Patents by Inventor Takamasa IWAI
Takamasa IWAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11631623Abstract: A lead member includes a plurality of lead terminals, and the lead terminals extend from the inside to the outside of a mold resin. Each of the lead terminals has a base portion and a tip end portion on the outside of the mold resin. The base portion is disposed on a region side having a semiconductor element and extends in a direction protruding from the mold resin. The tip end portion extends in a direction different from the base portion and is disposed on the opposite side to a region having the semiconductor element as viewed from the base portion. The length by which the base portion extends differs between a pair of lead terminals adjacent to each other, among the lead terminals. At least a surface of the base portion of each of the lead terminals is covered with a coating resin.Type: GrantFiled: September 4, 2019Date of Patent: April 18, 2023Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Takamasa Iwai, Junji Fujino, Hiroshi Kawashima
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Patent number: 11450594Abstract: A semiconductor device includes: semiconductor elements and; a lead frame including a mount having an upper surface over which the semiconductor elements and are mounted; a sealing resin sealing the lead frame and the semiconductor elements and so that outer leads and of the lead frame protrude outwardly; and a resin wall located on an inner lead between the outer lead and the mount of the lead frame. A vertical thickness of the resin wall is greater than a vertical thickness from a lower surface of the sealing resin to a lower end of the lead frame.Type: GrantFiled: October 2, 2019Date of Patent: September 20, 2022Assignee: Mitsubishi Electric CorporationInventors: Hiroyuki Harada, Akira Kosugi, Takamasa Iwai
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Publication number: 20220293434Abstract: A mold die includes a resin injection gate through which fluid resin serving as mold resin is injected toward a cavity, a resin reservoir to store the fluid resin flowing through the cavity, and a resin reservoir gate. The resin reservoir is provided on the side opposite to the side on which the resin injection gate is arranged with the cavity interposed. The resin reservoir gate communicatively connects the cavity and the resin reservoir. The opening cross-sectional area of the resin reservoir gate is smaller than the opening cross-sectional area of the resin injection gate.Type: ApplicationFiled: September 29, 2020Publication date: September 15, 2022Applicant: Mitsubishi Electric CorporationInventors: Takamasa IWAI, Yuichiro SUZUKI, Akitoshi SHIRAO, Akira KOSUGI, Junji FUJINO
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Patent number: 11217514Abstract: In a power semiconductor device, power semiconductor elements are mounted on a large die pad and the like. The large die pad is joined to a power lead via a lead stepped portion. The large die pad has a first end portion and a second end portion located with a distance therebetween in the X axis direction. In the Y axis direction, the lead stepped portion is joined to the first end portion side relative to a central line between the first end portion and the second end portion. The large die pad is inclined such that a distance between the large die pad and the first main surface of the molding resin is longer from the first end portion toward the second end portion.Type: GrantFiled: April 19, 2019Date of Patent: January 4, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Takamasa Iwai, Shingo Sudo, Yuichiro Suzuki
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Publication number: 20210327777Abstract: A lead member includes a plurality of lead terminals, and the lead terminals extend from the inside to the outside of a mold resin. Each of the lead terminals has a base portion and a tip end portion on the outside of the mold resin. The base portion is disposed on a region side having a semiconductor element and extends in a direction protruding from the mold resin. The tip end portion extends in a direction different from the base portion and is disposed on the opposite side to a region having the semiconductor element as viewed from the base portion. The length by which the base portion extends differs between a pair of lead terminals adjacent to each other, among the lead terminals. At least a surface of the base portion of each of the lead terminals is covered with a coating resin.Type: ApplicationFiled: September 4, 2019Publication date: October 21, 2021Applicant: Mitsubishi Electric CorporationInventors: Takamasa IWAI, Junji FUJINO, Hiroshi KAWASHIMA
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Patent number: 11107746Abstract: A lead frame (4) includes an inner lead (5), an outer lead (2) connected to the inner lead (5), and a power die pad (7). A power semiconductor device (9) is bonded onto the power die pad (7). A first metal thin line (11) electrically connects the inner lead (5) and the power semiconductor device (9). Sealing resin (1) seals the inner lead (5), the power die pad (7), the power semiconductor device (9), and the first metal thin line (11). The sealing resin (1) includes an insulating section (15) directly beneath the power die pad (7). A thickness of the insulating section (15) is 1 to 4 times a maximum particle diameter of inorganic particles in the sealing resin (1). A first hollow (14) is provided on an upper surface of the sealing resin (1) directly above the power die pad (7) in a region without the first metal thin line (11) and the power semiconductor device (9).Type: GrantFiled: February 9, 2016Date of Patent: August 31, 2021Assignee: Mitsubishi Electric CorporationInventors: Hiroshi Kawashima, Takamasa Iwai, Taketoshi Shikano, Satoshi Kondo, Ken Sakamoto
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Publication number: 20210020551Abstract: In a power semiconductor device, power semiconductor elements are mounted on a large die pad and the like. The large die pad is joined to a power lead via a lead stepped portion. The large die pad has a first end portion and a second end portion located with a distance therebetween in the X axis direction. In the Y axis direction, the lead stepped portion is joined to the first end portion side relative to a central line between the first end portion and the second end portion. The large die pad is inclined such that a distance between the large die pad and the first main surface of the molding resin is longer from the first end portion toward the second end portion.Type: ApplicationFiled: April 19, 2019Publication date: January 21, 2021Applicant: Mitsubishi Electric CorporationInventors: Takamasa IWAI, Shingo SUDO, Yuichiro SUZUKI
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Publication number: 20200176366Abstract: A semiconductor device includes: semiconductor elements and; a lead frame including a mount having an upper surface over which the semiconductor elements and are mounted; a sealing resin sealing the lead frame and the semiconductor elements and so that outer leads and of the lead frame protrude outwardly; and a resin wall located on an inner lead between the outer lead and the mount of the lead frame. A vertical thickness of the resin wall is greater than a vertical thickness from a lower surface of the sealing resin to a lower end of the lead frame.Type: ApplicationFiled: October 2, 2019Publication date: June 4, 2020Applicant: Mitsubishi Electric CorporationInventors: Hiroyuki HARADA, Akira KOSUGI, Takamasa IWAI
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Patent number: 10431528Abstract: A leadframe of a semiconductor device includes a die pad, first and second suspension leads, and a frame. The main surfaces of the die pad and the frame are located on different planes, and the die pad and the frame are connected to each other by the first and second suspension leads. A first boundary line between the first suspension lead and the die pad runs on a straight line different from a second boundary line between the second suspension lead and the die pad. A third boundary line between the first suspension lead and the frame runs on a straight line different from a fourth boundary line between the second suspension lead and the frame.Type: GrantFiled: February 8, 2016Date of Patent: October 1, 2019Assignee: Mitsubishi Electric CorporationInventors: Takamasa Iwai, Satoshi Kondo, Hiroshi Kawashima, Junji Fujino, Ken Sakamoto
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Publication number: 20190057928Abstract: A lead frame (4) includes an inner lead (5), an outer lead (2) connected to the inner lead (5), and a power die pad (7). A power semiconductor device (9) is bonded onto the power die pad (7). A first metal thin line (11) electrically connects the inner lead (5) and the power semiconductor device (9). Sealing resin (1) seals the inner lead (5), the power die pad (7), the power semiconductor device (9), and the first metal thin line (11). The sealing resin (1) includes an insulating section (15) directly beneath the power die pad (7). A thickness of the insulating section (15) is 1 to 4 times a maximum particle diameter of inorganic particles in the sealing resin (1). A first hollow (14) is provided on an upper surface of the sealing resin (1) directly above the power die pad (7) in a region without the first metal thin line (11) and the power semiconductor device (9).Type: ApplicationFiled: February 9, 2016Publication date: February 21, 2019Applicant: Mitsubishi Electric CorporationInventors: Hiroshi KAWASHIMA, Takamasa IWAI, Taketoshi SHIKANO, Satoshi KONDO, Ken SAKAMOTO
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Publication number: 20190043788Abstract: A leadframe of a semiconductor device includes a die pad, first and second suspension leads, and a frame. The main surfaces of the die pad and the frame are located on different planes, and the die pad and the frame are connected to each other by the first and second suspension leads. A first boundary line between the first suspension lead and the die pad runs on a straight line different from a second boundary line between the second suspension lead and the die pad. A third boundary line between the first suspension lead and the frame runs on a straight line different from a fourth boundary line between the second suspension lead and the frame.Type: ApplicationFiled: February 8, 2016Publication date: February 7, 2019Applicant: Mitsubishi Electric CorporationInventors: Takamasa IWAI, Satoshi KONDO, Hiroshi KAWASHIMA, Junji FUJINO, Ken SAKAMOTO