Patents by Inventor Takamine Sugiura
Takamine Sugiura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11787981Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.Type: GrantFiled: May 2, 2022Date of Patent: October 17, 2023Assignee: DIC CORPORATIONInventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
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Publication number: 20230242793Abstract: An object of the present invention is to provide an adhesive tape that has high conformability and high adhesion to an adherend, particularly, to a hard adherend and that has high removability such that the adhesive tape, when peeled off, can be easily peeled off if it is stretched not only in the horizontal direction of the adhesive tape but also at an angle, without the need to embrittle the adhesive tape, for example, by heating or by using an organic solvent and without leaving an adhesive on the adherend. The present invention relates to an adhesive tape including an adhesive layer containing a filler. The adhesive tape has a thickness of more than 150 ?m and less than 1,500 ?m, an elongation at break of 600% to 3,000%, and a tensile strength at break of 2.5 to 80.0 MPa.Type: ApplicationFiled: April 10, 2023Publication date: August 3, 2023Applicant: DIC CORPORATIONInventors: Daisuke Watanabe, Takamine Sugiura
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Patent number: 11649381Abstract: An object of the present invention is to provide an adhesive tape that has high conformability and high adhesion to an adherend, particularly, to a hard adherend and that has high removability such that the adhesive tape, when peeled off, can be easily peeled off if it is stretched not only in the horizontal direction of the adhesive tape but also at an angle, without the need to embrittle the adhesive tape, for example, by heating or by using an organic solvent and without leaving an adhesive on the adherend. The present invention relates to an adhesive tape including an adhesive layer containing a filler. The adhesive tape has a thickness of more than 150 ?m and less than 1,500 ?m, an elongation at break of 600% to 3,000%, and a tensile strength at break of 2.5 to 80.0 MPa.Type: GrantFiled: February 26, 2019Date of Patent: May 16, 2023Assignee: DIC CORPORATIONInventors: Daisuke Watanabe, Takamine Sugiura
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Publication number: 20220251426Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.Type: ApplicationFiled: May 2, 2022Publication date: August 11, 2022Applicant: DIC CORPORATIONInventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
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Publication number: 20220049133Abstract: The adhesive sheet can be easily peeled off by stretching even if the direction of the stretching is the perpendicular direction with respect to an attached surface of an attached object, and is less likely to break even when a substrate of the adhesive sheet is thin, and is excellent in impact resistance, shear adhesive strength, and cleavage adhesive strength. The present invention relates to an adhesive sheet including an adhesive layer and a substrate layer. The adhesive layer contains filler particles and an adhesive resin. The content of the filler particles in the adhesive layer is 10 parts by weight to 90 parts by weight relative to 100 parts by weight of the adhesive resin. The volume ratio of the filler particles to the adhesive layer is 4% to 40%. The adhesive sheet has a stress at 25% elongation of 0.15 Mpa to 82 Mpa.Type: ApplicationFiled: August 29, 2019Publication date: February 17, 2022Applicant: DIC CorporationInventors: Daisuke Watanabe, Takamine Sugiura
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Publication number: 20210032506Abstract: An object of the present invention is to provide an adhesive tape that has high conformability and high adhesion to an adherend, particularly, to a hard adherend and that has high removability such that the adhesive tape, when peeled off, can be easily peeled off if it is stretched not only in the horizontal direction of the adhesive tape but also at an angle, without the need to embrittle the adhesive tape, for example, by heating or by using an organic solvent and without leaving an adhesive on the adherend. The present invention relates to an adhesive tape including an adhesive layer containing a filler. The adhesive tape has a thickness of more than 150 ?m and less than 1,500 ?m, an elongation at break of 600% to 3,000%, and a tensile strength at break of 2.5 to 80.0 MPa.Type: ApplicationFiled: February 26, 2019Publication date: February 4, 2021Applicant: DIC CorporationInventors: Daisuke Watanabe, Takamine Sugiura
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Publication number: 20200190370Abstract: The invention relates to a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.Type: ApplicationFiled: June 14, 2018Publication date: June 18, 2020Applicant: DIC CorporationInventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami