Abstract: A semiconductor device includes first and second metal plates which are disposed to face each other, a semiconductor chip, a first insulator block, and a package. The first semiconductor chip has first and second electrodes exposed on first and second surface respectively. The first and second electrodes are connected to the first and second metal plates, respectively. The first insulator block is adjacent to the first semiconductor chip, and has a first surface in contact with the first metal plate, and a second surface. The second surface is on the opposite side of the first insulator block from the first surface and is in contact with the second metal plate. The package is in contact with a surface to which the first semiconductor chip of the first metal plate is connected and a surface to which the first semiconductor chip of the second metal plate is connected.

Abstract: A reactor device formed by containing a reactor body comprising a plurality of cores joined with each other within a case in a floating state. The reactor body is placed on a case by using leaf spring bodies and a movement of the reactor body in the horizontal direction is allowed, thereby absorbing a difference in expansion resulting from a difference in the thermal expansion coefficient between the reactor body and the case due to a heat stress. Further, a resin mold is inserted into a concave portion of the case so as to allow the movement in the horizontal direction so that the movement of the reactor body along a slope surface can be achieved, thereby absorbing the difference in expansion.

Abstract: A cooling apparatus includes a case in which a refrigerant passage through which a refrigerant flows is formed inside, and an element module partially disposed within the refrigerant passage and including an element provided inside. A portion of the element module in contact with the refrigerant is formed of an insulating material.

Abstract: A reactor includes a core body having a U-shape block core and an I-shape block core arranged with a gap, a coil wound on an outer circumference of the core body, and a gap plate inserted into the gap between the U-shape block core and I-shape block core. The gap plate includes a coil retaining member extending towards and retaining the coil. By such a configuration, a reactor having temperature increase at the coil suppressed can be provided.

Abstract: A cooling apparatus includes a case in which a refrigerant passage through which a refrigerant flows is formed inside, and an element module partially disposed within the refrigerant passage and including an element provided inside. A portion of the element module in contact with the refrigerant is formed of an insulating material.

Abstract: A reactor device formed by containing a reactor body comprising a plurality of cores joined with each other within a case in a floating state. The reactor body is placed on a case by using leaf spring bodies and a movement of the reactor body in the horizontal direction is allowed, thereby absorbing a difference in expansion resulting from a difference in the thermal expansion coefficient between the reactor body and the case due to a heat stress. Further, a resin mold is inserted into a concave portion of the case so as to allow the movement in the horizontal direction so that the movement of the reactor body along a slope surface can be achieved, thereby absorbing the difference in expansion.