Abstract: The present invention provides a hydrolysate of a lignocellulosic material, and specifically a method of using a hydrolysis treatment liquid obtained by a hydrolysis treatment of a lignocellulosic material before kraft cooking in order to obtain dissolving pulp for uses other than use of a fuel. Specifically, the present invention provides a dispersant containing the hydrolysate obtained by hydrolysis treatment of the lignocellulosic material. The dispersant of the present invention has excellent dispersibility for a substance such as an inorganic substance and an organic substance without limitation of powder, particulate, granular, fiber, and flat plane shapes.

Abstract: The present invention provides a hydrolysate of a lignocellulosic material, and specifically a method of using a hydrolysis treatment liquid obtained by a hydrolysis treatment of a lignocellulosic material before kraft cooking in order to obtain dissolving pulp for uses other than use of a fuel. Specifically, the present invention provides a dispersant containing the hydrolysate obtained by hydrolysis treatment of the lignocellulosic material. The dispersant of the present invention has excellent dispersibility for a substance such as an inorganic substance and an organic substance without limitation of powder, particulate, granular, fiber, and flat plane shapes.

Abstract: Soldering can be performed in a state where the temperature in an object zone is stable, regardless of the heat capacity of a soldering object. A soldering device includes: a position calculation unit which calculates the position of a heated object according to operational information of a conveyer which sequentially transfers the heated object into a plurality of zones for heat processing communicated with each other; a heat capacity calculation unit which calculates the heat capacity of the heated object; and a temperature management unit which controls the temperature in an object zone into which the heated object is carried, upon receiving positional information from the position calculation unit. The temperature management unit feedforward-controls the temperature in the object zone by adjusting the heat capacity of the object zone according to the heat capacity calculated by the heat capacity calculation unit.

Abstract: Soldering can be performed in a state where the temperature in an object zone is stable, regardless of the heat capacity of a soldering object. A soldering device includes: a position calculation unit which calculates the position of a heated object according to operational information of a conveyer which sequentially transfers the heated object into a plurality of zones for heat processing communicated with each other; a heat capacity calculation unit which calculates the heat capacity of the heated object; and a temperature management unit which controls the temperature in an object zone into which the heated object is carried, upon receiving positional information from the position calculation unit. The temperature management unit feedforward-controls the temperature in the object zone by adjusting the heat capacity of the object zone according to the heat capacity calculated by the heat capacity calculation unit.

Abstract: A method for controlling a heating apparatus whereby the heating apparatus is started up effectively with limited power consumption. A heating priority is determined by multiplying the temperature deviation in each zone by a heat capacity coefficient specific for each zone. The heating priority of each zone is determined alternatively by multiplying an adjacency temperature deviation between adjacent zones by an adjacency coefficient that is set based on the adjacency relationship. The order of zones from the highest to lowest heating priorities is determined, and a plurality of zones are combined in such a manner as to include ones having, respectively, the highest and lowest heating priorities to prepare a group. Similarly, other plurality of zones are combined to prepare groups repeatedly. The power consumption of heaters is limited in each of these groups.

Abstract: This invention provides a soldering method capable of solving soldering defects due to excess molten solder in the case of soldering while applying an inner pressure into a through-hole of a lead component mounting substrate: (a) In a primary soldering step, a lead component mounting substrate is lowered, and the rear surface thereof is put close to or brought into close contact with an upper end opening edge of a nozzle. Simultaneously, the soldering surface of the molten solder supplied to the nozzle is elevated. (b) In a secondary soldering step, the rear surface of the lead component mounting substrate is relatively spaced from the soldering surface of molten solder by lowering the soldering surface. (c) In a lead separating step, the lead component mounting substrate is elevated while tilting the lead component mounting substrate.