Patents by Inventor Takamine Sugiura

Takamine Sugiura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11787981
    Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: October 17, 2023
    Assignee: DIC CORPORATION
    Inventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
  • Publication number: 20230242793
    Abstract: An object of the present invention is to provide an adhesive tape that has high conformability and high adhesion to an adherend, particularly, to a hard adherend and that has high removability such that the adhesive tape, when peeled off, can be easily peeled off if it is stretched not only in the horizontal direction of the adhesive tape but also at an angle, without the need to embrittle the adhesive tape, for example, by heating or by using an organic solvent and without leaving an adhesive on the adherend. The present invention relates to an adhesive tape including an adhesive layer containing a filler. The adhesive tape has a thickness of more than 150 ?m and less than 1,500 ?m, an elongation at break of 600% to 3,000%, and a tensile strength at break of 2.5 to 80.0 MPa.
    Type: Application
    Filed: April 10, 2023
    Publication date: August 3, 2023
    Applicant: DIC CORPORATION
    Inventors: Daisuke Watanabe, Takamine Sugiura
  • Patent number: 11649381
    Abstract: An object of the present invention is to provide an adhesive tape that has high conformability and high adhesion to an adherend, particularly, to a hard adherend and that has high removability such that the adhesive tape, when peeled off, can be easily peeled off if it is stretched not only in the horizontal direction of the adhesive tape but also at an angle, without the need to embrittle the adhesive tape, for example, by heating or by using an organic solvent and without leaving an adhesive on the adherend. The present invention relates to an adhesive tape including an adhesive layer containing a filler. The adhesive tape has a thickness of more than 150 ?m and less than 1,500 ?m, an elongation at break of 600% to 3,000%, and a tensile strength at break of 2.5 to 80.0 MPa.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: May 16, 2023
    Assignee: DIC CORPORATION
    Inventors: Daisuke Watanabe, Takamine Sugiura
  • Publication number: 20220251426
    Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.
    Type: Application
    Filed: May 2, 2022
    Publication date: August 11, 2022
    Applicant: DIC CORPORATION
    Inventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami
  • Publication number: 20220049133
    Abstract: The adhesive sheet can be easily peeled off by stretching even if the direction of the stretching is the perpendicular direction with respect to an attached surface of an attached object, and is less likely to break even when a substrate of the adhesive sheet is thin, and is excellent in impact resistance, shear adhesive strength, and cleavage adhesive strength. The present invention relates to an adhesive sheet including an adhesive layer and a substrate layer. The adhesive layer contains filler particles and an adhesive resin. The content of the filler particles in the adhesive layer is 10 parts by weight to 90 parts by weight relative to 100 parts by weight of the adhesive resin. The volume ratio of the filler particles to the adhesive layer is 4% to 40%. The adhesive sheet has a stress at 25% elongation of 0.15 Mpa to 82 Mpa.
    Type: Application
    Filed: August 29, 2019
    Publication date: February 17, 2022
    Applicant: DIC Corporation
    Inventors: Daisuke Watanabe, Takamine Sugiura
  • Publication number: 20210032506
    Abstract: An object of the present invention is to provide an adhesive tape that has high conformability and high adhesion to an adherend, particularly, to a hard adherend and that has high removability such that the adhesive tape, when peeled off, can be easily peeled off if it is stretched not only in the horizontal direction of the adhesive tape but also at an angle, without the need to embrittle the adhesive tape, for example, by heating or by using an organic solvent and without leaving an adhesive on the adherend. The present invention relates to an adhesive tape including an adhesive layer containing a filler. The adhesive tape has a thickness of more than 150 ?m and less than 1,500 ?m, an elongation at break of 600% to 3,000%, and a tensile strength at break of 2.5 to 80.0 MPa.
    Type: Application
    Filed: February 26, 2019
    Publication date: February 4, 2021
    Applicant: DIC Corporation
    Inventors: Daisuke Watanabe, Takamine Sugiura
  • Publication number: 20200190370
    Abstract: The invention relates to a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.
    Type: Application
    Filed: June 14, 2018
    Publication date: June 18, 2020
    Applicant: DIC Corporation
    Inventors: Daisuke Watanabe, Takamine Sugiura, Akira Yamakami