Abstract: Provided is an efficient method for attaching a tissue section. In the invention, one of problems is solved by changing attachment conditions of the tissue section depending on an organ from which the tissue section is derived. A technique of achieving good adhesiveness between a microscope slide and a section by introducing unevenness on a front surface of the microscope slide using reactive ion etching as one of the attachment conditions is provided. Further, a technique of optimizing the attachment of the section using a machine learning technique or the like is provided.

Abstract: A semiconductor device has a circuit element region formed on a semiconductor substrate, and a protective pattern formed so as to surround the circuit element region.

Abstract: A semiconductor device has a circuit element region formed on a semiconductor substrate, and a protective pattern formed so as to surround the circuit element region.

Abstract: A pickup device comprises a thrusting mechanism, a carrying mechanism and a controller. The thrusting mechanism is configured to thrust the chips sequentially by using pins from a back side of the adhesive tape with the adhesive tape between the chips and the pins so as to peel the chips off the adhesive tape. The carrying mechanism is configured to sequentially absorb the chips with use of a collet, hold the chips to be absorbed until the chips are peeled off the adhesive tape, thereafter pick the chips up by ascending the collet in order to be carried the chips to a subsequent process stage. The controller is configured to controlling the thrust of the chip by thrusting mechanism, the controller control an ascend time and a descend time of the pins, and keeping a predetermined period of a time when the pins arrive at their peak.

Abstract: In order to suppress the warp of a semiconductor package of an over-coat structure, when thermal expansion coefficient, Young's modulus and thickness of the wiring substrate are &agr;s, Es and Hs, respectively, and thermal expansion coefficient, Young's modulus and thickness of the resin layer are &agr;r, Er and Hr, respectively, the value R of (&agr;r·Er·Hr)/(&agr;s·Es·Hs) is set to be approximately 0.6 or more. With adoption of such a configuration, stress exerting on a semiconductor package can be effectively alleviated, and coplanarity of the semiconductor package can be improved.

Abstract: An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip.

Abstract: A pickup device comprises a thrusting mechanism, a carrying mechanism and a controller. The thrusting mechanism is configured to thrust the chips sequentially by using pins from a back side of the adhesive tape with the adhesive tape between the chips and the pins so as to peel the chips off the adhesive tape. The carrying mechanism is configured to sequentially absorb the chips with use of a collet, hold the chips to be absorbed until the chips are peeled off the adhesive tape, thereafter pick the chips up by ascending the collet in order to be carried the chips to a subsequent process stage. The controller is configured to controlling the thrust of the chip by thrusting mechanism, the controller control an ascend time and a descend time of the pins, and keeping a predetermined period of a time when the pins arrive at their peak.

Abstract: In order to suppress the warp of a semiconductor package of an over-coat structure, when thermal expansion coefficient, Young's modulus and thickness of the wiring substrate are &agr;s, Es and Hs, respectively, and thermal expansion coefficient, Young's modulus and thickness of the resin layer are &agr;r, Er and Hr, respectively, the value R of (&agr;r·Er·Hr)/(&agr;s·Es·Hs) is set to be approximately 0.6 or more. With adoption of such a configuration, stress exerting on a semiconductor package can be effectively alleviated, and coplanarity of the semiconductor package can be improved.

Abstract: An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip.

Abstract: An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip.

Abstract: A semiconductor package is provided that includes a semiconductor chip that is mounted on a mount board with metal bumps interposed therebetween so as to create a gap. A structure is provided in the gap for limiting the flow of a resin, which is deposited along side the semiconductor chip, around the peripheral portion of the semiconductor chip. The structure increases the resistance to the flow of the resin in the peripheral portion of the semiconductor chip. Therefore, the rate at which the resin flows in the peripheral portion of the semiconductor chip is made lower than the rate at which the resin flows near the central portion of semiconductor chip. Accordingly, the formation of a resin-less void in the gap is suppressed so that the grade and quality of the semiconductor device is improved. In one embodiment, the structure in the gap includes projections provided on a portion of the mount board that corresponds to the peripheral portion of the semiconductor chip.

Abstract: In a method for manufacturing a flip-chip bonded semiconductor device is used an apparatus for resin-encapsulating, the apparatus which comprises a molding die consisting of a plurality of mold bodies, device for decompressing cavities of the molding die, device for heating the molding die, and device for injecting a liquid resin under pressure into the cavities, to form a resin-encapsulating layer by transfer molding. A bonded body having a semiconductor chip connected to a wiring substrate through its bumps is placed in the cavities of the molding die, the cavities are heated and decompressed, then the liquid resin is injected under pressure into the cavities through a gate to form a resin-encapsulating layer. Thus, the molding resin can be filled uniformly into the gap between the semiconductor chip and the wiring substrate in a short time to produce a flip-chip bonded semiconductor device having good performances.

Abstract: An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip.

Abstract: In the disclosed method of manufacturing semiconductor devices with a single-sided resin-sealed package structure, when resin is filled into between the chip and the substrate, the occurrence of variations in the finishing dimensions of the package or defects in the outward appearance of the package is prevented.