Patents by Inventor Takanobu Kobayashi

Takanobu Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210345518
    Abstract: A device which includes a heat generator, a resinous housing covering the heat generator, and a heat radiation material disposed on at least some of the surfaces of the heat generator, wherein the heat radiation material includes metal particles and a resin and has a region where the metal particles arranged along the surface direction are present at a relatively high density.
    Type: Application
    Filed: September 11, 2019
    Publication date: November 4, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Maki TAKAHASHI, Takashi ANDOU, Yoshitaka TAKEZAWA, Takanobu KOBAYASHI, Naoki MARUYAMA
  • Publication number: 20210332281
    Abstract: A heat radiation material which includes metal particles and a resin and has a region inside where the metal particles arranged along the surface direction are present in a relatively high density.
    Type: Application
    Filed: September 11, 2019
    Publication date: October 28, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Maki TAKAHASHI, Takashi ANDOU, Yoshitaka TAKEZAWA, Takanobu KOBAYASHI, Naoki MARUYAMA
  • Patent number: 9147522
    Abstract: An object of the present invention is to provide an ignition coil for use in an internal combustion engine, offering improved water drainage performance, while achieving high waterproof performance with controlled entry of water in a plug hole. A high-voltage generating section 3 that generates a high voltage is housed inside a coil case 4. A plug hole seal 5 closes an opening in a plug hole 2 in which an ignition plug 21 is mounted. The ignition coil further includes a space portion 6 placed on an outer side portion of the high-voltage generating section 3 and an air path 9 for venting air between the space portion 6 and the plug hole 2. The space portion 9 has an open lower surface (an entirely open surface facilitates demolding).
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: September 29, 2015
    Assignees: Hitachi Automotive Systems, Ltd., Honda Motor Co., Ltd.
    Inventors: Makio Takahashi, Takanobu Kobayashi, Yoichi Anzo, Gakuji Moriya, Makoto Kurahashi
  • Patent number: 8922314
    Abstract: An auxiliary core portion and a main core portion, including a magnet if the magnet is attached, are covered by a resin film or an elastomer film and fixed as a single assembly. In this state, a coil is attached to the assembly and a side core portion is assembled to the assembly. The auxiliary core portion and the main core portion, including the magnet if it is attached, can be supplied, as the single assembly, to an automated assembly line for ignition coils. It is not necessary to position such components on the assembly line. Thus, the workability of the automated assembly can be enhanced.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: December 30, 2014
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Takanobu Kobayashi, Yoichi Anzo, Makio Takahashi
  • Publication number: 20140043717
    Abstract: An object of the present invention is to provide an ignition coil for use in an internal combustion engine, offering improved water drainage performance, while achieving high waterproof performance with controlled entry of water in a plug hole. A high-voltage generating section 3 that generates a high voltage is housed inside a coil case 4. A plug hole seal 5 closes an opening in a plug hole 2 in which an ignition plug 21 is mounted. The ignition coil further includes a space portion 6 placed on an outer side portion of the high-voltage generating section 3 and an air path 9 for venting air between the space portion 6 and the plug hole 2. The space portion 9 has an open lower surface (an entirely open surface facilitates demolding).
    Type: Application
    Filed: March 2, 2012
    Publication date: February 13, 2014
    Applicants: Honda Motor Co., Ltd., Hitachi Automotive Systems, Ltd.
    Inventors: Makio Takahashi, Takanobu Kobayashi, Yoichi Anzo, Gakuji Moriya, Makoto Kurahashi
  • Publication number: 20120299679
    Abstract: An auxiliary core portion and a main core portion, including a magnet if the magnet is attached, are covered by a resin film or an elastomer film and fixed as a single assembly. In this state, a coil is attached to the assembly and a side core portion is assembled to the assembly. The auxiliary core portion and the main core portion, including the magnet if it is attached, can be supplied, as the single assembly, to an automated assembly line for ignition coils. It is not necessary to position such components on the assembly line. Thus, the workability of the automated assembly can be enhanced.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 29, 2012
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Takanobu KOBAYASHI, Yoichi Anzo, Makio Takahashi
  • Patent number: 8309658
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: November 13, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi
  • Patent number: 8161955
    Abstract: An internal combustion engine ignition coil device has an annular seal rubber at its lower side coil. An annular projection is provided on a part of the seal rubber and is pressed against the inner diameter surface of a plug hole. An air path is formed in part of a coil case by mounting the seal rubber into a groove, enabling inside and outside portions of the plug hole to communicate. A gas-permeable thin film resin member is bonded to an inlet of the air path.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: April 24, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Yoichi Anzo, Makio Takahashi, Takanobu Kobayashi
  • Patent number: 8138268
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: March 20, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi
  • Publication number: 20120063109
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Application
    Filed: November 17, 2011
    Publication date: March 15, 2012
    Inventors: Shigeki KATOGI, Houko SUTOU, Hiroyuki IZAWA, Toshiaki SHIRASAKA, Masami YUSA, Takanobu KOBAYASHI
  • Publication number: 20110247600
    Abstract: An internal combustion engine ignition coil device has an annular seal rubber at its lower side coil. An annular projection is provided on a part of the seal rubber and is pressed against the inner diameter surface of a plug hole. An air path is formed in part of a coil case by mounting the seal rubber into a groove, enabling inside and outside portions of the plug hole to communicate. A gas-permeable thin film resin member is bonded to an inlet of the air path.
    Type: Application
    Filed: June 21, 2011
    Publication date: October 13, 2011
    Applicant: Hitachi, Ltd.
    Inventors: Yoichi ANZO, Makio TAKAHASHI, Takanobu KOBAYASHI
  • Patent number: 7984707
    Abstract: An internal combustion engine ignition coil device has an annular seal rubber at its lower side coil. An annular projection is provided on a part of the seal rubber and is pressed against the inner diameter surface of a plug hole. An air path is formed in part of a coil case by mounting the seal rubber into a groove, enabling inside and outside portions of the plug hole to communicate. A gas-permeable thin film resin member is bonded to an inlet of the air path.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: July 26, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Yoichi Anzo, Makio Takahashi, Takanobu Kobayashi
  • Publication number: 20110176288
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Application
    Filed: June 8, 2005
    Publication date: July 21, 2011
    Applicant: HITACHI CHEMICAL COMPANY LTD.
    Inventors: Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi
  • Publication number: 20100275893
    Abstract: An internal combustion engine ignition coil device has an annular seal rubber at its lower side coil. An annular projection is provided on a part of the seal rubber and is pressed against the inner diameter surface of a plug hole. An air path is formed in part of a coil case by mounting the seal rubber into a groove, enabling inside and outside portions of the plug hole to communicate. A gas-permeable thin film resin member is bonded to an inlet of the air path.
    Type: Application
    Filed: July 14, 2010
    Publication date: November 4, 2010
    Applicant: Hitachi, Ltd.
    Inventors: Yoichi ANZO, Makio TAKAHASHI, Takanobu KOBAYASHI
  • Patent number: 7789078
    Abstract: An internal combustion engine ignition coil device has an annular seal rubber at its lower side coil. An annular projection is provided on a part of the seal rubber and is pressed against the inner diameter surface of a plug hole. An air path is formed in part of a coil case by mounting the seal rubber into a groove, enabling inside and outside portions of the plug hole to communicate. A gas-permeable thin film resin member is bonded to an inlet of the air path.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: September 7, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Yoichi Anzo, Makio Takahashi, Takanobu Kobayashi
  • Publication number: 20100012358
    Abstract: The circuit-connecting material of the present invention is a circuit-connecting material for connecting a first circuit component having a plurality of first circuit electrodes on a main surface of a first circuit board and a second circuit component having a plurality of second circuit electrodes on a main surface of a second circuit board, in such a manner that the first circuit electrodes and the second circuit electrodes are electrically connected while being opposed to one another; wherein the circuit-connecting material contains an adhesive composition, conductive particles, and a plurality of insulating particles containing one or both of polyamic acid particles and polyimide particles.
    Type: Application
    Filed: August 6, 2007
    Publication date: January 21, 2010
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Takashi Tatsuzawa, Kouji Kobayashi, Naoki Fukushima, Takanobu Kobayashi, Akihiro Ito
  • Publication number: 20080029074
    Abstract: An ignition coil device for an internal combustion engine, which has a superior waterproof property and can be reduced in size and easily produced. An annular seal rubber (2) is mounted to the lower side of an ignition coil device (1). An annular projection (2a) is provided on a part of the seal rubber and is pressed against the inner diameter surface of a plug hole. A substantially L-shaped groove for forming an air path (4) is formed in a part of a coil case (1a). The air path (4) is formed by mounting the seal rubber (2) into the groove, enabling the inside and the outside of the plug hole to communicate with each other. A thin film resin member (3) with a porous structure being permeable to gas but not to liquid is fixedly bonded to an inlet (4a) of the air path (4) to prevent water from entering the plug hole. Those features realize the ignition coil device for the internal combustion engine, which has a superior waterproof property and can be reduced in size and easily produced.
    Type: Application
    Filed: July 28, 2005
    Publication date: February 7, 2008
    Inventors: Yoichi Anzo, Makio Takahashi, Takanobu Kobayashi
  • Patent number: 6303968
    Abstract: An ohmic electrode for electrically connecting a shielding metal film and a window layer is provided to a semiconductor light-receiving element in which stray light is controlled by the shielding metal film. In this semiconductor light-receiving element, the ohmic electrode is disposed such that it encircles a p+ diffusion region while kept in contact with the window layer on a substrate. Crack propagation from the edgewise region into the ohmic electrode is thereby impeded.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: October 16, 2001
    Assignee: Oki Electric Industry, Co., Ltd.
    Inventor: Takanobu Kobayashi
  • Patent number: 4373316
    Abstract: A plug driving apparatus comprising an annular rotary receiver stand for receiving containers, the receiver stand having container placing portions disposed at a plurality of locations thereon in circular arrangement, plug driver heads disposed individually above said placing portions, each of the heads having a sucker portion for sucking and retaining thereon plugs, a plurality of plug pick-up means, each having a retractable hooked portion adapted to be extended to and retracted from a point right beneath the plug driver head, fixed plug-feeder means for feeding plugs to the hooked portion, the plug driver head being adapted to be raised and lowered between an intermediate position where the sucker portion thereof sucks and retains thereon a plug held in the hooked portion and a lower position where plug driving operation is carried out and an upper limit of movement of the driver head.
    Type: Grant
    Filed: September 5, 1980
    Date of Patent: February 15, 1983
    Assignee: Hitachi Shipbuilding & Engineering Company Limited
    Inventor: Takanobu Kobayashi