Abstract: A liquid ejection head includes a substrate which has an energy-generating element that generates energy to be utilized for ejecting a liquid, and a supply orifice for supplying the liquid to the energy-generating element; and an ejection orifice forming member that has a plurality of ejection orifices through which the liquid is ejected, and at least one beam-like projection which projects toward the substrate and extends along an array direction of the ejection orifices at a position corresponding to the supply orifice. A sectional area perpendicular to the array direction of the ejection orifices at the central part of the beam-like projection in the array direction of the ejection orifices is larger than a sectional area in the direction perpendicular to the array direction of the ejection orifices at both ends of the beam-like projection in the array direction.

Abstract: A method of making a nozzle chip includes a step of reduction-projection-exposing a photosensitive resin material to exposure light through a mask by using a reduction-projection-exposure apparatus, the mask having a light-transmitting pattern formed thereon; and a step of forming an ejection orifice pattern corresponding to the light-transmitting pattern on the photosensitive resin material by performing a developing operation. The exposure light in the step of reduction-projection-exposing is passed through a correction mechanism before the exposure light reaches the photosensitive resin material, the correction mechanism being configured to suppress an inclination of a chief ray due to off-axis telecentricity that occurs in the reduction-projection-exposure apparatus.

Abstract: A liquid ejection head is provided with a recording element substrate having a plurality of ejection orifices for ejecting a liquid, the plurality of ejection orifices being arranged to form a row of the ejection orifices. In at least some of the plurality of the ejection orifices, each having one side and another side, the area of an inner wall of the ejection orifices is set to be larger on the other side than on the one side, the one side and the other side being defined by a plane which passes through the center of the ejection orifice, intersects with the row of the ejection orifices at right angles and extends along the direction of the depth of the ejection orifice.

Abstract: A liquid ejection head chip includes a liquid ejection unit having a plurality of ejection orifices for ejecting a liquid, a flow path in communication with the ejection orifices, and an energy generating element that generates energy for ejecting the liquid, the liquid ejection unit being provided on an upper surface formed of a (100) surface of a silicon single-crystal substrate. The side surfaces in at least one of two combinations of opposing side surfaces of the substrate have (111) surfaces of silicon single crystal and the angles of the (111) surfaces relative to the (100) surface are supplementary to each other.

Abstract: An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.

Abstract: Provided is a method of manufacturing a liquid ejection head, including: forming, on a substrate, a flow path mold pattern that becomes a mold of a liquid flow path; forming a negative photosensitive resin layer on the flow path mold pattern; subjecting the negative photosensitive resin layer to exposure processing with use of a reduction projection exposing apparatus and a mask pattern having an ejection orifice mask shape for forming ejection orifices; and subjecting the negative photosensitive resin layer obtained after the exposure processing to development processing to form the ejection orifices, in which the ejection orifices are formed by correcting, by the ejection orifice mask shape, an inclination of an ejection angle due to an off-axis telecentricity caused by the reduction projection exposing apparatus so as to be close to a direction perpendicular to a surface of the substrate.

Abstract: This invention is a manufacturing method of a liquid discharge head that includes a substrate having a plurality of discharge energy generating elements that generate energy that is utilized for discharging a liquid, and a discharge port forming member that constitutes a discharge port group including a plurality of discharge ports that discharge the liquid and flow paths that communicate with the discharge port group. The manufacturing method includes (1) disposing a photosensitive resin as material of the discharge port forming member on or above the substrate, and (2) forming an exposure pattern of the discharge port group using ultraviolet light in the photosensitive resin. In the aforementioned (2), the discharge port group is divided in a longitudinal direction and exposed, and the exposures are respectively performed so that regions in which there is a high degree of telecentricity face each other.

Abstract: A manufacturing method of a liquid ejection head includes a step of performing a first exposure to form a first ejection orifice row and a step of performing a second exposure to form a second ejection orifice row in which ejection orifices are arranged in a row with ejection orifices that form the first ejection orifice row through a connection portion. In an ejection orifice row formed by the first and the second ejection orifice rows, regarding the distances between the centers of ejection orifices in an arrangement direction of the ejection orifices on opening surfaces of the ejection orifices, the ejection orifices are formed so that a distance between the centers of two ejection orifices adjacent to each other with the connection portion in between is longer than a distance between the centers of two ejection orifices adjacent to each other without the connection portion in between.

Abstract: A liquid ejection head is provided with a recording element substrate having a plurality of ejection orifices for ejecting a liquid, the plurality of ejection orifices being arranged to form a row of the ejection orifices. In at least some of the plurality of the ejection orifices, the area of an inner wall of the ejection orifices is set to be larger on the other side than on one side, the other side and the one side being defined by a plane which passes through the center of the ejection orifice, intersects with the row of the ejection orifices at right angles and extends along the direction of the depth of the ejection orifice.

Abstract: A liquid ejection head chip includes a liquid ejection unit having a plurality of ejection orifices for ejecting a liquid, a flow path in communication with the ejection orifices, and an energy generating element that generates energy for ejecting the liquid, the liquid ejection unit being provided on an upper surface formed of a (100) surface of a silicon single-crystal substrate. The side surfaces in at least one of two combinations of opposing side surfaces of the substrate have (111) surfaces of silicon single crystal and the angles of the (111) surfaces relative to the (100) surface are supplementary to each other.

Abstract: Provided is a method of manufacturing a liquid ejection head, including: forming, on a substrate, a flow path mold pattern that becomes a mold of a liquid flow path; forming a negative photosensitive resin layer on the flow path mold pattern; subjecting the negative photosensitive resin layer to exposure processing with use of a reduction projection exposing apparatus and a mask pattern having an ejection orifice mask shape for forming ejection orifices; and subjecting the negative photosensitive resin layer obtained after the exposure processing to development processing to form the ejection orifices, in which the ejection orifices are formed by correcting, by the ejection orifice mask shape, an inclination of an ejection angle due to an off-axis telecentricity caused by the reduction projection exposing apparatus so as to be close to a direction perpendicular to a surface of the substrate.

Abstract: A liquid ejection head includes: a substrate which has an energy-generating element that generates energy to be utilized for ejecting a liquid, and a supply orifice for supplying the liquid to the energy-generating element; and an ejection orifice forming member that has a plurality of ejection orifices through which the liquid is ejected, and at least one beam-like projection which projects toward the substrate and extends along an array direction of the ejection orifices at a position corresponding to the supply orifice; wherein a sectional area perpendicular to the array direction of the ejection orifices in the central part of the beam-like projection in the array direction of the ejection orifices is larger than a sectional area in the direction perpendicular to the array direction of the ejection orifices in both ends of the beam-like projection in the array direction.

Abstract: An ink jet recording head includes a substrate having a plurality of discharge energy generation elements and having an ink supply port, a protective film provided on the substrate and configured to protect wiring connected to the discharge energy generation elements, and an ink discharge port forming member, wherein the protective film has a protruding portion, wherein the ink discharge port forming member has a beam-like protrusion, wherein the beam-like protrusion has a reinforcing rib, and wherein a separation film containing gold is formed at a portion where the protruding portion and the reinforcing rib are held in close contact with each other.

Abstract: A method of making a nozzle chip includes a step of reduction-projection-exposing a photosensitive resin material to exposure light through a mask by using a reduction-projection-exposure apparatus, the mask having a light-transmitting pattern formed thereon; and a step of forming an ejection orifice pattern corresponding to the light-transmitting pattern on the photosensitive resin material by performing a developing operation. The exposure light in the step of reduction-projection-exposing is passed through a correction mechanism before the exposure light reaches the photosensitive resin material, the correction mechanism being configured to suppress an inclination of a chief ray due to off-axis telecentricity that occurs in the reduction-projection-exposure apparatus.

Abstract: A process for producing a semiconductor chip having a substrate and a bump formed on the substrate including (1) forming, on a substrate, a conductor gold for plating to be a base of plating growth; (2) forming a mask for plating on the conductor gold for plating; (3) performing plating using the mask for plating to form the bump and a dummy pattern; (4) removing the mask for plating; (5) etching the conductor gold for plating; and (6) applying a shock to at least the dummy pattern. The amount of side etching of the conductor gold for plating is grasped from a state of separation of the dummy pattern due to the shock in the step (6).

Abstract: The present disclosure provides a method of making a nozzle chip including a step of forming an ejection orifice row by performing irradiation with light rays using a mask having ejection orifice row patterns that form an ejection orifice row pattern of one nozzle chip when the ejection orifice row patterns are connected to each other through a connection portion. The mask is configured such that, with respect to a direction in which ejection orifices of the ejection orifice row are arranged, an absolute value of off-axis telecentricity of one of the light rays with which an ejection orifice that is at the smallest distance from the connection portion is irradiated is less than an absolute value of off-axis telecentricity of one of the light rays with which an ejection orifice that is at the greatest distance from the connection portion is irradiated.