Abstract: According to an embodiment of the present disclosure, an apparatus is configured to perform a solution process by supplying a processing solution from a processing solution supply source to the substrate held on a substrate holder via a flow path member and a nozzle at a flow rate equal to or less than 1 mL/sec. The apparatus includes a solution transfer unit configured to transfer the processing solution to the nozzle, and mounted to the flow path member, and an ultrasonic flowmeter mounted to the flow path member at a downstream side from the solution transfer unit. In this embodiment, a lower limit of a flow rate range which is measured by the ultrasonic flowmeter is equal to or less than 1 mL/sec.

Abstract: A plug-in unit includes a breaker electrically connected with a busbar at a power supply side and an electric device electrically connected with the breaker. Joint surfaces making contact with each other are formed at the breaker and the electric device, respectively. The breaker includes a terminal metal fitting connecting the busbar thereto and a plug-in terminal metal fitting installed at the joint surface of the breaker, and the electric device includes a plug terminal, which is installed at the joint surface thereof and capable of being connected with the plug-in terminal metal fitting. The breaker is detachably joined with the electric device by an engaging member including an engaging unit and an engagement receiving unit. The engaging unit and the engagement receiving unit are installed at the joint surfaces of the breaker and the electric device, respectively, and detachably engaged with each other.

Abstract: A plug-in unit includes a breaker electrically connected with a busbar at a power supply side and an electric device electrically connected with the breaker. Joint surfaces making contact with each other are formed at the breaker and the electric device, respectively. The breaker includes a terminal metal fitting connecting the busbar thereto and a plug-in terminal metal fitting installed at the joint surface of the breaker, and the electric device includes a plug terminal, which is installed at the joint surface thereof and capable of being connected with the plug-in terminal metal fitting. The breaker is detachably joined with the electric device by an engaging member including an engaging unit and an engagement receiving unit. The engaging unit and the engagement receiving unit are installed at the joint surfaces of the breaker and the electric device, respectively, and detachably engaged with each other.

Abstract: Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

Abstract: A washing method for washing objects includes the steps of supplying a washing liquid to a washing vessel and immersing objects in the washing liquid contained in the washing vessel. The method also includes the steps of discharging the liquid at least once from the washing vessel, and starting to apply the washing liquid to the objects when the objects are partly exposed to air as the liquid is discharged from the washing vessel. The washing liquid application is continued during exposure of the objects to the air to prevent the surface of the objects from being dried and stained.

Abstract: An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.

Abstract: Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

Abstract: A substrate scrubbing and cleaning method in which a substrate is carried to a rotatable scrubbing arrangement, and both surfaces of the substrate are scrubbed by the rotatable scrubbing arrangement while the substrate is maintained substantially horizontal. In addition, a cleaning solution is applied to both surfaces of the substrate while the substrate is substantially horizontal and is linearly reciprocated.

Abstract: A heat treatment device comprises a table of a thermal conductor located in a housing carrying an object of treatment thereon, and a treatment heat source located in the housing and by the table so that a bottom face of the table is opposite to a top face of the heat source, whereby the object of treatment in heat-treated through the table. An annular groove is formed in the top face of the heat source and evacuated so that the substrate and heat source are securely attached thereby increasing the heat conduction between them.

Abstract: An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.

Abstract: Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

Abstract: A substrate scrubbing and cleaning device comprising a mechanism having an upper and a lower brush members for scrubbing both surfaces of an LCD glass substrate, a mechanism for rotating the upper and lower brush members, a mechanism for supplying pure water to the upper and lower brush members, a mechanism for carrying the substrate between the upper and the lower brush members to reciprocate it relative to the upper and lower brush members in a substrate carrying direction, and a controller for controlling the operation of the substrate carrying mechanism.