Patents by Inventor Takaki Kashihara

Takaki Kashihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin molding material for sealing use and semiconductor device
    Patent number: 7397139
    Abstract: An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 ?m or less and a specific surface area of 3.0 m2/g or more.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: July 8, 2008
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara, Fumio Furusawa, Masaki Yoshii, Shinsuke Hagiwara, Mitsuo Katayose
  • Epoxy resin molding material for sealing use and semiconductor device
    Publication number: 20060214153
    Abstract: 1. An encapsulating epoxy resin molding material, comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the inorganic filler (C) has an average particle size of 12 ?m or less and a specific surface area of 3.0 m2/g or more.
    Type: Application
    Filed: April 7, 2004
    Publication date: September 28, 2006
    Inventors: Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Yoshinori Endou, Takaki Kashihara, Fumio Furusawa, Masaki Yoshii, Shinsuke Hagiwara, Mitsuo Katayose
  • Encapsulating material and LOC structure semiconductor device using the same
    Patent number: 6211277
    Abstract: An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.
    Type: Grant
    Filed: October 2, 1998
    Date of Patent: April 3, 2001
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tatsuo Kawata, Hiroki Sashima, Takaki Kashihara, Masanobu Fujii, Naoki Nara, Terumi Tsukahara, Hiroyuki Sakai