Abstract: It is determined whether or not a previously received wafer process condition can be changed to a newly received wafer process condition based on a wafer operation progress indicating which wafer is treated or untreated among a given number of wafers in a previously received lot process condition table when a new lot process condition table containing wafer process conditions corresponding to wafer identification information and having the wafer identification information all equal to wafer identification information in the previously received lot process condition table. When any wafer process condition is changeable, the wafer process condition is changed to the newly received wafer process condition. In this way, a semiconductor manufacturing apparatus can have increased yields in accordance with wafers.