Patents by Inventor Takamitsu Miura

Takamitsu Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9895758
    Abstract: An object is to prolong the life of a ring tool, and improve the productivity of a welded pipe. A ring tool unit is held in a downstream-side end portion of a mandrel to be inserted into a welded pipe currently being manufactured from the upstream side of a welding position, and is used as a cutting tool for continuously cutting a bead produced on the inner surface of the welded pipe, wherein the ring tool unit is formed by fitting a ring tool having a ring-like blade in a sleeve having a circular hole for holding the outer circumference of the ring tool.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: February 20, 2018
    Assignee: NAKATA MANUFACTURING CO., LTD.
    Inventors: Feizhou Wang, Takeyuki Sato, Mitsuru Nakata, Tomoyasu Nakano, Takamitsu Miura
  • Publication number: 20170080507
    Abstract: An object is to prolong the life of a ring tool, and improve the productivity of a welded pipe. A ring tool unit is held in a downstream-side end portion of a mandrel to be inserted into a welded pipe currently being manufactured from the upstream side of a welding position, and is used as a cutting tool for continuously cutting a bead produced on the inner surface of the welded pipe, wherein the ring tool unit is formed by fitting a ring tool having a ring-like blade in a sleeve having a circular hole for holding the outer circumference of the ring tool.
    Type: Application
    Filed: March 18, 2014
    Publication date: March 23, 2017
    Applicant: NAKATA MANUFACTURING CO., LTD
    Inventors: Feizhou WANG, Takeyuki SATO, Mitsuru NAKATA, Tomoyasu NAKANO, Takamitsu MIURA
  • Patent number: 6040520
    Abstract: In a solar cell including a photoelectric conversion layer 14 disposed on a flexible substrate 11 and constituted by a laminated layer of non-single crystalline silicon thin films, the flexible substrate 11 has a coefficient of linear thermal expansion of is 2.0 ppm to 10.0 ppm. By this, the coefficient of linear thermal expansion of the flexible substrate 11 and that of the photoelectric conversion layer 14 become close to each other, so that warp and deformation during manufacturing steps and after the steps are decreased. Further, since stress applied to the photoelectric conversion layer 14 is also lessened, the photoelectric conversion efficiency can be increased.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: March 21, 2000
    Assignees: Semicondutor Energy Laboratory Co., Ltd., TDK Corporation
    Inventors: Hisao Morooka, Takamitsu Miura, Hiroshi Yamada, Katsuki Kurihara, Mitsutaka Matsuse, Yasuyuki Arai