Patents by Inventor Takamitsu Nakamura

Takamitsu Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240129362
    Abstract: An orchestrator locates a server in anyone of a plurality of edge clouds on the basis of a plurality of delay differences, respectively corresponding to the plurality of the edge clouds having each delay difference and assumed if the server located in each of the edge clouds, that are each a difference between delay from the server to a first client and delay from the server to a second client, and gives a delay to at least one of the first client and the second client so that the delay from the located server to the first client and the delay from the located server to the second client become the same.
    Type: Application
    Filed: February 15, 2021
    Publication date: April 18, 2024
    Inventors: Mitsuo AMASAKA, Takamitsu NARUMI, Takayuki NAKAMURA, Takuya SATO
  • Patent number: 11945261
    Abstract: Provided is a tire including, in a surface of a tread of the tire, a land portion row in which four land portions are arranged in parallel in a width direction of the tread, in a land portion on one end side of the land portion row, a recess that opens in a circumferential groove on an adjacent land portion side, and an intermittent sipe extending in an orientation intersecting the width direction of the tread, intermittently by being interrupted by the circumferential groove, from a position of a start end corresponding to the recess, across three land portions of the four land portions excluding the land portion on the one end side, wherein the intermittent sipe opens in a surface of each of the three land portions via an inclined surface from the surface of each of the three land portions toward the intermittent sipe.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: April 2, 2024
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura
  • Publication number: 20240021503
    Abstract: The present disclosure is directed to an electronic component package including: a wiring board including a first principal surface and a second principal surface facing each other; an electronic component mounted on the first principal surface; a sealing member provided on the first principal surface for covering the electronic component; and a shield film provided on a surface of the sealing member, wherein the wiring board is provided with a plurality of through holes between the first principal surface and the second principal surface, an electronic component including a columnar terminal is mounted on the first principal surface, and the columnar terminal is inserted into at least one of the through holes from the first principal surface and is exposed on a side of the second principal surface, thereby reducing the size and height of the package.
    Type: Application
    Filed: September 26, 2023
    Publication date: January 18, 2024
    Inventors: Yoshihito OTSUBO, Takamitsu NAKAMURA
  • Publication number: 20230380059
    Abstract: A module includes a substrate including a first surface, a first land electrode arranged on the first surface, and a first electronic component mounted on the substrate with the first land electrode being interposed. The substrate is provided with a first opening that passes through the substrate in a direction of thickness within a projection area of the first land electrode.
    Type: Application
    Filed: August 2, 2023
    Publication date: November 23, 2023
    Inventors: Yoshihito OTSUBO, Takamitsu NAKAMURA
  • Publication number: 20230335451
    Abstract: An electronic component package includes: a resin portion having a first surface; one or more electronic components each having a plurality of external electrodes; and a plurality of extraction electrodes electrically connected to the plurality of external electrodes. Only each of the plurality of extraction electrodes is exposed from the resin portion on the first surface. The plurality of external electrodes are covered with the resin portion.
    Type: Application
    Filed: June 12, 2023
    Publication date: October 19, 2023
    Inventors: Takamitsu NAKAMURA, Hideo NAKAGOSHI, Kensuke OTAKE, Hiroki YOSHIMORI
  • Publication number: 20220281266
    Abstract: The circumferential groove and the circumferential groove of the pneumatic tire are formed inside than a tire equatorial line when mounted to the vehicle. In an outside center land portion and an inside center land portion, linear width direction sipes, width direction sipes and width direction sipes inclined with respect to the tire width direction are formed along the tire width direction. An inside shoulder land portion has a slick portion in which the surface of the inside shoulder land portion is slick in a grounding region of the inside shoulder land portion in a state where normal load is loaded on a tire.
    Type: Application
    Filed: September 11, 2020
    Publication date: September 8, 2022
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Takamitsu NAKAMURA, Haruka SUZUKI
  • Publication number: 20220072910
    Abstract: Provided is a tire including, in a surface of a tread of the tire, a land portion row in which four land portions are arranged in parallel in a width direction of the tread, in a land portion on one end side of the land portion row, a recess that opens in a circumferential groove on an adjacent land portion side, and an intermittent sipe extending in an orientation intersecting the width direction of the tread, intermittently by being interrupted by the circumferential groove, from a position of a start end corresponding to the recess, across three land portions of the four land portions excluding the land portion on the one end side, wherein the intermittent sipe opens in a surface of each of the three land portions via an inclined surface from the surface of each of the three land portions toward the intermittent sipe.
    Type: Application
    Filed: December 11, 2019
    Publication date: March 10, 2022
    Applicant: BRIDGESTONE CORPORATION
    Inventor: Takamitsu NAKAMURA
  • Publication number: 20210221178
    Abstract: Provided is a motorcycle tire with improved wet grip performance while ensuring the rigidity during turning.
    Type: Application
    Filed: August 30, 2018
    Publication date: July 22, 2021
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Takamitsu NAKAMURA, Yasufumi TOKITOH, Naoki SHIMAMURA
  • Patent number: D924125
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: July 6, 2021
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura
  • Patent number: D924126
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: July 6, 2021
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura
  • Patent number: D929311
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: August 31, 2021
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura
  • Patent number: D931191
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: September 21, 2021
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura
  • Patent number: D934153
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: October 26, 2021
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura
  • Patent number: D938898
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: December 21, 2021
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura
  • Patent number: D958054
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: July 19, 2022
    Assignee: BRIDGESTONE CORPORATION
    Inventors: Takamitsu Nakamura, Norimasa Yamashita
  • Patent number: D958055
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: July 19, 2022
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura
  • Patent number: D981940
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: March 28, 2023
    Assignee: BRIDGESTONE CORPORATION
    Inventors: Norimasa Yamashita, Takamitsu Nakamura
  • Patent number: D997086
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: August 29, 2023
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura
  • Patent number: D998545
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: September 12, 2023
    Assignee: BRIDGESTONE CORPORATION
    Inventors: Norimasa Yamashita, Takamitsu Nakamura
  • Patent number: D1000369
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: October 3, 2023
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Takamitsu Nakamura