Patents by Inventor Takaki Naito

Takaki Naito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120033931
    Abstract: A waveguide having a main body, an inner housing, and a wave receiving transmission path. The main body includes a body resin member, a concave groove extending in a longitudinal direction and a body metal plating layer over an entire surface of the concave groove. The inner housing has a resin cover member and an inner housing metal plating layer along an inner wall of the inner housing. The wave receiving transmission path is formed when the inner housing covers the concave groove of the main body when the main body and cover are assembled together.
    Type: Application
    Filed: October 12, 2011
    Publication date: February 9, 2012
    Inventors: Hideyuki Usui, Takaki Naito
  • Publication number: 20120001705
    Abstract: A high-frequency coupler used in communication of high frequency signals, which aims to provide a high-frequency coupler satisfying both constant communication quality and thinning. The high-frequency coupler includes a circuit board and a toroidal coil. The circuit board includes a first receiving passageway and a second receiving passageway. The toroidal coil extends through the first receiving passageway and the second receiving passageway between a first surface and a second surface of the circuit board. The toroidal coil orbits on both sides of the first surface and the second surface in a circular shape. The toroidal coil reverses an orbiting direction at a position substantially near a half of a length of the toroidal coil.
    Type: Application
    Filed: September 19, 2011
    Publication date: January 5, 2012
    Inventors: Daisuke Nozue, Takaki Naito, Daisuke Dobashi, Shunnosuke Takasu
  • Patent number: 6872084
    Abstract: An electrical connector assembly in which conductor pads on a board are used as contacts is described. Signal conductor pads transmitting positive and negative differential signals, are disposed on one side of the board. A ground pad is disposed on the opposite side of the board so that it is positioned at an intermediate point between the positive and negative signal conductor pads, thus forming one set of pads. The signal conductor pads of another adjacent set, are disposed on the same side as the signal pad of the previous set such that their negative differential signals an adjacent. The pad of a third set (not shown in the figures) which is adjacent to the positive signal pad of the second set is a pad that transmits the same positive differential signal. As a result, signal crosstalk can be prevented.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: March 29, 2005
    Assignee: Tyco Electronics AMP, K.K.
    Inventors: Takaki Naito, Doron Lapidot
  • Publication number: 20040127091
    Abstract: The present invention aims to provide an electrical cable assembly which is inexpensive and allows a user to make a proper connection between devices. Electrical connectors which are fixed on both ends of the cable are provided with a visual indicator which enables a user to make a proper connection with a tuner or PDP (Plasma Display Panel) even with the interchangeable mating surfaces of the electrical connectors.
    Type: Application
    Filed: December 12, 2003
    Publication date: July 1, 2004
    Inventors: Takaki Naito, Doron Lapidot, Masayuki Aizawa
  • Patent number: 6752633
    Abstract: The invention relates to an electrical cable for termination to an electrical component and method for termination that minimizes the mismatching of the differential impedance of a terminal part from which a shielding covering of an electrical cable has been stripped in a cable consisting of two differential transmission signal wires, a drain wire and a shielding covering that covers the electrical wire. Accordingly, a plastic heat-shrink tube is caused to adhere tightly to the terminal part and shielding covering, except for the stripped front end portion of the terminal part, so that the front end portion is exposed. As a result, the heat-shrink tube prevents or alleviates the mismatching of the differential impedance.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: June 22, 2004
    Assignee: Tyco Electronics. AMP, K.K.
    Inventors: Masayuki Aizawa, Takaki Naito
  • Patent number: 6746265
    Abstract: The male connector 1 has a metal shielding shell 4 that accommodates a housing 2 and a synthetic resin enclosure 8 that covers approximately the rear half of this shielding shell 4. Fastening parts 40 and protruding parts 42 are formed by stamping in the upper-side shell half-body 4a. A metal latching arm 44 which is formed with the approximate shape of a shallow inverted V, and which has an engaging part 54, is disposed between these fastening parts 40 and protruding parts 42. The latching arm 44 can be pressed by means of a finger-catch part 68. This configuration obtains the desired shielding performance while maintaining a compact size in a shielded electrical connector assembly.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: June 8, 2004
    Assignee: Tyco Electronics. AMP, K.K.
    Inventors: Hiroshi Shirai, Katsuhiko Kobayashi, Naotaka Sasame, Takaki Naito, Doron Lapidot
  • Patent number: 6561849
    Abstract: An improved high speed connector is provided in which conductive pads (34) are alternately disposed on both sides of a board (10). The conductive pad (34a) transmits a + differential signal, and the conductive pad (34b) transmits a − differential signal. These conductive pads are disposed on the same surface (10a). The pad (34c) used for grounding is disposed on the opposite surface (10b) so that this pad (34c) is positioned between the conductive pads (34a) and (34b), thus forming one set of pads. In the case of the conductive pads (34d), (34e) and (34f) of another adjacent set, the pad (34d) which transmits a − differential signal is disposed on the same side as the pad (34b) of the previous set which transmits the same − differential signal. The pad (34f) used for grounding is disposed on the opposite side from the pads (34d) and (34e).
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: May 13, 2003
    Assignee: Tyco Electronics. AMP, K.K.
    Inventors: Takaki Naito, Doron Lapidot
  • Publication number: 20020050386
    Abstract: The invention relates to an electrical cable for termination to an electrical component and method for termination that minimizes the mismatching of the differential impedance of a terminal part from which a shielding covering of an electrical cable has been stripped in a cable consisting of two differential transmission signal wires, a drain wire and a shielding covering that covers the electrical wire. Accordingly, a plastic heat-shrink tube is caused to adhere tightly to the terminal part and shielding covering, except for the stripped front end portion of the terminal part, so that the front end portion is exposed. As a result, the heat-shrink tube prevents or alleviates the mismatching of the differential impedance.
    Type: Application
    Filed: October 24, 2001
    Publication date: May 2, 2002
    Inventors: Masayuki Aizawa, Takaki Naito
  • Publication number: 20020039857
    Abstract: An improved high speed connector is provided in which conductive pads (34) are alternately disposed on both sides of a board (10). The conductive pad (34a) transmits a + differential signal, and the conductive pad (34b) transmits a − differential signal. These conductive pads are disposed on the same surface (10a). The pad (34c) used for grounding is disposed on the opposite surface (10b) so that this pad (34c) is positioned between the conductive pads (34a) and (34b), thus forming one set of pads. In the case of the conductive pads (34d), (34e) and (34f) of another adjacent set, the pad (34d) which transmits a − differential signal is disposed on the same side as the pad (34b) of the previous set which transmits the same − differential signal. The pad (34f) used for grounding is disposed on the opposite side from the pads (34d) and (34e).
    Type: Application
    Filed: September 28, 2001
    Publication date: April 4, 2002
    Inventors: Takaki Naito, Doron Lapidot
  • Publication number: 20020039860
    Abstract: The male connector 1 has a metal shielding shell 4 that accommodates a housing 2 and a synthetic resin enclosure 8 that covers approximately the rear half of this shielding shell 4. Fastening parts 40 and protruding parts 42 are formed by stamping in the upper-side shell half-body 4a. A metal latching arm 44 which is formed with the approximate shape of a shallow inverted V, and which has an engaging part 54, is disposed between these fastening parts 40 and protruding parts 42. The latching arm 44 can be pressed by means of a finger-catch part 68. This configuration obtains the desired shielding performance while maintaining a compact size in a shielded electrical connector assembly.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 4, 2002
    Inventors: Hiroshi Shirai, Katsuhiko Kobayashi, Naotaka Sasame, Takaki Naito, Doron Lapidot
  • Publication number: 20010027041
    Abstract: An electrical connector assembly in which conductor pads on a board are used as contact is described. The conductor pads (34) are alternately disposed on both sides of a board (10). The conductor pad (34a) transmits a positive differential signal, and the conductor pad (34b) transmits a negative differential signal; these conductor pads are disposed on the same side (10a) of the board (10). The ground pad (34c) is disposed on the opposite side (10b) of the board (10) so that this ground pad (34c) is positioned at an intermediate point between the conductor pads (34a) and (34b), thus forming one set of pads. In regard to the conductor pads (34d), (34e) and (34f) of another adjacent set, the pad (34d) which transmits a positive differential signal is disposed on the side of the pad (34b) of the previous set, which transmits the same negative differential signal. The ground pad (34f) of this set is disposed on the opposite side of the board (10) from the pads (34d) and (34e).
    Type: Application
    Filed: March 28, 2001
    Publication date: October 4, 2001
    Inventors: Takaki Naito, Doron Lapidot
  • Patent number: 5907213
    Abstract: The present invention provides a low-cost piezoelectric cable and wire harness using the same, which offer a high connection reliability without picking up interference signals in areas where the cable acts as a sensor. Coaxial piezoelectric cable 10 has a piezoelectric material layer 14 disposed between a core conductor 12 and an outer conductor 16. Piezoelectric material layer 14 is polarized and shows piezoelectric properties in a region 20 which extends along a window frame 2 of an automobile, but is not polarized, and therefore shows no piezoelectric properties, in a region 22 in which it is not desired that the cable act as a sensor. Accordingly, there is no pick-up of false signals in the region 22.
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: May 25, 1999
    Assignee: Measurement Specialties, Inc.
    Inventors: Ryuichi Oshima, Takaki Naito, Kyung Tae Park
  • Patent number: 5702269
    Abstract: An electrical connector for interconnecting a flexible printed circuit with a printed circuit board comprises a plug connector and a socket connector. The plug connector includes a plug housing having an end portion of the flexible printed circuit fastened thereon. The socket connector includes a socket housing which defines a cavity open through a top of the socket housing and dimensioned to receive the plug connector therein. A flexible film which carries a plurality of conductors is wrapped around an elastomer, and the elastomer is disposed in the cavity with the conductors arrayed for mating engagement with respective circuit paths on the flexible printed circuit. The flexible film is fastened to a bridge part of the socket housing adjacent to the cavity.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: December 30, 1997
    Inventors: Masaki Uchida, Takaki Naito, Hiroshi Shirai, Koichi Iino, Hiroyuki Okazaki