Patents by Inventor Takaki Kokubun

Takaki Kokubun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual in-line packaging and method of producing the same
    Patent number: 5219795
    Abstract: A dual in-line packaging comprises a substrate having a top surface, a bottom surface and a peripheral surface, semiconductor chips mounted on the top and bottom surfaces of the substrate, a plurality of terminals fixed to the substrate and projecting from the bottom surface of the substrate, a first layer made of a first material and covering the bottom surface of the substrate and the semiconductor chips, and a second layer made of a second material and covering the top surface of the substrate and the semiconductor chips. The first material is resilient and moisture resistant and the second material is hard compared to the first material.
    Type: Grant
    Filed: April 28, 1992
    Date of Patent: June 15, 1993
    Assignee: Fujitsu Limited
    Inventors: Toshio Kumai, Takaki Kokubun, Shingo Nojiri
  • Dual in-line packaging with improved moisture resistance
    Patent number: 5130780
    Abstract: A dual in-line packaging comprises a substrate having a top surface, a bottom surface and a peripheral surface, semiconductor chips mounted on the top and bottom surfaces of the substrate, a plurality of terminals fixed to the substrate and projecting from the bottom surface of the substrate, a first layer made of a first material and covering the bottom surface of the substrate and the semiconductor chips, and a second layer made of a second material and covering the top surface of the substrate and the semiconductor chips. The first material is resilient and moisture resistant and the second material is hard compared to the first material.
    Type: Grant
    Filed: March 21, 1991
    Date of Patent: July 14, 1992
    Assignee: Fujitsu Limited
    Inventors: Toshio Kumai, Takaki Kokubun, Shingo Nojiri