Patents by Inventor Takamichi Yamashita

Takamichi Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050032975
    Abstract: A protective member for protecting electric wires includes: a non-woven cloth layer having flexibility and made of a chlorine-free resin; and an outer resin layer laminated monolithically on outer surface of the non-woven cloth layer, and made of a chlorine-free and fire-retardant resin, wherein a thickness of the outer resin layer is configured to be not more than a thickness of the non-woven cloth layer, and wherein a total thickness of the non-woven cloth layer and the outer resin layer is configured to have a predetermined wear resistance.
    Type: Application
    Filed: July 9, 2004
    Publication date: February 10, 2005
    Applicants: SUMITOMO WIRING SYSTEMS, LTD., KYOSHIN CO., LTD., GOKO CORPO.
    Inventors: Takahiro Sakaguchi, Atsushi Fujisawa, Takamichi Yamashita, Hiromichi Tsuji, Takeshi Goto
  • Publication number: 20030217864
    Abstract: A wire harness protective material comprising a tape-like substrate made of a nonhalogen-based resin or vinyl chloride resin coated with an adhesive comprising an acrylic resin as a main component on at least one side thereof. Preferably, the adhesive and/or the substrate comprises an age resistor and/or a copper inhibitor incorporated therein. The content of the age resistor is defined to be from 10% to 500% based on the content of the age resistor in the covering material for the wire coated with a nonhalogen-based resin in the bundle of wires on which the wire harness protective material is wound. The content of the copper inhibitor is defined to be from 0.001 to 5 parts by weight based on 100 parts by weight of the adhesive resin component or from 0.001 to 5 parts by weight based on 100 parts by weight of the substrate resin component.
    Type: Application
    Filed: November 19, 2002
    Publication date: November 27, 2003
    Applicant: Sumitomo Wiring Systems, Ltd.
    Inventors: Masanao Ishikawa, Mamoru Kondo, Tatsuya Hase, Yoshiharu Deguchi, Jun Yoshimoto, Tetsuya Nakamura, Genya Kawakita, Takamichi Yamashita, Hiroshi Hayami
  • Publication number: 20030207106
    Abstract: A harness-protecting material and wire harness comprises a base material which comprises two faces, at least one face of which is coated with an adhesive. The base material comprises a base organic material portion which includes a base polymer portion formed of a halogen-free resin or a substantially halogen-free resin. The adhesive comprises an adhesive adjuvant which contains at least one compound selected from the group consisting of a hydrogenated terpene-type resin, a hydrogenated aromatic resin, a hydrogenated aliplatic-type resin, a cumarone-indene type resin, a phenol-type resin and a styrene-type resin. The adhesive may contain acrylic acid-type resin as base polymer portion. The base material and/or adhesive may contain an anti-oxidizing agent, a copper damage inhibitor and/or an adsorbent. This abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.
    Type: Application
    Filed: January 15, 2003
    Publication date: November 6, 2003
    Applicant: Sumitomo Wiring Systems, Ltd.
    Inventors: Tetsuya Nakamura, Mamoru Kondo, Tatsuya Hase, Yoshiharu Deguchi, Jun Yoshimoto, Genya Kawakita, Masanao Ishikawa, Takamichi Yamashita