Abstract: An acoustic wave device includes a piezoelectric body portion, an interdigital transducer electrode connected to a first terminal and a second terminal, and a reflector connected to the second terminal. In the interdigital transducer electrode, in the interdigital transducer electrode, where, of a group of electrode fingers, the electrode finger located at one end in a second direction is a first end electrode finger and the electrode finger located at another end is a second end electrode finger, the first end electrode finger is located between the reflector and the second end electrode finger in the second direction. An outer busbar portion of one of a first busbar and a second busbar, not connected to the first end electrode finger, is located on an inner side in the second direction relative to a center portion, in a first direction, of the first end electrode finger.

Abstract: An acoustic wave device includes a plurality of interdigital transducer electrodes, in a first interdigital transducer electrode, a first electrode finger includes a wide portion having a greater width in the second direction than a center portion. In the first interdigital transducer electrode, for the first electrode finger, a first distance that is a maximum distance in the second direction between a center line of the center portion in a first direction is shorter than a second distance that is a maximum distance in a second direction between the center line of the center portion and an outer edge, away from a second interdigital transducer electrode, of the wide portion.

Abstract: An acoustic wave device includes an interdigital transducer electrode connected to first and second terminals, and a reflector connected to the second terminal. In a group of electrode fingers of the interdigital transducer electrode, the electrode fingers at one end and another end in a second direction are respectively first and second end electrode fingers, the first end electrode finger includes a wide portion at a distal end portion. The first end electrode finger is located between the reflector and the second end electrode finger in the second direction. An inner busbar portion of one of first and second busbars not connected to the first end electrode finger, is located on an inner side in the second direction relative to the wide portion of the first end electrode finger so as not to overlap the wide portion of the first end electrode finger in a first direction.

Abstract: An acoustic wave device includes a piezoelectric body portion, an interdigital transducer electrode connected to a first terminal and a second terminal, and a reflector connected to the second terminal. In the interdigital transducer electrode, in the interdigital transducer electrode, where, of a group of electrode fingers, the electrode finger located at one end in a second direction is a first end electrode finger and the electrode finger located at another end is a second end electrode finger, the first end electrode finger is located between the reflector and the second end electrode finger in the second direction. An outer busbar portion of one of a first busbar and a second busbar, not connected to the first end electrode finger, is located on an inner side in the second direction relative to a center portion, in a first direction, of the first end electrode finger.

Abstract: An acoustic wave device includes a plurality of interdigital transducer electrodes, in a first interdigital transducer electrode, a first electrode finger includes a wide portion having a greater width in the second direction than a center portion. In the first interdigital transducer electrode, for the first electrode finger, a first distance that is a maximum distance in the second direction between a center line of the center portion in a first direction is shorter than a second distance that is a maximum distance in a second direction between the center line of the center portion and an outer edge, away from a second interdigital transducer electrode, of the wide portion.

Abstract: An acoustic wave device includes an interdigital transducer electrode connected to first and second terminals, and a reflector connected to the second terminal. In a group of electrode fingers of the interdigital transducer electrode, the electrode fingers at one end and another end in a second direction are respectively first and second end electrode fingers, the first end electrode finger includes a wide portion at a distal end portion. The first end electrode finger is located between the reflector and the second end electrode finger in the second direction. An inner busbar portion of one of first and second busbars not connected to the first end electrode finger, is located on an inner side in the second direction relative to the wide portion of the first end electrode finger so as not to overlap the wide portion of the first end electrode finger in a first direction.

Abstract: A dextrin fatty acid ester is provided in which the dextrin has an average degree of glycopolymerization of 3 or more and 100 or less. The fatty acid comprises one or more linear saturated fatty acids having 14 or more and 18 or less carbon atoms, and one or more branched saturated fatty acids having 14 or more and 18 or less carbon atoms. The molar fraction of the linear saturated fatty acid in the fatty acid is 0.75 or more and 0.95 or less. The average degree of substitution of the fatty acid per glucose unit is 1.5 or more and 2.0 or less.

Abstract: A dextrin fatty acid ester is provided in which the dextrin has an average degree of glycopolymerization of 3 or more and 100 or less. The fatty acid comprises one or more linear saturated fatty acids having 14 or more and 18 or less carbon atoms, and one or more branched saturated fatty acids having 14 or more and 18 or less carbon atoms. The molar fraction of the linear saturated fatty acid in the fatty acid is 0.75 or more and 0.95 or less. The average degree of substitution of the fatty acid per glucose unit is 1.5 or more and 2.0 or less.

Abstract: An object of the present invention is to provide novel dextrin fatty acid ester that is excellent in tackiness and useful as a base for cosmetics and the like. The novel dextrin fatty acid ester is prepared by esterification between dextrin and fatty acids, wherein the dextrin has an average degree of glucose polymerization of 3 to 150; the fatty acids comprise more than 50 mol % and 100 mol % or less, based on the total amount of the fatty acids, of one or more saturated branched fatty acids having 4 to 26 carbon atoms, and 0 mol % or more and less than 50 mol %, based on the total amount of the fatty acids, of one or more fatty acids selected from the group consisting of saturated linear fatty acids having 2 to 22 carbon atoms, unsaturated linear or branched fatty acids having 6 to 30 carbon atoms, and saturated or unsaturated cyclic fatty acids having 6 to 30 carbon atoms; and the degree of substitution by the fatty acids is 1.0 to 3.0 per glucose unit.

Abstract: Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.

Abstract: An object of the present invention is to provide novel dextrin fatty acid ester that is excellent in tackiness and useful as a base for cosmetics and the like. The novel dextrin fatty acid ester is prepared by esterification between dextrin and fatty acids, wherein the dextrin has an average degree of glucose polymerization of 3 to 150; the fatty acids comprise more than 50 mol % and 100 mol % or less, based on the total amount of the fatty acids, of one or more saturated branched fatty acids having 4 to 26 carbon atoms, and 0 mol % or more and less than 50 mol %, based on the total amount of the fatty acids, of one or more fatty acids selected from the group consisting of saturated linear fatty acids having 2 to 22 carbon atoms, unsaturated linear or branched fatty acids having 6 to 30 carbon atoms, and saturated or unsaturated cyclic fatty acids having 6 to 30 carbon atoms; and the degree of substitution by the fatty acids is 1.0 to 3.0 per glucose unit.

Abstract: Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.

Abstract: An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid.

Abstract: Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.

Abstract: A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.

Abstract: A pressure sensor package of the present invention includes a pressure sensor including a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm section; a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on the diaphragm section; and a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements, a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive portions, wherein a total thickness D1 of the semiconductor substrate, a thickness D2 of the diaphragm section, a thickness D3 of the cavity, and a thickness D4=D1?(D2+D3) satisfy the relationships: (D2+D3) in a range of approximately 5-20 ?m, and D1 not less than about 100 ?m.

Abstract: A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.

Abstract: A pressure sensor package of the present invention includes a pressure sensor including a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm section; a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on the diaphragm section; and a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements, a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive portions, wherein a total thickness D1 of the semiconductor substrate, a thickness D2 of the diaphragm section, a thickness D3 of the cavity, and a thickness D4=D1?(D2+D3) satisfy the relationships: (D2+D3) in a range of approximately 5-20 ?m, and D1 not less than about 100 ?m.

Abstract: An oil pump for an automatic transmission includes a pump body having a pump chamber, a pump cover disposed so as to oppose to the pump body, an inner rotor disposed in the pump chamber and driven by a driving force from a torque converter and an outer rotor meshed with the inner rotor. The pump body includes a pump suction port, a pump discharge port a first oil, passage for supplying oil from a oil pan to the pump suction port, a second oil passage for returning excess oil of a first regulator to the first oil passage and a third oil passage having an outlet port for returning excess oil of a second regulator to the pump suction port.

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.