Patents by Inventor Takami Okubayashi

Takami Okubayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Infrared sensor module
    Patent number: 8952331
    Abstract: An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: February 10, 2015
    Assignee: Panasonic Corporation
    Inventors: Mitsuhiko Ueda, Takami Okubayashi, Takanori Sugiyama, Yoshiharu Sanagawa, Takanori Aketa, Yushi Nakamura, Masao Kirihara
  • INFRARED SENSOR MODULE
    Publication number: 20120235044
    Abstract: An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.
    Type: Application
    Filed: December 17, 2010
    Publication date: September 20, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Mitsuhiko Ueda, Takami Okubayashi, Takanori Sugiyama, Yoshiharu Sanagawa, Takanori Aketa, Yushi Nakamura, Masao Kirihara