Patents by Inventor Takamichi TORII

Takamichi TORII has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250073977
    Abstract: The invention provides a carbon-neutral biaxially stretched polyamide film containing a raw material derived from biomass and having high heat-resistance, impact resistance, and folding pinhole resistance, as well as decreased variability in a degree of biomass in the mechanical (longitudinal) direction. The biaxially stretched polyamide film roll contains biaxially stretched polyamide film containing 70-99% by mass of polyamide 6 resin and 1-30% by mass of a polyamide resin in which at least a part of a raw material is derived from biomass, wherein the film roll has a winding length of from 1,000 m to 60,000 m, a width of from 400 mm to 3,000 mm, and variability in a degree of biomass of 15% or less based on radiocarbon 14C measurement of a biaxially stretched polyamide film sample taken from a surface to a core of the film roll at an interval of 1000 m in an MD direction.
    Type: Application
    Filed: December 20, 2022
    Publication date: March 6, 2025
    Applicant: TOYOBO CO., LTD.
    Inventors: Ayame TORII, Takamichi GOTO
  • Patent number: 10706993
    Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: July 7, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Takuma Shimoichi, Yasuhiro Kondo, Keishi Watanabe, Takamichi Torii, Katsuya Matsuura
  • Publication number: 20180005732
    Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.
    Type: Application
    Filed: September 13, 2017
    Publication date: January 4, 2018
    Applicant: ROHM CO., LTD.
    Inventors: Takuma SHIMOICHI, Yasuhiro KONDO, Keishi WATANABE, Takamichi TORII, Katsuya MATSUURA
  • Patent number: 9773588
    Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: September 26, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Takuma Shimoichi, Yasuhiro Kondo, Keishi Watanabe, Takamichi Torii, Katsuya Matsuura
  • Publication number: 20150332842
    Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.
    Type: Application
    Filed: May 15, 2015
    Publication date: November 19, 2015
    Applicant: ROHM CO., LTD.
    Inventors: Takuma SHIMOICHI, Yasuhiro KONDO, Keishi WATANABE, Takamichi TORII, Katsuya MATSUURA