Patents by Inventor Takaji Shimosaka

Takaji Shimosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6914023
    Abstract: The object of the present invention is to provide a flat-panel-display substrate which is high in heat resistance, of which the coefficient of thermal expansion is approximated to that of a thick film dielectric layer, which is low at high temperatures in reactivity with the lead-doped thick film dielectric layer, and which can be made to have a large area. The substrate of the present invention is obtained by sintering a body comprising glass powder and a filler made of metal and/or semi-metal oxide, and is constituted by the sintered body and whose average coefficient of linear thermal expansion is from 7 to 9.5 ppm/° C. in the temperature range of 25 to 700° C. The glass powder includes alkaline-earth oxide, 15 to 50% by weight of silicon oxide, and no greater than 2% by weight of boron oxide. Furthermore, the filler is at a concentration of 10 to 30% by volume of the total amount of the glass powder and the filler in the mould.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: July 5, 2005
    Assignee: TDK Corporation
    Inventors: Takaji Shimosaka, Yukihiko Shirakawa, Shirou Ootsuki
  • Publication number: 20040138042
    Abstract: The object of the present invention is to provide a flat-panel-display substrate which is high in heat resistance, of which the coefficient of thermal expansion is approximated to that of a thick film dielectric layer, which is low at high temperatures in reactivity with the lead-doped thick film dielectric layer, and which can be made to have a large area. The substrate of the present invention is obtained by sintering a body comprising glass powder and a filler made of metal and/or semi-metal oxide, and is constituted by the sintered body and whose average coefficient of linear thermal expansion is from 7 to 9.5 ppm/° C. in the temperature range of 25 to 700° C. The glass powder includes alkaline-earth oxide, 15 to 50% by weight of silicon oxide, and no greater than 2% by weight of boron oxide. Furthermore, the filler is at a concentration of 10 to 30% by volume of the total amount of the glass powder and the filler in the mould.
    Type: Application
    Filed: July 16, 2003
    Publication date: July 15, 2004
    Applicant: TDK CORPORATION
    Inventors: Takaji Shimosaka, Yukihiko Shirakawa, Shirou Ootsuki
  • Patent number: 6287996
    Abstract: A ceramic color composition which comprises from 5 to 40 wt % of a heat-resistant color pigment powder, from 50 to 94.5 wt % of a glass powder, from 0 to 25 wt % of a refractory filler, and from 0.1 to 40 wt % of at least one whisker-like refractory filler selected from the group consisting of aluminum borate whiskers, &agr;-alumina whiskers, potassium titanate whiskers, zinc oxide whiskers, Na2Ca2P2O18 whiskers, magnesium oxide whiskers, magnesium borate whiskers, basic magnesium sulfate (MgSO4.5MgO.8H2O) whiskers and titanium diboride whiskers.
    Type: Grant
    Filed: September 10, 1999
    Date of Patent: September 11, 2001
    Assignee: Asahi Glass Company Ltd.
    Inventors: Jiro Chiba, Takaji Shimosaka, Kenji Mukai, Shuji Taguchi, Mineyuki Ishida, Hitoshi Onoda, Hiroshi Usui, Tsuneo Manabe