Abstract: A method for manufacturing a curved surface multi-layer wiring board having the through-holes and high accurate inner patters with a high reliability. A curved surface multi-layer wiring board is manufactured by processes for forming the inner pattern on the copper clad substrates, and for perforating the holes to the substrates and prepregs, and for laying-up these substrates and prepregs, then for pressing these substrates and prepregs in the formation mould. Then the outer pattern are formed by the laser exposure process after the through holes are connected between the layers. A method is also provided for repeating the laying-up processes in order to obtain a curved surface multi-layer wiring board of which is a three dimensional curved surface.

Abstract: A method for manufacturing a curved surface multi-layer wiring board having highly accurate inner patterns with high reliability. A curved surface multi-layer wiring board is manufactured by providing and pressing a prepreg to form a curved surface, and by plating a copper film on the curved surface. Outer patterns are formed on the copper film. The outer patterns may be formed by a laser exposure process after through-holes are connected between the layers. A method is also provided for repeating the process to obtain a curved surface multi-layer wiring board which has a three dimensional curved surface.