Patents by Inventor TAKAMITSU HOSHIHIRA

TAKAMITSU HOSHIHIRA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEVICE AND METHOD OF MANUFACTURING THE DEVICE
    Publication number: 20230219324
    Abstract: A device includes a first member, a second member, and a bonding layer. A first surface of the first member and a second surface of the second member are bonded to each other via the bonding layer. The bonding layer includes a filler particle configured to be in contact with both of the first surface and the second surface, and a solidified adhesive. A distance between the first surface and the second surface is smaller than a diameter of the filler particle at at least one portion of an outer edge of the bonding layer.
    Type: Application
    Filed: December 22, 2022
    Publication date: July 13, 2023
    Inventors: NORIYUKI NAKAI, TAKAMITSU HOSHIHIRA