Abstract: A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes: a first step of applying the adhesive agent to an end surface of a wall; a second step of flattening out the adhesive agent on the end surface of the wall of the supply port in the height direction intersecting the end surface by moving the end surface of the wall of the supply port and the end surface of the wall of the supply passage toward each other; and a third step of moving the ridge line of the wall of the supply port in a direction along the end surface of the wall of the supply port.

Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.

Abstract: There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.

Abstract: Provided is a liquid ejection head formed by performing bonding and fixing operations speedily and highly accurately when a recording element board is bonded to a supporting member, the liquid ejection head having a high liquid-landing accuracy and achieving a high printing quality. A method of manufacturing the liquid ejection head is also provided. Heat is conducted from a holding member, which supports the recording element board, to a thermosetting adhesive via the supporting member, which supports the recording element board, in order to accelerate the curing of the adhesive.

Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.

Abstract: There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.

Abstract: A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes: a first step of applying the adhesive agent to an end surface of a wall; a second step of flattening out the adhesive agent on the end surface of the wall of the supply port in the height direction intersecting the end surface by moving the end surface of the wall of the supply port and the end surface of the wall of the supply passage toward each other; and a third step of moving the ridge line of the wall of the supply port in a direction along the end surface of the wall of the supply port.

Abstract: A liquid recording head includes a protective layer having resistance to liquid and an adhesiveness improving film disposed on a second surface of a silicon substrate, opposite to a first surface. The first surface and the second surface have a plane direction (100). The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates with a liquid introduction port on a side of the second surface of the silicon substrate.

Abstract: Provided is a liquid recording head in which a protective layer having resistance to liquid and an adhesiveness improving film are disposed on a second surface opposite to a first surface of a silicon substrate. The first surface and the second surface have a plane direction. The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates to a liquid introduction port on a side of the second surface of the silicon substrate.

Abstract: An inkjet recording head, wherein a support member being formed by at least two layers is provided between an ink supply member and a recording element substrate having a substrate, which includes discharge ports to discharge ink and an energy generating element to generate energy to discharge the ink from the discharge ports.

Abstract: An ink jet print head includes a print element substrate having an ink ejection energy generator, a support substrate to support the print element substrate, and an ultraviolet light and heat combination setting adhesive bonding the print element substrate to the support substrate. A bonding surface of the support substrate on which the print element substrate is supported is formed with an ultraviolet light reflection prevention surface that prevents a reflection of ultraviolet light.

Abstract: An inkjet recording head, wherein a support member being formed by at least two layers is provided between an ink supply member and a recording element substrate having a substrate, which includes discharge ports to discharge ink and an energy generating element to generate energy to discharge the ink from the discharge ports.

Abstract: The present invention provides an ink jet print head having an improved intimate contact between the print element substrate and the support substrate and therefore a high level of reliability. A method of manufacturing such a print head is also provided. To this end, an ultraviolet light/heat setting adhesive with an additive of coupling agent is used to bond the first and second print element substrates to the first plate. The bonding surface of the first plate is formed with an ultraviolet light reflection prevention area.