Patents by Inventor Takahito SEKIDO

Takahito SEKIDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
    Publication number: 20220389130
    Abstract: The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and an imidazole compound (C) represented by a specific formula.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 8, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Masashi OKANIWA, Kohei HIGASHIGUCHI, Takahito SEKIDO, Kentaro TAKANO, Tsuyoshi KIDA
  • FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING A SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
    Publication number: 20220344227
    Abstract: The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and a hydroperoxide (C).
    Type: Application
    Filed: June 26, 2020
    Publication date: October 27, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Masashi OKANIWA, Kohei HIGASHIGUCHI, Takahito SEKIDO, Kentaro TAKANO, Tsuyoshi KIDA
  • FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
    Publication number: 20220332868
    Abstract: A film containing: a propenyl group-containing resin (A) including, at an end of a molecule, a constituent unit represented by the following formula (1); a radical polymerizable resin or compound (B) other than the propenyl group-containing resin (A); and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) includes at least one selected from the group consisting of a maleimide group and a citraconimide group. In the formula (1), —* represents a bonding hand.
    Type: Application
    Filed: June 26, 2020
    Publication date: October 20, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takahito SEKIDO, Masashi OKANIWA, Genki SUGIYAMA, Kentaro TAKANO, Tsuyoshi KIDA