesion to a substrate and can be used suitably as the polymer for the coating film having durability against pattern collapse in the finer pattern formation for progressed lithography technology and a method for producing the copolymer, as well as a novel thiol compound useful as a chain transfer agent in the production of the copolymer. The novel thiol compound of the present invention has the structure represented by the formula (1); wherein R1 is a bivalent substituent selected from linear, branched or cyclic saturated hydrocarbon having 1 to 15 carbon atoms.

Abstract: The present invention provides a positive photosensitive resin and a resist composition containing the positive photosensitive resin, both of which are used for fine pattern formation in semiconductor production and are preferably used in a semiconductor lithography of higher-than-before sensitivity.

Abstract: A positive photosensitive resin having, in the high-molecular main chain, a structure represented by the following general formula (1): and a dithiol compound represented by the following general formula (2): The positive photosensitive resin can alleviate the problems of conventional technique and, when used for formation of a fine patter in semiconductor production, can show a higher resist sensitivity than conventional products and can bring about effects such as reduction in impurities after development. The dithiol compound is novel and extremely suitable for use in production of the positive photosensitive resin.

Abstract: By resolving objections in the prior art, provided are a novel copolymer suitable as a coating polymers which is excellent in adhesion to a substrate and can be used suitably as the polymer for the coating film having durability against pattern collapse in the finer pattern formation for progressed lithography technology and a method for producing the copolymer, as well as a novel thiol compound useful as a chain transfer agent in the production of the copolymer.