Patents by Inventor Takako Hayakawa

Takako Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10803908
    Abstract: Approaches to patching a leaky hermetically-sealed device include the use of a laminate rework patch that includes an adhesive tape layer, an aluminum sheet layer, and an outer cover layer, and whereby a viscous adhesive is injected or otherwise applied between the patch and the device leak location, over a layer of primer material, to fill the leak and stop the leakage of gas from inside the device. The thickness of the viscous adhesive, and thus the curing time and temperature of the viscous adhesive, can be managed by way of the thickness of the adhesive tape layer.
    Type: Grant
    Filed: January 25, 2020
    Date of Patent: October 13, 2020
    Assignee: Western Digital Technologies, Inc.
    Inventors: Hitoshi Tamura, Takako Hayakawa
  • Publication number: 20200265868
    Abstract: Disclosed here is a magnet comprising a magnet body. The magnet body comprises a plurality of coated magnetic granules.
    Type: Application
    Filed: August 28, 2019
    Publication date: August 20, 2020
    Inventors: Toshio Takahashi, Kazushi Tsuwako, Masamichi Sakauchi, Takako Hayakawa, Kouki Uefune
  • Patent number: 10575424
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: February 25, 2020
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yuta Onobu, Takako Hayakawa, Kimihiko Sudo, Seong-Hun Choe, Takehito Nagata, Yuji Soga, Nobumasa Nishiyama, Kazuhiro Nagaoka
  • Patent number: 10460768
    Abstract: A base member includes a recessed portion extending in radial directions and recessed upward from a lower surface of the base member, and a hole extending through the recessed portion in the vertical direction. The recessed portion includes a recessed portion loop-shaped surface defining a loop-shaped surface in the radial direction. A connector is located on a lower side of the recessed portion to cover the hole portion. An adhesive is located between the connector and the recessed portion.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: October 29, 2019
    Assignees: NIDEC CORPORATION, WEST DIGITAL TECHNOLOGIES, INC.
    Inventors: Masahiro Akagi, Takeshi Ohiro, Tomohiro Yoneda, Akihiro Yudate, Takayuki Ishino, Sho Nakamura, Jiro Kaneko, Takako Hayakawa, Kimihiko Sudo, Yuta Onobu
  • Patent number: 10424345
    Abstract: A misalignment-tolerant flexible type electrical feed-through assembly, which is able to tolerate connector misalignment, involves a flexible circuit assembly (FCA) part constructed as a laminate structure of a base insulating layer, a conductor layer, and a cover insulating layer, where the FCA part is wrapped around a plurality of metal parts, where the metal parts are slidable relative to each other. Such a feed-through assembly may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment.
    Type: Grant
    Filed: December 22, 2018
    Date of Patent: September 24, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: Miki Namihisa, Kimihiko Sudo, Takako Hayakawa, Yuichi Arai
  • Publication number: 20190104630
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Application
    Filed: February 20, 2017
    Publication date: April 4, 2019
    Inventors: Yuta ONOBU, Takako HAYAKAWA, Kimihiko SUDO, Seong-Hun CHOE, Takehito NAGATA, Yuji SOGA, Nobumasa NISHIYAMA, Kazuhiro NAGAOKA
  • Patent number: 10164358
    Abstract: An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electrically conductive connection pad material, such as a solder pad, coupled thereto. In variations, the top and/or bottom apexes may be slightly recessed from a corresponding surface of the non-conductive material, such that the connection pads fill the respective recesses; and/or the top and/or bottom apexes barely extend from a corresponding surface, such that the connection pads bulge out from the corresponding surface. Such a feed-through configuration may inhibit pin bending, in addition to enabling use of more types of connectors beyond pin-and-socket type connectors.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: December 25, 2018
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kyosuke Yoshida, Kimihiko Sudo, Takako Hayakawa, Hajime Eguchi, Yuta Onobu
  • Publication number: 20180322909
    Abstract: A base member includes a recessed portion arranged to extend in radial directions and recessed upward from a lower surface of the base member, the radial directions being directions perpendicular to a vertical direction or directions parallel to these directions; and a hole portion arranged to pass through the recessed portion in the vertical direction. The recessed portion includes a recessed portion loop-shaped surface being a loop-shaped surface perpendicular to the vertical direction. A connector is arranged on a lower side of the recessed portion to cover the hole portion. An adhesive is arranged between the connector and the recessed portion.
    Type: Application
    Filed: June 26, 2018
    Publication date: November 8, 2018
    Inventors: Jiro Kaneko, Takako Hayakawa, Kimihiko Sudo, Yuta Onobu
  • Publication number: 20180308525
    Abstract: A base member includes a recessed portion arranged to extend in radial directions and recessed upward from a lower surface of the base member, the radial directions being directions perpendicular to a vertical direction or directions parallel to these directions; and a hole portion arranged to pass through the recessed portion in the vertical direction. The recessed portion includes a recessed portion loop-shaped surface being a loop-shaped surface perpendicular to the vertical direction. A connector is arranged on a lower side of the recessed portion to cover the hole portion. An adhesive is arranged between the connector and the recessed portion.
    Type: Application
    Filed: June 26, 2018
    Publication date: October 25, 2018
    Inventors: Jiro Kaneko, Takako Hayakawa, Kimihiko Sudo, Yuta Onobu
  • Publication number: 20180308526
    Abstract: A base member includes a recessed portion arranged to extend in radial directions and recessed upward from a lower surface of the base member, the radial directions being directions perpendicular to a vertical direction or directions parallel to these directions; and a hole portion arranged to pass through the recessed portion in the vertical direction. The recessed portion includes a recessed portion loop-shaped surface being a loop-shaped surface perpendicular to the vertical direction. A connector is arranged on a lower side of the recessed portion to cover the hole portion. An adhesive is arranged between the connector and the recessed portion.
    Type: Application
    Filed: June 26, 2018
    Publication date: October 25, 2018
    Inventors: Jiro Kaneko, Takako Hayakawa, Kimihiko Sudo, Yuta Onobu
  • Publication number: 20180097301
    Abstract: An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electrically conductive connection pad material, such as a solder pad, coupled thereto. In variations, the top and/or bottom apexes may be slightly recessed from a corresponding surface of the non-conductive material, such that the connection pads fill the respective recesses; and/or the top and/or bottom apexes barely extend from a corresponding surface, such that the connection pads bulge out from the corresponding surface. Such a feed-through configuration may inhibit pin bending, in addition to enabling use of more types of connectors beyond pin-and-socket type connectors.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 5, 2018
    Inventors: Kyosuke Yoshida, Kimihiko Sudo, Takako Hayakawa, Hajime Eguchi, Yuta Onobu
  • Patent number: 9870806
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 16, 2018
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yuta Onobu, Takako Hayakawa, Kimihiko Sudo, Seong-Hun Choe, Takehito Nagata, Yuji Soga, Nobumasa Nishiyama, Kazuhiro Nagaoka
  • Publication number: 20170278551
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Application
    Filed: January 13, 2017
    Publication date: September 28, 2017
    Inventors: Yuta ONOBU, Takako HAYAKAWA, Kimihiko SUDO, Seong-Hun CHOE, Takehito NAGATA, Yuji SOGA, Nobumasa NISHIYAMA, Kazuhiro NAGAOKA
  • Patent number: 9721619
    Abstract: A hermetically-sealed hard disk drive (HDD) utilizes a laminated film seal to seal an interface of an electrical feed-through connector and an HDD enclosure base. The laminated film seal may be constructed of a heat sealant layer that bonds with a surface of the base and a surface of the electrical connector, a barrier layer which inhibits gas from escaping from inside the HDD, and a film surface protective layer which protects the heat sealant and barrier layers. Embodiments may include a heat sealant layer comprising a thermoplastic polymer such as polypropylene, a barrier layer comprising a metal such as aluminum, and a film surface protective layer comprising a thermoplastic polymer such as polyethylene terephthalate.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: August 1, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kimihiko Sudo, Takako Hayakawa, Yuichi Arai, Yuta Onobu
  • Patent number: 9721620
    Abstract: A hermetically-sealed hard disk drive (HDD) utilizes a laminated film seal to seal an HDD cover-to-base interface. The laminated film seal may be constructed of a heat sealant layer hermetically-coupled to and forming a seal with the base, a barrier layer which inhibits gas from escaping from inside the HDD, and a film surface protective layer which protects the heat sealant and barrier layers. Embodiments may include a heat sealant layer comprising a thermoplastic polymer such as polypropylene, a barrier layer comprising a metal such as aluminum, and a film surface protective layer comprising a thermoplastic polymer such as polyethylene terephthalate.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: August 1, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kimihiko Sudo, Takako Hayakawa, Yuichi Arai, Yuta Onobu
  • Patent number: 9704539
    Abstract: A hermetically-sealed hard disk drive (HDD) utilizes a laminated film seal to seal an interface of an electrical flexible cable assembly and an HDD enclosure base. The laminated film seal may be constructed of a heat sealant layer that bonds with a surface of the base and a surface of the flex cable, a barrier layer which inhibits gas from escaping from inside the HDD, and a film surface protective layer which protects the heat sealant and barrier layers. Embodiments may include a heat sealant layer comprising a thermoplastic polymer such as polypropylene, a barrier layer comprising a metal such as aluminum, and a film surface protective layer comprising a thermoplastic polymer such as polyethylene terephthalate.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: July 11, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kimihiko Sudo, Takako Hayakawa, Yuichi Arai, Yuta Onobu
  • Publication number: 20170169861
    Abstract: A hermetically-sealed hard disk drive (HDD) utilizes a laminated film seal to seal an interface of an electrical flexible cable assembly and an HDD enclosure base. The laminated film seal may be constructed of a heat sealant layer that bonds with a surface of the base and a surface of the flex cable, a barrier layer which inhibits gas from escaping from inside the HDD, and a film surface protective layer which protects the heat sealant and barrier layers. Embodiments may include a heat sealant layer comprising a thermoplastic polymer such as polypropylene, a barrier layer comprising a metal such as aluminum, and a film surface protective layer comprising a thermoplastic polymer such as polyethylene terephthalate.
    Type: Application
    Filed: December 9, 2015
    Publication date: June 15, 2017
    Inventors: Kimihiko Sudo, Takako Hayakawa, Yuichi Arai, Yuta Onobu
  • Publication number: 20170169860
    Abstract: A hermetically-sealed hard disk drive (HDD) utilizes a laminated film seal to seal an interface of an electrical feed-through connector and an HDD enclosure base. The laminated film seal may be constructed of a heat sealant layer that bonds with a surface of the base and a surface of the electrical connector, a barrier layer which inhibits gas from escaping from inside the HDD, and a film surface protective layer which protects the heat sealant and barrier layers. Embodiments may include a heat sealant layer comprising a thermoplastic polymer such as polypropylene, a barrier layer comprising a metal such as aluminum, and a film surface protective layer comprising a thermoplastic polymer such as polyethylene terephthalate.
    Type: Application
    Filed: December 9, 2015
    Publication date: June 15, 2017
    Inventors: Kimihiko Sudo, Takako Hayakawa, Yuichi Arai, Yuta Onobu
  • Publication number: 20170169862
    Abstract: A hermetically-sealed hard disk drive (HDD) utilizes a laminated film seal to seal an HDD cover-to-base interface. The laminated film seal may be constructed of a heat sealant layer hermetically-coupled to and forming a seal with the base, a barrier layer which inhibits gas from escaping from inside the HDD, and a film surface protective layer which protects the heat sealant and barrier layers. Embodiments may include a heat sealant layer comprising a thermoplastic polymer such as polypropylene, a barrier layer comprising a metal such as aluminum, and a film surface protective layer comprising a thermoplastic polymer such as polyethylene terephthalate.
    Type: Application
    Filed: December 9, 2015
    Publication date: June 15, 2017
    Inventors: Kimihiko Sudo, Takako Hayakawa, Yuichi Arai, Yuta Onobu
  • Patent number: 9570114
    Abstract: A hermetically-sealed hard disk drive (HDD) utilizes a laminated film enclosure to hermetically seal an HDD within. The laminated film enclosure may be constructed of a heat sealant layer hermetically-sealed around the HDD, a barrier layer which inhibits gas from escaping from inside the laminated film enclosure, and a film surface protective layer which protects the heat sealant and barrier layers. Embodiments may include a heat sealant layer comprising a thermoplastic polymer such as polypropylene, a barrier layer comprising a metal such as aluminum, and a film surface protective layer comprising a thermoplastic polymer such as polyethylene terephthalate.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: February 14, 2017
    Assignee: HGST Netherlands B.V.
    Inventors: Kimihiko Sudo, Kazuki Takeichi, Takako Hayakawa, Yuta Onobu