Patents by Inventor Takami Sasahara

Takami Sasahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same
    Patent number: 6465085
    Abstract: A dummy pad is formed through a polyimide insulating layer so as to be provided opposite to a via connecting pad formed on the surface of a ceramic substrate. A defect occurring in the via connecting pad is filled with a protrusion when the dummy pad is formed. Accordingly, the influence of the defect upon a layer above the dummy pad is prevented. Further, in a method for manufacturing a thin film wiring board obtained by forming a thin film layer on a base substrate having a via that allows interlayer electric conduction, a void defect existing in the via is filled with a conductive material having corrosion resistance against an etchant, and then the thin film layer is formed on the base substrate.
    Type: Grant
    Filed: October 31, 2000
    Date of Patent: October 15, 2002
    Assignee: Fujitsu Limited
    Inventors: Zhiyi Song, Kiyokazu Moriizumi, Takami Sasahara, Norikazu Ozaki, Manabu Watanabe, Misao Umematsu, Shunichi Kikuchi