Abstract: A method for manufacturing a light emitting module includes: providing a light emitting device; placing a joining member on a wiring of a wiring board, the joining member containing solder particles and flux containing at least one of a solvent and an active agent; mounting the light emitting device on the joining member; performing a first heating process in which the wiring board, the joining member, and the light emitting device are heated for a first heating time in a first temperature range that is higher than a prescribed temperature, and lower than a fusing point of the solder particles; and performing a second heating process for a second heating time in a second temperature range higher than the fusing point of the solder particles, the second heating time being shorter than the first heating time.