Abstract: A cover tape for packaging electronic components is formed that causes no contamination of sealing bar due to the outflow of the cushion layer, and attains superior adhesion to the carrier tape. Embodiments include a cover tape, for packaging electronic components heat-sealable to a carrier tape for packaging electronic components, comprising: at least a base layer, a cushion layer formed of resin A, a following layer formed along the heat-seal layer of resin B, and a heat-sealing layer laminated in this order; wherein resin A has a Vicat softening temperature Ta measured in accordance with ISO 306 (rate of temperature increase:50° C./hour, load: 10N),and resin B comprises a linear low density polyethylene and has a Vicat softening temperature Tb measured in accordance with ISO 306 (rate of temperature increase:50° C./hour, load: 10N) satisfying the Relational Expression 1 below; and the thickness of the following layer is not smaller than 2 ?m and not larger than 15 ?m: Ta?Tb?3(° C.).

Abstract: A cover tape for packaging electronic components that causes no contamination of sealing bar by the outflow of cushion layer and attains superior adhesion characteristic with the carrier tape is provided. A cover tape for packaging electronic components heat-sealable to a carrier tape for packaging electronic components, comprising at least a base layer, a cushion layer formed of resin A, a heat-seal following layer formed of resin B and a heat-sealing layer laminated in this order; wherein Vicat softening temperature Ta of said resin A measured in accordance with ISO 306 (rate of temperature increase: 50° C./hour, load: 10 N) and Vicat softening temperature Tb of said resin B measured in accordance with ISO 306 (rate of temperature increase: 50° C./hour, load: 10 N) satisfy the Relational Expression 1 below; and thickness of said heat-seal following layer is not smaller than 2 ?m and not larger than 15 ?m: Ta?Tb?3(° C.).