Abstract: A printed circuit board having a multi-layered copper plating film with excellent mechanical characteristics is obtained by a process of non-electrolytic copper plating comprising at least one sequence of the following steps (a)-(d):(a) immersing the printed circuit board to be plated in a non-electrolytic copper plating bath;(b) drawing out the immersed board from the bath;(c) immersing the drawn out board in the bath; and(d) drawing out the immersed board from the bath.In place of using one non-electrolytic copper plating bath, two non-electrolytic copper plating baths containing same solutes and having different concentration of the solutes in baths and/or different temperature of the baths respectively are used alternately.