Abstract: Provided is a coating device and a method capable of coating a conductor of a plurality of electrical wires with coating material with simple configuration and of coating without exposing the conductor. A nozzle and a coating area of a terminal-equipped electrical wire are applied to voltage by a voltage applying unit such as to be electrified with polarity different from each other, and jetting jet liquid forms jet liquid over the whole coating area, forms the coating layer with anticorrosion material on a surface of the terminal-equipped electrical wire, and coats the coating area including a conductor with anticorrosion material without being exposed. Furthermore, it is possible to allow the nozzle jet the jet liquid and to move the nozzle in an arranging direction of the terminal-equipped electrical wire, and also to coat the coating area of the terminal-equipped electrical wire with anticorrosion material.

Abstract: Provided is a coating device and a method capable of coating a conductor of a plurality of electrical wires with coating material with simple configuration and of coating without exposing the conductor. A nozzle and a coating area of a terminal-equipped electrical wire are applied to voltage by a voltage applying unit such as to be electrified with polarity different from each other, and jetting jet liquid forms jet liquid over the whole coating area, forms the coating layer with anticorrosion material on a surface of the terminal-equipped electrical wire, and coats the coating area including a conductor with anticorrosion material without being exposed. Furthermore, it is possible to allow the nozzle jet the jet liquid and to move the nozzle in an arranging direction of the terminal-equipped electrical wire, and also to coat the coating area of the terminal-equipped electrical wire with anticorrosion material.

Abstract: A spray device includes an opening gap between a needle-shaped needle tip and a first nozzle hole. The gap is adjusted by a very tiny amount by a needle movement amount adjustment device, and liquid oozes from the first nozzle hole along the needle tip part. The liquid is formed into tiny particles by a first atomization compressed gas flowing through the first atomization compressed gas passage and is exhausted from a second nozzle hole. The exhaust flow passes through a third nozzle hole and is exhausted. The third nozzle's second atomization/eddy flow formation compressed gas collides with this exhaust flow, so the exhaust flow is made into even smaller particles, and swirls and disperses, and is applied to the coated object.

Abstract: A spray device includes an opening gap between a needle-shaped needle tip and a first nozzle hole. The gap is adjusted by a very tiny amount by a needle movement amount adjustment device, and liquid oozes from the first nozzle hole along the needle tip part. The liquid is formed into tiny particles by a first atomization compressed gas flowing through the first atomization compressed gas passage and is exhausted from a second nozzle hole. The exhaust flow passes through a third nozzle hole and is exhausted. The third nozzle's second atomization/eddy flow formation compressed gas collides with this exhaust flow, so the exhaust flow is made into even smaller particles, and swirls and disperses, and is applied to the coated object.

Abstract: In the process for producing a laminated substrate (1) such as electronic substrates (2; 3), when applying a sealing agent (7) to the end face of substrates (2; 3) combined together to seal it, first the sealing agent (7) is applied to a target area in the form of successive beads (7), and then a stream of compressed gas (10) is blown against the successive beads (7) from a gas ejecting nozzle (9) so as to scan the successive beads (7). The method can effectively fill the indentation or the stepped area formed along the end face with the sealing agent (7).

Abstract: Apparatus and methods for spray coating selected areas of a circuit board with an insulative coating material without coating regions of the circuit board to be left uncoated. A liquid spray device emits the coating material and an air assist attachment connected to the liquid spray device directs jets of air into impinging relation with the coating material emitted therefrom to transform the coating material into an atomized, shaped spray pattern for coating the selected areas. The air assist attachment can be disabled so that the spray device transforms the coating material into a non-atomized, shaped spray pattern for coating selected areas without coating regions of the circuit board to be left uncoated.

Abstract: An adaptor for liquid dispensing of precisely controlled amounts through an outlet of a liquid filled syringe includes a valve shaft extended through an inlet of the syringe, along the syringe and seated against a valve seat assembly at the outlet of the syringe. The valve seat assembly and a cylindrical casing cooperatively mount the syringe to a housing assembly. A spring within the housing assembly biases the valve shaft to a normally closed position against the valve seat assembly. By pressurizing the liquid in the syringe, timer actuation of a solenoid within the housing assembly retracts the valve shaft away from the valve seat assembly to an open position to force the pressurized liquid through the outlet and out of the syringe.

Abstract: A method of applying coating material to only selected areas of a packaged printed circuit board wherein the coating material is supplied to a flat-pattern nozzle at a pressure sufficient to produce a liquid film emission in a flat triangular or dovetail shaped pattern which portion of the nozzle emission is substantially free of atomized particles. The circuit board is positioned relative the nozzle to place the board in the path of the film pattern and relative movement between the nozzle and board is effect in conjunction with controlling the supply of coating to the nozzle to coat only desired regions of the board while avoiding deposit of coating material on areas to be left uncoated.

Abstract: A method of applying coating material to only selected areas of a packaged printed circuit board wherein the coating material is supplied to a flat-pattern nozzle at a pressure sufficient to produce a liquid film emission in a flat leaf-shaped pattern which portion of the nozzle emission is substantially free of atomized particles. The circuit board is positioned relative the nozzle to place the board in the path of the film pattern and relative movement between the nozzle and board is effected in conjunction with controlling the supply of coating to the nozzle to coat only desired regions of the board while avoiding deposit of coating material on areas to be left uncoated.