Patents by Inventor Takahito Takayanagi

Takahito Takayanagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8659900
    Abstract: A circuit board is provided with a plurality of arms and a heat radiation plate. The insulating substrate of the each of the arms includes: a passive element region to which a passive element is connected; an active element region to which an active element is connected; and a wiring region on which wiring lines of the element group are laid. In the each of the arms, the passive element region, the active element region and the wiring region align in a lengthwise direction of the insulating substrate, and the passive element region and the wiring region are arranged on both sides of the active element region which is located centrally.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: February 25, 2014
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takahito Takayanagi, Masami Ogura, Kosuke Kasagi
  • Patent number: 8415801
    Abstract: There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: April 9, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: Masami Ogura, Takahito Takayanagi, Yuko Yamada, Jun Kato, Tsugio Masuda, Tsukasa Aiba, Fumitomo Takano
  • Publication number: 20110267781
    Abstract: A circuit board is provided with a plurality of arms and a heat radiation plate. The insulating substrate of the each of the arms includes: a passive element region to which a passive element is connected; an active element region to which an active element is connected; and a wiring region on which wiring lines of the element group are laid. In the each of the arms, the passive element region, the active element region and the wiring region align in a lengthwise direction of the insulating substrate, and the passive element region and the wiring region are arranged on both sides of the active element region which is located centrally.
    Type: Application
    Filed: April 28, 2011
    Publication date: November 3, 2011
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Takahito Takayanagi, Masami Ogura, Kosuke Kasagi
  • Publication number: 20100308465
    Abstract: There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.
    Type: Application
    Filed: June 4, 2010
    Publication date: December 9, 2010
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Masami Ogura, Takahito Takayanagi, Yuko Yamada, Jun Kato, Tsugio Masuda, Tsukasa Aiba, Fumitomo Takano