Patents by Inventor Takanobu Kawauchi

Takanobu Kawauchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coining method for bonding pad surface
    Patent number: 5522133
    Abstract: The punching face of a punch for coining is set smaller than the bonding pad surface of a lead frame to which wire bonding is applied and coining is applied to only a portion necessary for the wire bonding to be effected on the bonding pad surface.
    Type: Grant
    Filed: May 16, 1994
    Date of Patent: June 4, 1996
    Assignee: Rohm Co., Ltd
    Inventor: Takanobu Kawauchi
  • Wire bonding method
    Patent number: 5277356
    Abstract: A method of bonding an end of an aluminum wire to a lead comprises the steps of: forming a plurality of parallel bonding grooves on a surface of the lead; pressing the wire end against the grooved surface of the lead with the wire end held in parallel to the bonding grooves; and applying ultrasonic vibration to the wire end in a direction parallel to the bonding grooves.
    Type: Grant
    Filed: June 8, 1993
    Date of Patent: January 11, 1994
    Assignee: Rohm Co., Ltd.
    Inventor: Takanobu Kawauchi