Patents by Inventor Takamichi Suzuki

Takamichi Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200223046
    Abstract: A striking tool includes: a driver which is provided to be slidable toward an ejecting port provided in a tip end of the striking tool so as to strike out a fastener from the ejecting port; a plunger to which the driver is coupled; a plunger urging member which is configured to urge the plunger toward the ejecting port: and a drive mechanism which is configured to move the plunger to accumulate urging force in the plunger urging member. A standby position of the plunger before striking out the fastener can be switched between a usual standby position and a standby position for maintenance closer to the ejecting port than the usual standby position.
    Type: Application
    Filed: January 14, 2020
    Publication date: July 16, 2020
    Applicant: MAX CO., LTD.
    Inventors: Takamichi HOSHINO, Yasushi YOKOCHI, Yoshihiko KONDO, Yosei NODAGUCHI, Takashi SUZUKI
  • Publication number: 20190385815
    Abstract: A film forming apparatus includes a vacuum-evacuable processing chamber, a lower electrode for mounting thereon a target substrate, an upper electrode disposed to face the lower electrode, a gas supply unit, a voltage application unit and a switching unit. The gas supply unit supplies a film forming source gas to be formed into plasma to a processing space between the upper and the lower electrode. The voltage application unit applies to the upper electrode a voltage outputted from at least one of a high frequency power supply and a DC power supply included therein. The switching unit selectively switches the voltage to be applied to the upper electrode among a high frequency voltage outputted from the high frequency power supply, a DC voltage outputted from the DC power supply, and a superimposed voltage in which the DC voltage is superimposed with the high frequency voltage.
    Type: Application
    Filed: June 4, 2019
    Publication date: December 19, 2019
    Inventors: Shinya IWASHITA, Ayuta SUZUKI, Takahiro SHINDO, Kazuki DEMPOH, Tatsuo MATSUDO, Yasushi MORITA, Takamichi KIKUCHI, Tsuyoshi MORIYA
  • Patent number: 6869008
    Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: March 22, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
  • Patent number: 6695200
    Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: February 24, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Takamichi Suzuki, Yoshihide Yamaguchi, Noriyuki Oroku, Kosuke Inoue
  • Patent number: 6595404
    Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: July 22, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Takamichi Suzuki, Yoshihide Yamaguchi, Noriyuki Oroku, Kosuke Inoue
  • Publication number: 20030029908
    Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.
    Type: Application
    Filed: October 10, 2002
    Publication date: February 13, 2003
    Inventors: Takamichi Suzuki, Yoshihide Yamaguchi, Noriyuki Oroku, Kosuke Inoue
  • Publication number: 20020166886
    Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
    Type: Application
    Filed: May 28, 2002
    Publication date: November 14, 2002
    Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
  • Patent number: 6460755
    Abstract: There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.
    Type: Grant
    Filed: March 7, 1997
    Date of Patent: October 8, 2002
    Assignees: Hitachi, Ltd., Hitachi Seiko Ltd.
    Inventors: Kosuke Inoue, Takamichi Suzuki, Hitoshi Odashima, Katsuhiro Iwashita, Tatsuya Yoneda, Michiharu Honda, Katuhisa Tanaka, Tsuyoshi Yamaguchi, Tetsuo Murakami, Asahi Tsuchiya, Yoshitatsu Naito, Mitsuhiro Suzuki, Izumi Hata, Kouji Sajiki
  • Patent number: 6413850
    Abstract: The present invention provides a method of forming bumps capable of forming many bumps having an adequate volume and having a narrow range of variations in height and few limitations in selecting materials on an object such as a semiconductor device or the like at high production rates with high reliability and with ease, and a system therefor. The present invention uses a suction head using a porous plate and a stencil having many apertures. Solder balls are previously aligned and charged into the stencil. The solder balls and the stencil are sucked and retained by the suction head and then are positioned with respect to the surfaces of the pads of a semiconductor device and only the solder balls are dropped on the pads. The solder balls are fixed to the pads with an adhesive previously applied thereto and then are reflowed to form bumps.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: July 2, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Noriyuki Ooroku, Kosuke Inoue, Takamichi Suzuki, Asao Nishimura
  • Patent number: 6402014
    Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: June 11, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
  • Patent number: 6400020
    Abstract: An aggregate of semiconductor devices, including semiconductor packages packaging the semiconductor devices, the packages being on a tape which is wound on a reel, is provided. The aggregate of semiconductor devices includes the semiconductor packages arranged consecutively on a first tape; and the aggregate also includes a second tape, which is a spacer tape, having spacers (protrusions), provided between adjacent windings of the first tape on the reel, providing spaces for the semiconductor packages. The semiconductor packages can be provided with bumps, e.g., on the side of the first tape opposite the side of the first tape having the semiconductor packages thereon, and the first tape can be a flexible printed circuit board.
    Type: Grant
    Filed: April 25, 2000
    Date of Patent: June 4, 2002
    Assignees: Hitachi Ltd, Hitachi Tokyo Electronics Co., Ltd., Hitachi ULSI Systems Co., Ltd.
    Inventors: Kosuke Inoue, Tatsuya Yoneda, Takamichi Suzuki, Ryosuke Kimoto, Junichi Suzuki
  • Publication number: 20010008160
    Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.
    Type: Application
    Filed: January 12, 2001
    Publication date: July 19, 2001
    Inventors: Takamichi Suzuki, Yoshihide Yamaguchi, Noriyuki Oroku, Kosuke Inoue
  • Patent number: 6213386
    Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: April 10, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
  • Patent number: 6146920
    Abstract: A method for forming bumps in an LSI package in which: semiconductor chips are mounted onto a flexible printed circuit board; electrically conductive balls are temporarily fixed by using a fixing liquid including one selected from a group including flux, solder paste and an adhesive containing an electrically conductive agent, onto pads which are provided on the flexible printed circuit board so as to be electrically connected to the semiconductor chips; the flexible printed circuit board having the electrically conductive balls temporarily fixed thereto is wound up onto a reel; the flexible printed circuit board having the electrically conductive balls temporarily fixed thereto is fed out from the reel and heated to thereby form bumps thereon; and the flexible printed circuit board having the bumps formed thereon is wound up onto another reel; and the flexible printed circuit board is cleansed and trimmed to thereby form LSI packages.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: November 14, 2000
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics Co., Ltd, Hitachi ULSI Systems, Co., Ltd.
    Inventors: Kosuke Inoue, Tatsuya Yoneda, Takamichi Suzuki, Ryosuke Kimoto, Junichi Suzuki
  • Patent number: 5760273
    Abstract: A process for producing an unsymmetrical chain carbonic acid ester is described, which comprises reacting a first symmetrical chain carbonic acid ester with a second symmetrical chain carbonic acid ester or a monohydric alcohol in the presence of a catalyst comprising as an active catalyst component an oxide of at least one element selected from the Group IIIB elements of the periodic table.
    Type: Grant
    Filed: October 18, 1996
    Date of Patent: June 2, 1998
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Masashi Inaba, Katsuaki Hasegawa, Noriko Shimizu, Yuji Ohgomori, Masayuki Honda, Takamichi Suzuki
  • Patent number: 5213176
    Abstract: A self-propelled vehicle capable of all directional movement over a floor surface and adapted to be guided along a path such as a semiconductor processing line. The vehicle is provided with at least three wheels having a construction enabling rotational movement in a rotational plane of the wheel and in a direction orthogonal thereto. When at least four wheels are provided, the vehicle is provided with a suspension mechanism for mounting the wheels and a mechanism for maintaining a parallel relationship of the suspension mechanism and a chassis of the vehicle so that slanting of the vehicle body during travel is avoided. Also, the vehicle is provided with a vibration preventing base interposed between the vehicle and a substance mounting base for controlling the proper vibration frequency of the vibration presenting base to be lower than 1/.sqroot.2 of the proper vibration frequency of the vehicle.
    Type: Grant
    Filed: December 7, 1990
    Date of Patent: May 25, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Noriyuki Oroku, Takamichi Suzuki, Toyohide Hamada, Minoru Ikeda, Hiroshi Kikuchi, Masayasu Akaiwa, Isao Takahashi, Naoki Takehara, Kazumi Adachi
  • Patent number: 4872618
    Abstract: An apparatus suitable for use in winding a coil on a toroidal core of a magnetic head of a video tape recorder or magnetic disc player by passing a wire through a minuscule aperture, with the apparatus including an annular wire guide formed with a cutout, a plurality of pairs of feed rollers having axes disposed perpendicular to a plane in which the annular wire guide is disposed, the rollers of each pair engaging each other inside the annular wire guide, and at least one core holding unit for holding a core in such a manner as to be positioned in the cutout of the annular wire guide. By repeatedly performing the operations of feeding a wire by the feed rollers, guiding the movement of the wire by the annular wire guide and inserting the wire through a core window of the toroidal core after transporting the wire to the wire insertion position, it is possible to wind a coil positively with increased speed and reliability.
    Type: Grant
    Filed: May 3, 1988
    Date of Patent: October 10, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Sato, Toshijiro Ohashi, Toyohide Hamada, Yukimori Umakoshi, Takamichi Suzuki, Yuuji Wada, Shigeo Hara, Youshuke Fukumoto
  • Patent number: 4771956
    Abstract: A method of and an apparatus suitable for use in winding a coil on a toroidal core of a magnetic head of a video tape recorder or magnetic disc player by passing a wire through a minuscule aperture. The apparatus includes an annular wire guide formed with a cutout, a plurality of pairs of feed rollers having axes disposed perpendicular to a plane in which the annular wire guide is disposed, the rollers of each pair engaging each other inside the annular wire guide, and at least one core holding unit for holding a core in such a manner as to be positioned in the cutout of the annular wire guide. By repeatedly performing the operations of feeding a wire by the feed rollers, guiding the movement of the wire by the annular wire guide and inserting the wire through a core window of the toroidal core after transporting the wire to the wire insertion position, it is possible to wind a coil positively with increased speed and reliability.
    Type: Grant
    Filed: July 23, 1986
    Date of Patent: September 20, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Sato, Toshijiro Ohashi, Toyohide Hamada, Yukimori Umakoshi, Takamichi Suzuki, Yuuji Wada, Shigeo Hara, Youshuke Fukumoto
  • Patent number: 4383359
    Abstract: A parts feeding and assembling system including a plurality of stockers containing a multiplicity of parts arranged in a disorderly manner, a separating and feeding mechanism for separating one part after another from the parts in the stockers and feeding same to a predetermined station, a tentatively positioning mechanism for tentatively positioning each part fed to the station by the separating and feeding mechanism, a parts posture discriminating mechanism for discriminating the posture of each part including the position and direction tentatively positioned by the tentatively positioning mechanism, a parts posture changing mechanism for changing the posture of each part in accordance with the result of discrimination of the part effected by the parts posture discriminating mechanism and an assembling mechanism for assembling each part in a predetermined position of an assembly of parts after the part has had its posture changed.
    Type: Grant
    Filed: September 10, 1980
    Date of Patent: May 17, 1983
    Assignee: Hitachi, Ltd.
    Inventors: Takamichi Suzuki, Tomoaki Sakata, Koichi Sugimoto, Michinaga Kohno