Patents by Inventor Takamitsu Kimura

Takamitsu Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10399167
    Abstract: An electrical discharge machining electrode wire includes a core including a copper or a copper alloy, and a covering layer that covers a periphery of the core and includes a zinc. The covering layer includes an outermost layer consisting of an ?-phase of a copper-zinc based alloy. The outermost layer has a Cu concentration of 12 to 20 mass % and a variation range within 5 mass % in the Cu concentration in a longitudinal direction of the electrode wire.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: September 3, 2019
    Assignee: HITACHI METALS, LTD.
    Inventors: Takayuki Tsuji, Hiromitsu Kuroda, Tetsuya Tokumitsu, Takamitsu Kimura, Yosuke Shiba, Hiroshi Matsuzaki, Yuichi Komuro, Shingo Amamiya
  • Patent number: 10384282
    Abstract: An electrical discharge machining electrode wire includes a core including a copper or a copper alloy, and a covering layer that covers a periphery of the core and includes a zinc. The covering layer includes an outermost layer consisting of an ?-phase of a copper-zinc based alloy. The outermost layer has a Vickers hardness of 200 to 300 Hv.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: August 20, 2019
    Assignee: HITACHI METALS, LTD.
    Inventors: Takayuki Tsuji, Hiromitsu Kuroda, Tetsuya Tokumitsu, Takamitsu Kimura, Yosuke Shiba, Hiroshi Matsuzaki, Yuichi Komuro, Shingo Amamiya
  • Patent number: 10307848
    Abstract: An electrical discharge machining electrode wire includes a core including a copper or a copper alloy, and a covering layer covering a periphery of the core and including a zinc. The covering layer includes an inner layer including a ?-phase of copper-zinc based alloy and covering the periphery of the core, and an outer layer including an ?-phase of copper-zinc based alloy and covering a periphery of the inner layer. An x-ray diffraction intensity of (0001) of the ?-phase is more than twice an x-ray diffraction intensity of (332) of the ?-phase.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: June 4, 2019
    Assignee: HITACHI METALS, LTD.
    Inventors: Takayuki Tsuji, Hiromitsu Kuroda, Tetsuya Tokumitsu, Takamitsu Kimura, Yosuke Shiba, Hiroshi Matsuzaki, Yuichi Komuro, Shingo Amamiya
  • Publication number: 20170072489
    Abstract: An electrical discharge machining electrode wire includes a core including a copper or a copper alloy, and a covering layer that covers a periphery of the core and includes a zinc. The covering layer includes an outermost layer consisting of an ?-phase of a copper-zinc based alloy. The outermost layer has a Vickers hardness of 200 to 300 Hv.
    Type: Application
    Filed: January 7, 2015
    Publication date: March 16, 2017
    Inventors: Takayuki TSUJI, Hiromitsu KURODA, Tetsuya TOKUMITSU, Takamitsu KIMURA, Yosuke SHIBA, Hiroshi MATSUZAKI, Yuichi KOMURO, Shingo AMAMIYA
  • Publication number: 20170014927
    Abstract: An electrical discharge machining electrode wire includes a core including a copper or a copper alloy, and a covering layer that covers a periphery of the core and includes a zinc. The covering layer includes an outermost layer consisting of an s-phase of a copper-zinc based alloy. The outermost layer has a Cu concentration of 12 to 20 mass % and a variation range within 5 mass % in the Cu concentration in a longitudinal direction of the electrode wire.
    Type: Application
    Filed: January 7, 2015
    Publication date: January 19, 2017
    Inventors: Takayuki TSUJI, Hiromitsu KURODA, Tetsuya TOKUMITSU, Takamitsu KIMURA, Yosuke SHIBA, Hiroshi MATSUZAKI, Yuichi KOMURO, Shingo AMAMIYA
  • Patent number: 8461470
    Abstract: In a laser machining apparatus that performs machining by a laser beam (4) emitted from a laser oscillator (1), the laser machining apparatus herein provided includes an aperture (5) placed in a light path of the laser beam (4) emitted from the laser oscillator (1) so as to block a perimeter portion of the laser beam (4) and to transmit a middle portion thereof, and a beam-power measurement sensor (6) for measuring beam power of a laser beam (20) transmitted through the aperture (5), whereby it utilizes that beam power of the laser beam transmitted through the aperture (5) significantly changes (the more degraded, the more the beam power rises) due to a degradation condition of an output mirror (2) when the output mirror in the laser oscillator (1) becomes in high thermal loading condition due to the laser beam with high beam power, so that the degradation condition of the output mirror (2) is determined.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: June 11, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kenji Ito, Takamitsu Kimura, Osami Yamaoka
  • Publication number: 20100245830
    Abstract: In a laser machining apparatus that performs machining by a laser beam (4) emitted from a laser oscillator (1), the laser machining apparatus herein provided includes an aperture (5) placed in a light path of the laser beam (4) emitted from the laser oscillator (1) so as to block a perimeter portion of the laser beam (4) and to transmit a middle portion thereof, and a beam-power measurement sensor (6) for measuring beam power of a laser beam (20) transmitted through the aperture (5), whereby it utilizes that beam power of the laser beam transmitted through the aperture (5) significantly changes (the more degraded, the more the beam power rises) due to a degradation condition of an output mirror (2) when the output mirror in the laser oscillator (1) becomes in high thermal loading condition due to the laser beam with high beam power, so that the degradation condition of the output mirror (2) is determined.
    Type: Application
    Filed: November 20, 2007
    Publication date: September 30, 2010
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kenji Ito, Takamitsu Kimura, Osami Yamaoka
  • Patent number: 6362447
    Abstract: It is an object of the invention to provide an electrode wire for an electrical discharge machining apparatus, which is low-priced in cost of production, has sufficient conductivity and strength at high temperature and is suited for improving the speed of electrical discharge machining. Cu—Zn alloy covering layer is formed around a core metallic wire formed of Cu—0.02 to 0.2 Zr alloy or Cu—0.15 to 0.25 Sn—0.15 to 0.25 In alloy.
    Type: Grant
    Filed: March 9, 1999
    Date of Patent: March 26, 2002
    Assignee: Hitachi Cable Ltd.
    Inventors: Kiyoshi Shimojima, Seigi Aoyama, Hideo Kawano, Koichi Tamura, Takahiro Sato, Takamitsu Kimura, Masato Watabe
  • Publication number: 20010050269
    Abstract: It is an object of the invention to provide an electrode wire for an electrical discharge machining apparatus, which is low-priced in cost of production, has sufficient conductivity and strength at high temperature and is suited for improving the speed of electrical discharge machining. Cu—Zn alloy covering layer is formed around a core metallic wire formed of Cu-0.02 to 0.2 Zr alloy or Cu-0.15 to 0.25 Sn-0.15 to 0.25 In alloy.
    Type: Application
    Filed: March 9, 1999
    Publication date: December 13, 2001
    Inventors: KIYOSHI SHIMOJIMA, SEIGI AOYAMA, HIDEO KAWANO, KOICHI TAMURA, TAKAHIRO SATO, TAKAMITSU KIMURA, MASATO WATABE
  • Patent number: 6250536
    Abstract: The invention relates to a method for manufacturing an electrode wire for an electrical discharge machining apparatus, which is composed of a core wire formed of Cu or Cu-alloy and a covering layer formed of brass. A brass tape is longitudinally applied around a core wire to provide a pipe, a seam formed by butting longitudinal edges of the brass tape is continuously welded to provide a composite wire, area-reduction process of reduction rate less than 65% is applied to the brass pipe by means of a squeezing die, a heat treatment at a temperature higher a recrystallization one of brass is applied to the composite pipe, and thereafter the composite wire is processed to be reduced in area through plural reducing dies step by step.
    Type: Grant
    Filed: May 13, 1999
    Date of Patent: June 26, 2001
    Assignee: Hitachi Cable Ltd.
    Inventors: Kiyoshi Shimojima, Seigi Aoyama, Hideo Kawano, Koichi Tamura, Takahiro Sato, Takamitsu Kimura, Masato Watabe