Abstract: In order to provide a curing agent (alkoxylated resole-type phenolic resin) with which a coating film having high hot-water resistance, high workability, and high adhesion to metals may be formed without limiting the main agent to be a bisphenol-A-type epoxy resin, the present invention provides a method for producing an alkoxylated resole-type phenolic resin. The method includes reacting a phenol (a1) including meta-cresol with an aldehyde (a2) in the presence of a basic compound to prepare a resole-type phenolic resin (A); and reacting the resole-type phenolic resin (A) with an alcohol (B) in the presence of an acidic compound having an acid dissociation constant (pKa) of 0 or less.

Abstract: In order to provide a curing agent (alkoxylated resole-type phenolic resin) with which a coating film having high hot-water resistance, high workability, and high adhesion to metals may be formed without limiting the main agent to be a bisphenol-A-type epoxy resin, the present invention provides a method for producing an alkoxylated resole-type phenolic resin. The method includes reacting a phenol (a1) including meta-cresol with an aldehyde (a2) in the presence of a basic compound to prepare a resole-type phenolic resin (A); and reacting the resole-type phenolic resin (A) with an alcohol (B) in the presence of an acidic compound having an acid dissociation constant (pKa) of 0 or less.

Abstract: Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).

Abstract: Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).

Abstract: The present invention provides a (meth)acryloyl group-containing resin having excellent heat resistance and a phenolic hydroxyl group-containing compound used as a raw material of the resin. A phenolic hydroxyl group-containing compound has a molecular structure represented by general formula (1) below [in the formula, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms, m and n are each independently an integer of 1 to 4, p is an integer of 0 to 4, V is a hydrogen atom, a (meth)acryloyloxy group, or a hydroxyl group, and W, X, and Y are each independently a (meth)acryloyloxy group or a hydroxyl group], wherein at least one of V, W, X, and Y is a hydroxyl group, and at least one of V, W, X, and Y is a (meth)acryloyloxy group.

Abstract: Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).

Abstract: The present invention provides a modified novolac phenol resin having excellent developability and heat resistance, a method for producing the same, a photosensitive composition, a resist material, and a permanent film. The modified novolac phenol resin has a molecular structure in which hydrogen atoms of phenolic hydroxyl groups possessed by a novolac phenol resin (C) are partially or entirely substituted by acid dissociable groups, the novolac phenol resin (C) being produced by condensing an aromatic compound (A) represented by structural formula (1) below with an aldehyde compound (B).

Abstract: The present invention provides a (meth)acryloyl group-containing resin having excellent heat resistance and a phenolic hydroxyl group-containing compound used as a raw material of the resin. A phenolic hydroxyl group-containing compound has a molecular structure represented by general formula (1) below [in the formula, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms, m and n are each independently an integer of 1 to 4, p is an integer of 0 to 4, V is a hydrogen atom, a (meth)acryloyloxy group, or a hydroxyl group, and W, X, and Y are each independently a (meth)acryloyloxy group or a hydroxyl group], wherein at least one of V, W, X, and Y is a hydroxyl group, and at least one of V, W, X, and Y is a (meth)acryloyloxy group.

Abstract: Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).

Abstract: A positive photoresist composition includes 3 to 80 parts by mass of a novolac phenol resin (B) relative to 100 parts by mass of a cresol novolac resin (A).

Abstract: An object of the present invention is to provide a radically curable compound which produces cured products with excellent heat resistance, and in order to achieve the object, the present invention provides a radically curable compound represented by general formula (1) below. (In the formula, R1 and R2 are each independently an alkyl group having 1 to 8 carbon atoms, R3 and R4 are each independently a hydrogen atom or a methyl group, m and n are each independently an integer of 1 to 4, and X is an aromatic hydrocarbon group or an aromatic hydrocarbon group substituted by an alkyl group having 1 to 8 carbon atoms.

Abstract: A positive photoresist composition includes 3 to 80 parts by mass of a novolac phenol resin (B) relative to 100 parts by mass of a cresol novolac resin (A).

Abstract: Provided is a positive photoresist composition containing a cresol novolac resin (A) manufactured using m-cresol, p-cresol, and formaldehyde as essential raw materials and a novolac phenolic resin (B) manufactured using o-cresol, resorcinol, and formaldehyde as essential raw materials. This positive photoresist composition has high sensitivity and high heat resistance at the same time, which have so far been difficult to achieve at the same time, at a higher level and is suitable for use as a resist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, which have required formation of finer patterns with the increasing packing density in recent years, the manufacture of displays such as LCDs, and the manufacture of printing plates.

Abstract: Provided is a positive photoresist composition containing, as an essential component, a novolac phenolic resin (C) prepared by condensing an aromatic compound (A) represented by general formula (1) or (2) with an aliphatic aldehyde (B). This positive photoresist composition has high sensitivity and high heat resistance at the same time, and is suitable for use as a positive photoresist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, the manufacture of displays such as LCDs, and the manufacture of printing plates. (In the formulas, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms; m, n, and p are each independently an integer of 0 to 4; q is an integer of 1 to (5?p); and s is an integer of 1 to (9?p).

Abstract: An object of the present invention is to provide a radically curable compound which produces cured products with excellent heat resistance, and in order to achieve the object, the present invention provides a radically curable compound represented by general formula (1) below. (In the formula, R1 and R2 are each independently an alkyl group having 1 to 8 carbon atoms, R3 and R4 are each independently a hydrogen atom or a methyl group, m and n are each independently an integer of 1 to 4, and X is an aromatic hydrocarbon group or an aromatic hydrocarbon group substituted by an alkyl group having 1 to 8 carbon atoms.

Abstract: Provided is a positive photoresist composition containing, as an essential component, a novolac phenolic resin (C) prepared by condensing an aromatic compound (A) represented by general formula (1) or (2) with an aliphatic aldehyde (B). This positive photoresist composition has high sensitivity and high heat resistance at the same time, and is suitable for use as a positive photoresist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, the manufacture of displays such as LCDs, and the manufacture of printing plates. (In the formulas, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms; m, n, and p are each independently an integer of 0 to 4; q is an integer of 1 to (5?p); and s is an integer of 1 to (9?p).

Abstract: Provided is a positive photoresist composition containing a cresol novolac resin (A) manufactured using m-cresol, p-cresol, and formaldehyde as essential raw materials and a novolac phenolic resin (B) manufactured using o-cresol, resorcinol, and formaldehyde as essential raw materials. This positive photoresist composition has high sensitivity and high heat resistance at the same time, which have so far been difficult to achieve at the same time, at a higher level and is suitable for use as a resist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, which have required formation of finer patterns with the increasing packing density in recent years, the manufacture of displays such as LCDs, and the manufacture of printing plates.