Patents by Inventor Takakuni Nasu
Takakuni Nasu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220108943Abstract: A multilayer wiring substrate includes a first wiring substrate including a plurality of stacked layers made of a thermosetting resin and having a wiring layer formed between each adjacent layers of the layers in a state in contact with the adjacent layers; a second wiring substrate made of a ceramic; and a joining layer disposed between a back surface of the first wiring substrate and a front surface of the second wiring substrate and configured to join the first wiring substrate and the second wiring substrate to each other. At least a surface of the joining layer adjacent to the second wiring substrate is made of a thermoplastic resin.Type: ApplicationFiled: May 22, 2020Publication date: April 7, 2022Inventors: Hirohito HASHIMOTO, Takakuni NASU, Fumio SHIRAKI, Guangzhu JIN
-
Patent number: 10887991Abstract: A wiring substrate for inspection apparatus includes a base substrate and a plurality of tile substrates. The tile substrate is composed of a ceramic substrate section and a first resin substrate section. Each ceramic substrate section is composed of a plurality of ceramic layers and has a plurality of upper-surface connection terminals provided on an upper surface thereof, a plurality of lower-surface connection terminals provided on a lower surface thereof, and a plurality of through conductors for conducting electricity between the upper-surface connection terminals and the lower-surface connection terminals. The first resin substrate section is laminated on the upper surface and includes a laminate of a plurality of resin layers, a plurality of probe pads formed on a resin front-surface thereof, a plurality of inner wiring layers formed between the resin layers, and a plurality of electrically conductive paths for conducting electricity between the probe pads and the upper-surface connection terminals.Type: GrantFiled: February 8, 2019Date of Patent: January 5, 2021Assignee: NGK SPARK PLUG CO., LTD.Inventor: Takakuni Nasu
-
Patent number: 10834818Abstract: A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.Type: GrantFiled: September 27, 2019Date of Patent: November 10, 2020Assignee: NGK SPARK PLUG CO., LTD.Inventors: Takakuni Nasu, Kengo Tanimori, Yousuke Kondo, Masahiro Kamegai, Kouta Kimata, Junya Matsura, Fumio Shiraki, Guangzhu Jin
-
Patent number: 10834812Abstract: A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; and a metal member mounted to the second resin board. The first resin board is superposed to a first surface of the ceramic board. The second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board. The second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal. The metal member is joined to the joint pad by brazing or soldering.Type: GrantFiled: July 26, 2019Date of Patent: November 10, 2020Assignee: NGK SPARK PLUG CO., LTD.Inventors: Takakuni Nasu, Yousuke Kondou, Masaomi Hattori, Kouta Kimata, Atsushi Kaga, Guangzhu Jin
-
Patent number: 10729006Abstract: [Objective] To provide a wiring substrate for electronic component inspection apparatus which includes a first laminate of resin layers with a plurality of pads for probe provided on its front surface and a second laminate of ceramic layers disposed on the back side of the first laminate and which, despite joining by brazing of a plurality of studs to the back surface of the second laminate, is free from deformation of resin of the first laminate caused by softening or the like and from accidental formation of a short circuit between brazing material layers used for the brazing and external connection terminals formed on the back surface of the second laminate.Type: GrantFiled: September 10, 2018Date of Patent: July 28, 2020Assignee: NGK SPARK PLUG CO., LTD.Inventors: Takakuni Nasu, Yousuke Kondo, Kouta Kimata, Guangzhu Jin
-
Patent number: 10674614Abstract: A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate Each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion. The flange portion has a truncated conical shape and the outside surface from which the bolt portion protrudes, such that the outside surface slopes from the proximal end side of the bolt portion toward the peripheral edge of the flange portion and gradually approaches the inside surface of the flange portion.Type: GrantFiled: September 27, 2018Date of Patent: June 2, 2020Assignee: NGK SPARK PLUG CO., LTD.Inventors: Takakuni Nasu, Masaomi Hattori
-
Publication number: 20200146146Abstract: A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.Type: ApplicationFiled: September 27, 2019Publication date: May 7, 2020Inventors: Takakuni NASU, Kengo TANIMORI, Yousuke KONDO, Masahiro KAMEGAI, Kouta KIMATA, Junya MATSURA, Fumio SHIRAKI, Guangzhu JIN
-
Publication number: 20200077512Abstract: A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; and a metal member mounted to the second resin board. The first resin board is superposed to a first surface of the ceramic board. The second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board. The second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal. The metal member is joined to the joint pad by brazing or soldering.Type: ApplicationFiled: July 26, 2019Publication date: March 5, 2020Inventors: Takakuni NASU, Yousuke KONDOU, Masaomi HATTORI, Kouta KIMATA, Atsushi KAGA, Guangzhu JIN
-
Patent number: 10433433Abstract: A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate, wherein each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion; and in a vertical cross section along an axial direction of the bolt portion, the outside surface from which the bolt portion protrudes has a curved surface which is convex toward an inside surface of the flange portion facing the back surface of the first laminate.Type: GrantFiled: September 27, 2018Date of Patent: October 1, 2019Assignee: NGK SPARK PLUG CO., LTD.Inventor: Takakuni Nasu
-
Publication number: 20190261514Abstract: A wiring substrate for inspection apparatus includes a base substrate and a plurality of tile substrates. The tile substrate is composed of a ceramic substrate section and a first resin substrate section. Each ceramic substrate section is composed of a plurality of ceramic layers and has a plurality of upper-surface connection terminals provided on an upper surface thereof, a plurality of lower-surface connection terminals provided on a lower surface thereof, and a plurality of through conductors for conducting electricity between the upper-surface connection terminals and the lower-surface connection terminals. The first resin substrate section is laminated on the upper surface and includes a laminate of a plurality of resin layers, a plurality of probe pads formed on a resin front-surface thereof, a plurality of inner wiring layers formed between the resin layers, and a plurality of electrically conductive paths for conducting electricity between the probe pads and the upper-surface connection terminals.Type: ApplicationFiled: February 8, 2019Publication date: August 22, 2019Inventor: Takakuni NASU
-
Publication number: 20190098770Abstract: A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate, wherein each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion; and in a vertical cross section along an axial direction of the bolt portion, the outside surface from which the bolt portion protrudes has a curved surface which is convex toward an inside surface of the flange portion facing the back surface of the first laminate.Type: ApplicationFiled: September 27, 2018Publication date: March 28, 2019Inventor: Takakuni NASU
-
Publication number: 20190098769Abstract: A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate, wherein each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion; and the flange portion has a truncated conical shape and the outside surface from which the bolt portion protrudes, such that the outside surface slopes from the proximal end side of the bolt portion toward the peripheral edge of the flange portion and gradually approaches the inside surface of the flange portion.Type: ApplicationFiled: September 27, 2018Publication date: March 28, 2019Inventors: Takakuni NASU, Masaomi HATTORI
-
Publication number: 20190082531Abstract: [Objective] To provide a wiring substrate for electronic component inspection apparatus which includes a first laminate of resin layers with a plurality of pads for probe provided on its front surface and a second laminate of ceramic layers disposed on the back side of the first laminate and which, despite joining by brazing of a plurality of studs to the back surface of the second laminate, is free from deformation of resin of the first laminate caused by softening or the like and from accidental formation of a short circuit between brazing material layers used for the brazing and external connection terminals formed on the back surface of the second laminate.Type: ApplicationFiled: September 10, 2018Publication date: March 14, 2019Inventors: Takakuni NASU, Yousuke KONDO, Kouta KIMATA, Guangzhu JIN
-
Patent number: 9903887Abstract: Disclosed is a wiring board for simultaneously testing of multiple semiconductor devices. The wiring board includes a multilayer ceramic substrate, an organic wiring structure arranged on the multilayer ceramic substrate, a plurality of capacitor connection pads formed on the organic wiring structure and a plurality of test pads formed on the organic wiring structure. The organic wiring structure has a plurality of inner conductor layers including first and second plane layers. Each of the first plane layers is divided in a plurality of regions. Each of the second plane layer(s) is placed in a different layer from the first plane layers and made larger in area than the first plane layers. At least a part of the test pads of each test pad group is electrically connected to at least a part of the connection pads via an outermost one of the first plane layers.Type: GrantFiled: November 1, 2016Date of Patent: February 27, 2018Assignee: NGK SPARK PLUG CO., LTD.Inventors: Takakuni Nasu, Kengo Tanimori, Kouta Kimata, Guangzhu Jin
-
Publication number: 20170122981Abstract: Disclosed is a wiring board for simultaneously testing of multiple semiconductor devices. The wiring board includes a multilayer ceramic substrate, an organic wiring structure arranged on the multilayer ceramic substrate, a plurality of capacitor connection pads formed on the organic wiring structure and a plurality of test pads formed on the organic wiring structure. The organic wiring structure has a plurality of inner conductor layers including first and second plane layers. Each of the first plane layers is divided in a plurality of regions. Each of the second plane layer(s) is placed in a different layer from the first plane layers and made larger in area than the first plane layers. At least a part of the test pads of each test pad group is electrically connected to at least a part of the connection pads via an outermost one of the first plane layers.Type: ApplicationFiled: November 1, 2016Publication date: May 4, 2017Inventors: Takakuni NASU, Kengo TANIMORI, Kouta KIMATA, Guangzhu JIN
-
Publication number: 20160099163Abstract: A method of making a semiconductor manufacturing equipment component, such as an electrostatic chuck, includes an application step of applying a photosensitive metal paste onto a ceramic green sheet, which is to become the body substrate, the photosensitive metal paste being a heating element material; an exposure-and-development step of exposing the photosensitive metal paste, which has been applied onto the ceramic green sheet, to light and developing the photosensitive metal paste to form an intermediate heating element, which is to become the heating element, on the ceramic green sheet; and a firing step of co-firing the ceramic green sheet and the intermediate heating element to form the body substrate and the heating element.Type: ApplicationFiled: September 30, 2015Publication date: April 7, 2016Inventors: Takakuni NASU, Tomonori NIWA, Taichi KIBE
-
Patent number: 9107334Abstract: A ceramic substrate includes: a substrate body formed by laminating a plurality of ceramic layers and including a first and second opposing principal surfaces and a peripheral portion having a positioning portion; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second principal surface and having a diameter smaller than that of the first conductor pad. The positioning portion includes first and second through holes that individually pass through respective ceramic layers and are connected to each other in an axial direction. The first through hole passes through the first principal surface. The second through hole passes through the second principal surface and has a cross-sectional area that is smaller than that of the first through hole. At least apart of a peripheral edge of a ceramic layer defining the second through hole is visible through the first through hole.Type: GrantFiled: November 6, 2012Date of Patent: August 11, 2015Assignee: NGK SPARK PLUG CO., LTD.Inventors: Kenji Suzuki, Yuma Otsuka, Takakuni Nasu
-
Publication number: 20090051041Abstract: A multilayer wiring substrate includes one or more resin dielectric layers (81), conductor layers (84), via conductors (91), and projecting portions (85). The one or more resin dielectric layers (81) individually having via holes (90) formed therein and extending through a first surface (82) and a second surface (83). The conductor layers (84) are formed from a conductive metal material and disposed on the first surface (82) of the one or more resin dielectric layers (81). The via conductors (91) are disposed in the respective via holes (90) and electrically connected to respective conductor layers (84). The projecting portions (85) are bent toward the main surface (72) or the back surface (73) of the multilayer wiring substrate, project from opening edges of respective via holes (90) toward center axes thereof, and penetrate into the respective via conductors (91).Type: ApplicationFiled: August 20, 2008Publication date: February 26, 2009Applicant: NGK SPARK PLUG CO., LTD.Inventors: Yuma Otsuka, Takakuni Nasu, Masanori Kito
-
Publication number: 20030003862Abstract: An electronic part or component for use in a mobile communication apparatus is mounted with improved joining strength to a printed substrate. The electronic part is formed by laminating first and second insulator substrates. An auxiliary electrode is arranged in a portion of a laminating layer face on one side of the second insulator substrate in a part of that laminating layer face which does not overlap the corresponding laminating layer face of the first insulator substrate.Type: ApplicationFiled: May 31, 2002Publication date: January 2, 2003Inventors: Yoshitaka Yoshida, Takakuni Nasu, Daisuke Kato, Tomoaki Sakurai, Hajime Yoshikawa