Patents by Inventor Takanori ATSUSAKA

Takanori ATSUSAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230271761
    Abstract: This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer contains a copolymer (A) of a styrene-based hydrocarbon and a conjugated diene-based hydrocarbon, the component (A) contains a block copolymer (A-1) of 10% by mass or more and less than 50% by mass of a styrene-based hydrocarbon and more than 50% by mass and 90% by mass or less of a conjugated diene-based hydrocarbon, and a block copolymer (A-2) of 50% by mass or more and 95% by mass or less of a styrene-based hydrocarbon and 5% by mass or more and 50% by mass or less of a conjugated diene-based hydrocarbon, a content of the component (A-1) is 35 to 60% by mass based on a total amount of the heat seal layer, and a mass ratio of the component (A-2) to the component (A-1) is 0.30 to 1.0.
    Type: Application
    Filed: August 18, 2021
    Publication date: August 31, 2023
    Applicant: Denka Company Limited
    Inventors: Keisuke NABA, Gosuke NAKAJIMA, Takanori ATSUSAKA, Hisatsugu TOKUNAGA
  • Publication number: 20230265317
    Abstract: This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer contains a polystyrene-based resin (A) and an ethylene-(meth)acrylic acid-based copolymer (B), and contents of the component (A) and the component (B) are more than 80 parts by mass and 95 parts by mass or less and 5 parts by mass or more and less than 20 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B).
    Type: Application
    Filed: August 18, 2021
    Publication date: August 24, 2023
    Applicant: Denka Company Limited
    Inventors: Gosuke NAKAJIMA, Keisuke NABA, Takanori ATSUSAKA, Hisatsugu TOKUNAGA
  • Patent number: 11541645
    Abstract: A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of ?20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: January 3, 2023
    Assignee: DENKA COMPANY LIMITED
    Inventors: Takanori Atsusaka, Akira Sasaki, Saori Niwa, Shun Uchiyama, Akihiro Yoshikawa
  • Publication number: 20220242634
    Abstract: A cover film having at least a substrate layer and a sealant resin layer, wherein the sealant resin layer is formed to contact one surface of the substrate layer or is formed on an intermediate resin layer contacting one surface of the substrate layer, and the sealant resin layer contacting the substrate layer or the intermediate resin layer contacting the substrate layer contains an epoxidized fatty acid or a derivative thereof. The epoxidized fatty acid or a derivative thereof in the sealant resin layer contacting the substrate layer or in the intermediate resin layer contacting the substrate layer is preferably at a content of 0.5 parts by mass or less with respect to 100 parts by mass of a resin component constituting the intermediate resin layer contacting the substrate layer and/or the sealant resin layer contacting the substrate layer.
    Type: Application
    Filed: July 3, 2020
    Publication date: August 4, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takanori ATSUSAKA, Saori NIWA, Takeshi SAITOH
  • Publication number: 20200247099
    Abstract: A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of ?20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.
    Type: Application
    Filed: October 29, 2018
    Publication date: August 6, 2020
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takanori ATSUSAKA, Akira SASAKI, Saori NIWA, Shun UCHIYAMA, Akihiro YOSHIKAWA