Patents by Inventor Takakazu Murakami

Takakazu Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220309458
    Abstract: A method of processing information related to a distributed item includes generating attachment information and acquiring a reference request and requester information. The attachment information is associated with history information accumulated for the distributed item and is to be distributed along with the distributed item. The reference request is made for a reference to the history information using the attachment information attached to the distributed item. The requester information contains at least location data of a requester terminal that made the reference request.
    Type: Application
    Filed: June 13, 2022
    Publication date: September 29, 2022
    Inventors: Tatsuya OKABE, Yuka TAMURA, Shintarou HARA, Takakazu MURAKAMI
  • Patent number: 9048525
    Abstract: An antenna circuit which includes a substrate and a planar circuit with a circuit line of a conductive material formed on a surface of the substrate, and at least one conductive pad (notch-forming part) electrically connected with the circuit line of the planar circuit. Cutting lines, such as perforations, are provided in the substrate around an outer periphery of the notch-forming part and extend into the notch-forming part on either side of connection points where the circuit line connects with the notch-forming part, The cutting lines approach each other in the notch-forming part to form a section (notch port). The antenna circuit can be destroyed even if an IC tag provided with the antenna circuit is peeled off from various directions, and the destruction rate of the circuit can be increased stably.
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: June 2, 2015
    Assignee: LINTEC CORPORATION
    Inventors: Taiga Matsushita, Katsumi Katakura, Takakazu Murakami, Masateru Yamakage
  • Patent number: 7952527
    Abstract: According to the present invention, there is disclosed an antenna circuit characterized by comprising: a substrate, a surface circuit consisting of a planar coil circuit portion and at least one pair of opposed electrodes connected to the planar coil circuit portion formed on the substrate, at least one terminal for formation of broken line, formed in a conductor constituting the surface circuit, and a broken line which penetrates through the substrate and the surface circuit and which has, in the terminal for formation of broken line, at least one uncut part passing through the terminal for formation of broken line.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: May 31, 2011
    Assignee: Lintec Corporation
    Inventors: Taiga Matsushita, Naoki Hasegawa, Takakazu Murakami
  • Publication number: 20100328162
    Abstract: The present invention provides an antenna circuit which comprises a substrate, a planar circuit consisting of a circuit line of a conductive material formed on a surface of the substrate, and at least one notch-forming part connected with the circuit line of the planar circuit, wherein cutting lines are provided in the substrate around an outer periphery of the notch-forming part, each of the cutting lines on both sides of the circuit line connected with the notch-forming part are extended in the direction of the inside of the notch-forming part from the outside of the notch-forming part, up to the substrate and the notch-forming part, and the cutting lines are approached each other in the notch-forming part to form a notch part. The antenna circuit can be destroyed even if an IC tag comprising the antenna circuit is peeled off from various direction, and the destruction rate of the circuit can be increased stably.
    Type: Application
    Filed: February 17, 2009
    Publication date: December 30, 2010
    Applicant: LINTEC CORPORATION
    Inventors: Taiga Matsushita, Katsumi Katakura, Takakazu Murakami, Masateru Yamakage
  • Patent number: 7626548
    Abstract: The present invention discloses: an IC inlet 110 which comprises a substrate 2, a surface circuit including a plain coil circuit portion 6 formed on the substrate and opposed electrodes 8 and 12 individually connected with the two ends of the plain coil circuit portion 6, and an IC chip 16 mounted in connection with the opposed electrodes, wherein a cut-away broken line 22 formed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: December 1, 2009
    Assignee: Lintec Corporation
    Inventors: Taiga Matsushita, Yasukazu Nakata, Takakazu Murakami
  • Publication number: 20090096706
    Abstract: According to the present invention, there is disclosed an antenna circuit characterized by comprising: a substrate, a surface circuit consisting of a planar coil circuit portion and at least one pair of opposed electrodes connected to the planar coil circuit portion formed on the substrate, at least one terminal for formation of broken line, formed in a conductor constituting the surface circuit, and a broken line which penetrates through the substrate and the surface circuit and which has, in the terminal for formation of broken line, at least one uncut part passing through the terminal for formation of broken line.
    Type: Application
    Filed: May 2, 2006
    Publication date: April 16, 2009
    Applicant: Lintec Corporation
    Inventors: Taiga Matsushita, Naoki Hasegawa, Takakazu Murakami
  • Publication number: 20080036677
    Abstract: The present invention discloses: an IC inlet 110 which comprises a substrate 2, a surface circuit including a plain coil circuit portion 6 formed on the substrate and opposed electrodes 8 and 12 individually connected with the two ends of the plain coil circuit portion 6, and an IC chip 16 mounted in connection with the opposed electrodes, wherein a cut-away broken line 22 formed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.
    Type: Application
    Filed: June 20, 2005
    Publication date: February 14, 2008
    Applicant: LINTEC CORPORATION
    Inventors: Taiga Matsushita, Yasukazu Nakata, Takakazu Murakami