Patents by Inventor Takamasa Hirayama

Takamasa Hirayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210309889
    Abstract: Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of grinding accuracy, low contamination property, productivity, and fixing property. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains: a pressure-sensitive adhesive containing a base polymer; and a foaming agent having a foaming temperature of 90° C. or more, and wherein the pressure-sensitive adhesive sheet has, when a pressure-sensitive adhesive surface thereof is bonded to a silicon chip, a shear adhesive strength of 1.0 MPa or more under an ambient temperature of 25° C., and a shear adhesive strength of 0.2 MPa or more under an ambient temperature of 80° C.
    Type: Application
    Filed: August 19, 2019
    Publication date: October 7, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku UENO, Takumi YUTOU, Takamasa HIRAYAMA
  • Publication number: 20210309890
    Abstract: Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of low contamination property, productivity, grinding accuracy, and peelability. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a thickness of from 1 ?m to 300 ?m, and wherein a microhardness H (Pa) of the pressure-sensitive adhesive layer at 25° C. and the thickness, which is represented by hA (?m), of the pressure-sensitive adhesive layer satisfy a relationship represented by the following expression (1). log H?1.9385×log hA+4.2611 . . .
    Type: Application
    Filed: August 19, 2019
    Publication date: October 7, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku UENO, Takumi YUTOU, Takamasa HIRAYAMA
  • Publication number: 20140044957
    Abstract: A simplified production method for a chip-shaped electronic component such as a semiconductor chip is provided.
    Type: Application
    Filed: July 6, 2012
    Publication date: February 13, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa Hirayama, Daisuke Shimokawa
  • Publication number: 20130260120
    Abstract: There are provided a base material-less double-sided pressure-sensitive adhesive sheet without warping due to shrinkage of a base material after heat treatment, and having good peelability in heat peeling, and a method for manufacturing electronic parts or semiconductors by using the pressure-sensitive adhesive sheet. A heat-peelable pressure-sensitive adhesive sheet which is a base material-less double-sided pressure-sensitive adhesive sheet including a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres and a pressure-sensitive adhesive layer different from the heat-expandable pressure-sensitive adhesive layer and laminated thereon, wherein the pressure-sensitive adhesive layer has a higher elastic modulus than the heat-expandable pressure-sensitive adhesive layer.
    Type: Application
    Filed: March 26, 2013
    Publication date: October 3, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa HIRAYAMA, Akihisa MURATA, Daisuke SHIMOKAWA
  • Publication number: 20130240141
    Abstract: The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 19, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuki SOEJIMA, Shinji HOSHINO, Takamasa HIRAYAMA, Kazuyuki KIUCHI
  • Patent number: 8524361
    Abstract: The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of ?40° C. to 30° C.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: September 3, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Kazuki Soejima, Takamasa Hirayama, Daisuke Shimokawa, Masaaki Sato, Yukio Arimitsu
  • Patent number: 8409884
    Abstract: The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, including forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: April 2, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Takamasa Hirayama, Akihisa Murata, Yukio Arimitsu, Takashi Yamaoka, Masaaki Sato
  • Publication number: 20120237764
    Abstract: In the production process of electronic parts, the static electricity generated when peeling a pressure-sensitive adhesive tape has interfered with the performance of the electronic parts. This problem has been solved by a pressure-sensitive adhesive tape for temporary fixing of electronic parts of the present invention including at least a supporting substrate film and a thermally expandable pressure-sensitive adhesive layer provided on one side of the substrate, wherein the thermally expandable pressure-sensitive adhesive layer contains thermally expandable microspheres and an ionic liquid; the content of the ionic liquid is 0.01 to 10 parts by weight based on 100 parts by weight of a polymer contained in the thermally expandable pressure-sensitive adhesive layer; the surface resistance of the thermally expandable pressure-sensitive adhesive layer is 1.0×1013 ?/? or less; and the ratio of the surface resistance after heating for foaming to that before the heating is 5.0 or less.
    Type: Application
    Filed: March 15, 2012
    Publication date: September 20, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuki SOEJIMA, Daisuke SHIMOKAWA, Takamasa HIRAYAMA
  • Publication number: 20110200744
    Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
    Type: Application
    Filed: April 26, 2011
    Publication date: August 18, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa HIRAYAMA, Kazuyuki Kiuchi, Masaaki Sato, Yukio Arimitsu, Daisuke Shimokawa, Tomoko Kishimoto
  • Publication number: 20110124136
    Abstract: Provided is a process for producing an organic EL panel by using an ultrathin glass plate, in which the ultrathin glass plate is not “fractured” or “cut” in the production process, the organic EL element is formed reliably when formed by vacuum deposition, and recovered without damage after the production process, and there is no need for installing an additional step of cleaning the rear face of the ultrathin glass plate.
    Type: Application
    Filed: June 30, 2009
    Publication date: May 26, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa Hirayama, Akihisa Murata, Yukio Arimitsu, Takashi Yamaoka, Masaaki Sato
  • Publication number: 20100224316
    Abstract: The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of ?40° C. to 30° C.
    Type: Application
    Filed: March 3, 2010
    Publication date: September 9, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuki SOEJIMA, Takamasa HIRAYAMA, Daisuke SHIMOKAWA, Masaaki SATO, Yukio ARIMITSU
  • Publication number: 20100028669
    Abstract: A re-releasable adhesive agent comprises a radiation-reactive polymer and a radiation polymerization initiator, the radiation-reactive polymer has a side chain derived from at least one monomer expressed by the formula (1): CH2?CR1COOR2 (1), where R1 is a hydrogen atom or a methyl group, and R2 is a C6 or higher alkyl group, and a side chain having one carbon-carbon double bond, and the monomer of formula (1) is contained in a ratio of less than 50 mol % with respect to the total monomer constituting the main chain of the radiation-reactive polymer.
    Type: Application
    Filed: July 27, 2009
    Publication date: February 4, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi HABU, Tomokazu Takahashi, Fumiteru Asai, Takamasa Hirayama
  • Publication number: 20080038540
    Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
    Type: Application
    Filed: August 14, 2007
    Publication date: February 14, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa HIRAYAMA, Kazuyuki KIUCHI, Masaaki SATO, Yukio ARIMITSU, Daisuke SHIMOKAWA, Tomoko KISHIMOTO