Abstract: A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

Abstract: A wafer bonding apparatus may include a first chuck, a second chuck, and a pressure device. The first chuck may include a hole formed through a central portion of the first chuck. The second chuck may have a hole formed through a central portion of the second chuck. The pressure device may be configured to pressurize a wafer toward the second chuck through the holes. An air bearing may be interposed between the pressure device and the first chuck to suppress a dislocation of the pressure device.

Abstract: A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

Abstract: A medical image processing apparatus according to a present embodiment includes processing circuitry. The processing circuitry is configured to accept an operation for a region of interest (ROI) GUI and a guide GUI on a screen on which a medical image is displayed, the ROI GUI being for setting a ROI on the medical image, the guide GUI being for guiding a setting of the ROI on the medical image. The processing circuitry is configured to decide whether to move the ROI GUI and the guide GUI in a manner interlocked with each other or not according to a preset condition, when a turning operation or a sliding operation for any one of the ROI GUI and the guide GUI is accepted.

Abstract: A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

Abstract: A magnetic resonance imaging apparatus according to an embodiment includes processing circuitry. By using image data of a subject acquired by performing a first imaging process, the processing circuitry is configured to detect a first region including at least a part of a first site, the first site and a second site having a symmetrical relationship with each other in the subject. The processing circuitry is configured to derive a second region including at least a part of the second site on the basis of the first region. The processing circuitry is configured to set a Radio Frequency (RF) pulse application region used for performing a second imaging process, on the basis of the second region.

Abstract: A magnetic resonance imaging apparatus according to an embodiment includes processing circuitry. The processing circuitry generates an image based on a magnetic resonance signal from a subject. The processing circuitry generates a susceptibility image representing magnetic susceptibility of the subject from a phase component contained in a plurality of pixels in the image. The processing circuitry generates an artifact component of the susceptibility image based on a frequency signal obtained by frequency transform of the susceptibility image. The processing circuitry generates an artifact component-removed susceptibility image by removing the artifact component from a susceptibility image generated based on the magnetic resonance signal.

Abstract: A magnetic-resonance imaging apparatus of an embodiment includes acquiring circuitry and processing circuitry. The acquiring circuitry acquires a magnetic resonance signal that is generated from a subject. The processing circuitry creates a phase image based on the magnetic resonance signal. The processing circuitry sets a combination of a plurality of filters that are used to remove a phase variation derived from a background magnetic field according to a region in the phase image. The processing circuitry removes a phase variation derived from the background magnetic field from the phase image by using the combination of the filters.

Abstract: A magnetic resonance imaging apparatus according to an embodiment includes processing circuitry. By using image data of a subject acquired by performing a first imaging process, the processing circuitry is configured to detect a first region including at least a part of a first site, the first site and a second site having a symmetrical relationship with each other in the subject. The processing circuitry is configured to derive a second region including at least a part of the second site on the basis of the first region. The processing circuitry is configured to set a Radio Frequency (RF) pulse application region used for performing a second imaging process, on the basis of the second region.

Abstract: A magnetic-resonance imaging apparatus of an embodiment includes acquiring circuitry and processing circuitry. The acquiring circuitry acquires a magnetic resonance signal that is generated from a subject. The processing circuitry creates a phase image based on the magnetic resonance signal. The processing circuitry sets a combination of a plurality of filters that are used to remove a phase variation derived from a background magnetic field according to a region in the phase image. The processing circuitry removes a phase variation derived from the background magnetic field from the phase image by using the combination of the filters.

Abstract: A magnetic resonance imaging apparatus according to an embodiment includes processing circuitry. The processing circuitry generates an image based on a magnetic resonance signal from a subject. The processing circuitry generates a susceptibility image representing magnetic susceptibility of the subject from a phase component contained in a plurality of pixels in the image. The processing circuitry generates an artifact component of the susceptibility image based on a frequency signal obtained by frequency transform of the susceptibility image. The processing circuitry generates an artifact component-removed susceptibility image by removing the artifact component from a susceptibility image generated based on the magnetic resonance signal.

Abstract: A medical image processing apparatus according to a present embodiment includes processing circuitry. The processing circuitry is configured to accept an operation for a region of interest (ROI) GUI and a guide GUI on a screen on which a medical image is displayed, the ROI GUI being for setting a ROI on the medical image, the guide GUI being for guiding a setting of the ROI on the medical image. The processing circuitry is configured to decide whether to move the ROI GUI and the guide GUI in a manner interlocked with each other or not according to a preset condition, when a turning operation or a sliding operation for any one of the ROI GUI and the guide GUI is accepted.

Abstract: [Object] The invention is intended to provide a medical image processing apparatus in which improvement of accuracy of boundary detection of a heart is achieved. [Solving Means] A medical image processing apparatus acquires volume data of a heat, detects a three-dimensional left ventricle coordinate system composed of three axes including at least a left ventricle long axis of the heart from the volume data; uses a boundary model expressed in the left ventricle coordinate system and detects a left ventricle boundary from the volume data, and displays a cross-sectional image orthogonal to at least one axis of the three axes of the left ventricle coordinate system together with the detected left ventricle boundary on the cross-sectional image.

Abstract: [Object] The invention is intended to provide a medical image processing apparatus in which improvement of accuracy of boundary detection of a heart is achieved. [Solving Means] A medical image processing apparatus acquires volume data of a heat, detects a three-dimensional left ventricle coordinate system composed of three axes including at least a left ventricle long axis of the heart from the volume data; uses a boundary model expressed in the left ventricle coordinate system and detects a left ventricle boundary from the volume data, and displays a cross-sectional image orthogonal to at least one axis of the three axes of the left ventricle coordinate system together with the detected left ventricle boundary on the cross-sectional image.