Patents by Inventor Takamitsu OTA

Takamitsu OTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
    Patent number: 8664685
    Abstract: The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.3 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: March 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Takashi Taniguchi, Takamitsu Ota, Hisataka Ito
  • RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING DEVICE OBTAINED USING THE SAME
    Publication number: 20120217532
    Abstract: The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.26 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.
    Type: Application
    Filed: February 23, 2012
    Publication date: August 30, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuhiro Fuke, Takashi Taniguchi, Takamitsu Ota, Hisataka Ito
  • RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE, AND OPTICAL SEMICONDUCTOR LIGHT-EMITTING DEVICE OBTAINED USING THE SAME
    Publication number: 20110057228
    Abstract: The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.3 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.
    Type: Application
    Filed: September 3, 2010
    Publication date: March 10, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi TANIGUCHI, Takamitsu OTA, Hisataka ITO