Patents by Inventor TAKANOBU KAWAZOE

TAKANOBU KAWAZOE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11488994
    Abstract: To prevent peeling at an interface between layers forming a layer structure of a solid-state imaging element even in a case where stress is caused by an increase in pressure in a cavity in a configuration in which a translucent member is provided on the solid-state imaging element with a support portion interposed therebetween and the cavity is formed between the solid-state imaging element and the translucent member.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: November 1, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Takanobu Kawazoe
  • Publication number: 20210005655
    Abstract: To prevent peeling at an interface between layers forming a layer structure of a solid-state imaging element even in a case where stress is caused by an increase in pressure in a cavity in a configuration in which a translucent member is provided on the solid-state imaging element with a support portion interposed therebetween and the cavity is formed between the solid-state imaging element and the translucent member.
    Type: Application
    Filed: January 21, 2019
    Publication date: January 7, 2021
    Inventor: TAKANOBU KAWAZOE