Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.

Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.

Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

Abstract: The present invention provides a method of forming bumps capable of forming many bumps having an adequate volume and having a narrow range of variations in height and few limitations in selecting materials on an object such as a semiconductor device or the like at high production rates with high reliability and with ease, and a system therefor. The present invention uses a suction head using a porous plate and a stencil having many apertures. Solder balls are previously aligned and charged into the stencil. The solder balls and the stencil are sucked and retained by the suction head and then are positioned with respect to the surfaces of the pads of a semiconductor device and only the solder balls are dropped on the pads. The solder balls are fixed to the pads with an adhesive previously applied thereto and then are reflowed to form bumps.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: An aggregate of semiconductor devices, including semiconductor packages packaging the semiconductor devices, the packages being on a tape which is wound on a reel, is provided. The aggregate of semiconductor devices includes the semiconductor packages arranged consecutively on a first tape; and the aggregate also includes a second tape, which is a spacer tape, having spacers (protrusions), provided between adjacent windings of the first tape on the reel, providing spaces for the semiconductor packages. The semiconductor packages can be provided with bumps, e.g., on the side of the first tape opposite the side of the first tape having the semiconductor packages thereon, and the first tape can be a flexible printed circuit board.

Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: A method for forming bumps in an LSI package in which: semiconductor chips are mounted onto a flexible printed circuit board; electrically conductive balls are temporarily fixed by using a fixing liquid including one selected from a group including flux, solder paste and an adhesive containing an electrically conductive agent, onto pads which are provided on the flexible printed circuit board so as to be electrically connected to the semiconductor chips; the flexible printed circuit board having the electrically conductive balls temporarily fixed thereto is wound up onto a reel; the flexible printed circuit board having the electrically conductive balls temporarily fixed thereto is fed out from the reel and heated to thereby form bumps thereon; and the flexible printed circuit board having the bumps formed thereon is wound up onto another reel; and the flexible printed circuit board is cleansed and trimmed to thereby form LSI packages.

Abstract: A process for producing an unsymmetrical chain carbonic acid ester is described, which comprises reacting a first symmetrical chain carbonic acid ester with a second symmetrical chain carbonic acid ester or a monohydric alcohol in the presence of a catalyst comprising as an active catalyst component an oxide of at least one element selected from the Group IIIB elements of the periodic table.

Abstract: A self-propelled vehicle capable of all directional movement over a floor surface and adapted to be guided along a path such as a semiconductor processing line. The vehicle is provided with at least three wheels having a construction enabling rotational movement in a rotational plane of the wheel and in a direction orthogonal thereto. When at least four wheels are provided, the vehicle is provided with a suspension mechanism for mounting the wheels and a mechanism for maintaining a parallel relationship of the suspension mechanism and a chassis of the vehicle so that slanting of the vehicle body during travel is avoided. Also, the vehicle is provided with a vibration preventing base interposed between the vehicle and a substance mounting base for controlling the proper vibration frequency of the vibration presenting base to be lower than 1/.sqroot.2 of the proper vibration frequency of the vehicle.

Abstract: An apparatus suitable for use in winding a coil on a toroidal core of a magnetic head of a video tape recorder or magnetic disc player by passing a wire through a minuscule aperture, with the apparatus including an annular wire guide formed with a cutout, a plurality of pairs of feed rollers having axes disposed perpendicular to a plane in which the annular wire guide is disposed, the rollers of each pair engaging each other inside the annular wire guide, and at least one core holding unit for holding a core in such a manner as to be positioned in the cutout of the annular wire guide. By repeatedly performing the operations of feeding a wire by the feed rollers, guiding the movement of the wire by the annular wire guide and inserting the wire through a core window of the toroidal core after transporting the wire to the wire insertion position, it is possible to wind a coil positively with increased speed and reliability.

Abstract: A method of and an apparatus suitable for use in winding a coil on a toroidal core of a magnetic head of a video tape recorder or magnetic disc player by passing a wire through a minuscule aperture. The apparatus includes an annular wire guide formed with a cutout, a plurality of pairs of feed rollers having axes disposed perpendicular to a plane in which the annular wire guide is disposed, the rollers of each pair engaging each other inside the annular wire guide, and at least one core holding unit for holding a core in such a manner as to be positioned in the cutout of the annular wire guide. By repeatedly performing the operations of feeding a wire by the feed rollers, guiding the movement of the wire by the annular wire guide and inserting the wire through a core window of the toroidal core after transporting the wire to the wire insertion position, it is possible to wind a coil positively with increased speed and reliability.

Abstract: A parts feeding and assembling system including a plurality of stockers containing a multiplicity of parts arranged in a disorderly manner, a separating and feeding mechanism for separating one part after another from the parts in the stockers and feeding same to a predetermined station, a tentatively positioning mechanism for tentatively positioning each part fed to the station by the separating and feeding mechanism, a parts posture discriminating mechanism for discriminating the posture of each part including the position and direction tentatively positioned by the tentatively positioning mechanism, a parts posture changing mechanism for changing the posture of each part in accordance with the result of discrimination of the part effected by the parts posture discriminating mechanism and an assembling mechanism for assembling each part in a predetermined position of an assembly of parts after the part has had its posture changed.