Patents by Inventor Takanori Arai

Takanori Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250018509
    Abstract: A solder alloy includes 35 mass % or more and 65 mass % or less of Bi, 0.1 mass % or more and 0.65 mass % or less of Sb, 0.05 mass % or more and 2 mass % or less of Ag, and a balance including Sn and an inevitable impurity.
    Type: Application
    Filed: September 25, 2024
    Publication date: January 16, 2025
    Applicant: TAMURA CORPORATION
    Inventors: Takanori SHIMAZAKI, Tomoki ASANO, Masaya ARAI
  • Patent number: 9718166
    Abstract: A water jet peening apparatus includes: a nozzle, which is arranged in water and has a mouth from which water is jetted out; a detecting device, which is arranged in the water and detects sound in at least a part of a period during which the water is being jetted out from the mouth; and a processing device, which determines, based on a result of the detection by the detecting device, presence or absence of abnormality in the nozzle.
    Type: Grant
    Filed: January 12, 2015
    Date of Patent: August 1, 2017
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Motoyuki Fujii, Takanori Arai
  • Publication number: 20150231762
    Abstract: A water jet peening apparatus includes: a nozzle, which is arranged in water and has a mouth from which water is jetted out; a detecting device, which is arranged in the water and detects sound in at least a part of a period during which the water is being jetted out from the mouth; and a processing device, which determines, based on a result of the detection by the detecting device, presence or absence of abnormality in the nozzle.
    Type: Application
    Filed: January 12, 2015
    Publication date: August 20, 2015
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Motoyuki FUJII, Takanori ARAI
  • Patent number: 7613307
    Abstract: An active noise insulation wall includes an active sound reduction apparatus disposed on an upper end surface of a noise insulation wall. The active sound reduction apparatus comprises a combination of an active acoustic control cell and a sound tube. The active acoustic control cell controls a coming noise such that a diffracted sound pressure component of the coming noise at the upper end surface of the noise insulation wall is actively reduced. The sound tube decreases a sound wave of a frequency different from a target frequency of the active acoustic control cell. Thus, the active noise insulation wall can effectively reduce noises including many frequency components.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: November 3, 2009
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Keizo Ohnishi, Masaharu Nishimura, Susumu Teranishi, Takanori Arai
  • Publication number: 20060251267
    Abstract: An active noise insulation wall includes an active sound reduction apparatus disposed on an upper end surface of a noise insulation wall. The active sound reduction apparatus comprises a combination of an active acoustic control cell and a sound tube. The active acoustic control cell controls a coming noise such that a diffracted sound pressure component of the coming noise at the upper end surface of the noise insulation wall is actively reduced. The sound tube decreases a sound wave of a frequency different from a target frequency of the active acoustic control cell. Thus, the active noise insulation wall can effectively reduce noises including many frequency components.
    Type: Application
    Filed: July 6, 2006
    Publication date: November 9, 2006
    Inventors: Keizo Ohnishi, Masaharu Nishimura, Susumu Teranishi, Takanori Arai
  • Patent number: 6964093
    Abstract: An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has solder printed on all the lands thereof at the same time, the electronic parts (10) are all placed on the lands at the same time, and the electronic parts (10) are all soldered to the lands at the same time. Thus, the system (1) can be designed more compact, and the electronic parts packaged in a shorter time.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: November 15, 2005
    Assignee: Sony Corporation
    Inventors: Kazuhisa Mochida, Katsumi Togasaki, Katsumi Morita, Yusuke Masutani, Hiroji Kameda, Noboru Sekiguchi, Minoru Shimada, Toshio Toyama, Akihiro Koga, Mitsuo Inoue, Kazuhiro Abe, Tetsuya Yonemoto, Kenji Ishihara, Syunji Aoki, Fumio Matsumoto, Takanori Arai, Hisashi Naoshima
  • Publication number: 20030224524
    Abstract: The present invention enables a lower cost, a smaller equipment size, and a simplified operation for analysis. The invention comprises the steps of tilting a container 29 containing a biological sample and ejecting the biological sample within the container 29 onto the central portion of a cartridge 33 mounted on a turntable 21; rotating the turntable 21, exerting a centrifugal force upon the biological sample on the cartridge 33, and guiding the biological sample evenly into a plurality of reagent containing parts 41 arranged radially in the cartridge 33; and analyzing the biological sample after it is guided into each of the reagent containing parts 41 and mixed with a reagent 42, 44 within each of the reagent containing parts 41.
    Type: Application
    Filed: May 21, 2003
    Publication date: December 4, 2003
    Inventors: Takanori Arai, Noriyuki Nomura
  • Publication number: 20020133937
    Abstract: In an electronics packaging system (1) including a printer (3), placing unit (4) and reflow unit (5), a printed wiring board (2) is carried while being kept in upright position. The printed wiring board (2) has solder printed on lands thereof at the same time, electronic parts (10) placed on the lands at the same time, and the electronic parts (10) solder to the lands at the same time. Thus, the system (1) can be designed more compact, and package electronic parts in a shorter time.
    Type: Application
    Filed: April 12, 2002
    Publication date: September 26, 2002
    Inventors: Kazuhisa Mochida, Katsumi Togasaki, Katsumi Morita, Yusuke Masutani, Hiroji Kameda, Noboru Sekiguchi, Minoru Shimada, Toshio Toyama, Akihiro Koga, Mitsuo Inoue, Kazuhiro Abe, Tetsuya Yonemoto, Kenji Ishihara, Syunji Aoki, Fumio Matsumoto, Takanori Arai, Hisashi Naoshima
  • Publication number: 20010046303
    Abstract: An active noise insulation wall includes an active sound reduction apparatus disposed on an upper end surface of a noise insulation wall. The active sound reduction apparatus comprises a combination of an active acoustic control cell and a sound tube. The active acoustic control cell controls a coming noise such that a diffracted sound pressure component of the coming noise at the upper end surface of the noise insulation wall is actively reduced. The sound tube decreases a sound wave of a frequency different from a target frequency of the active acoustic control cell. Thus, the active noise insulation wall can effectively reduce noises including many frequency components.
    Type: Application
    Filed: April 20, 2001
    Publication date: November 29, 2001
    Inventors: Keizo Ohnishi, Masaharu Nishimura, Susumu Teranishi, Takanori Arai