Abstract: In order to further improve the communication quality, the electronic device (10) according to this disclosure includes the antenna (17) disposed on the case back (15) provided at the back side of the device, the display (11) provided on the front side of the device and the sheet metal member (12) that is provided at the front side of the device and is configured to protect the display (11). The sheet metal member (12) has a notch (121) extending in a specific direction, and the notch (121) divides the sheet metal member (12) into the external part (12A) and the internal part (12B) of the notch in the direction intersecting with a specific direction, and the external part (12A) functions as the antenna (18).

Abstract: In order to further improve the communication quality, the electronic device (10) according to this disclosure includes the antenna (17) disposed on the case back (15) provided at the back side of the device, the display (11) provided on the front side of the device and the sheet metal member (12) that is provided at the front side of the device and is configured to protect the display (11). The sheet metal member (12) has a notch (121) extending in a specific direction, and the notch (121) divides the sheet metal member (12) into the external part (12A) and the internal part (12B) of the notch in the direction intersecting with a specific direction, and the external part (12A) functions as the antenna (18).

Abstract: According to an aspect, a human body detecting system includes a mobile communication device, a stand, and a false detection reducing unit. The mobile communication device includes a communication unit for performing communication. The stand includes a human sensor for detecting a human body based on an ambient temperature distribution, and a storage unit for storing detection information of the human sensor. The false detection reducing unit is configured to perform false detection reducing processing on at least either one of the detection information of the human sensor and operation of the human sensor.

Abstract: A first conduction part (12) coated with a conductive paint is formed on a back housing (1CAR) to be attached to one housing of a portable telephone unit at a position near a hinge mechanism (9) which connects the one housing to the other housing of the portable telephone unit. A GPS antenna is disposed on the hinge mechanism (9) side inside the other housing. The first conduction part (12) is in contact with a conductive connection terminal (21). A condenser element (22C) and a coil element (22L) are connected in parallel between the connection terminal (21) and a reference potential line (10G) of a first circuit board (10) disposed inside the aforementioned one housing.

Abstract: According to an aspect, a human body detecting system includes a mobile communication device, a stand, and a false detection reducing unit. The mobile communication device includes a communication unit for performing communication. The stand includes a human sensor for detecting a human body based on an ambient temperature distribution, and a storage unit for storing detection information of the human sensor. The false detection reducing unit is configured to perform false detection reducing processing on at least either one of the detection information of the human sensor and operation of the human sensor.

Abstract: A mobile wireless device in which a first housing and a second housing are connected together at base ends thereof via a hinge section, the first housing including a first circuit board to which a first antenna and a second antenna are connected, and the second housing including a second circuit board, includes: an electric wiring section that brings a reference potential section of the first circuit board and a reference potential section of the second circuit board into conduction; and an inductive coupler that inductively couples the reference potential section of the first circuit board and the reference potential section of the second circuit board at high frequency near the second antenna provided at the base end of the first housing, the inductive coupler including a first conductor that extends toward the second housing side at the base end of the first housing and connects to the reference potential section of the first circuit board.

Abstract: A first conduction part (12) coated with a conductive paint is formed on a back housing (1CAR) to be attached to one housing of a portable telephone unit at a position near a hinge mechanism (9) which connects the one housing to the other housing of the portable telephone unit. A GPS antenna is disposed on the hinge mechanism (9) side inside the other housing. The first conduction part (12) is in contact with a conductive connection terminal (21). A condenser element (22C) and a coil element (22L) are connected in parallel between the connection terminal (21) and a reference potential line (10G) of a first circuit board (10) disposed inside the aforementioned one housing.

Abstract: A mobile wireless device in which a first housing and a second housing are connected together at base ends thereof via a hinge section, the first housing including a first circuit board to which a first antenna and a second antenna are connected, and the second housing including a second circuit board, includes: an electric wiring section that brings a reference potential section of the first circuit board and a reference potential section of the second circuit board into conduction; and an inductive coupler that inductively couples the reference potential section of the first circuit board and the reference potential section of the second circuit board at high frequency near the second antenna provided at the base end of the first housing, the inductive coupler including a first conductor that extends toward the second housing side at the base end of the first housing and connects to the reference potential section of the first circuit board.

Abstract: An wireless communication apparatus having a first case and a second case connected on each end to be able to open and close. The first case has an antenna element in an end opposite to the connected end, the second case has a first display unit displaying an image on a facing surface facing the first case in a closed state, a first drive unit driving the first display unit, a second display unit displaying an image on a back surface which is behind the facing surface, a second drive unit driving the second display unit, a frame which is provided between the first display unit and the second display unit and touched a back of the first display unit. The frame, the first drive unit and the second drive unit are arranged without overlapping the antenna element in the closed state, the second display unit is layered on the frame to overlap the second display unit and the antenna element in the closed state.

Abstract: A mobile wireless device including: first housing, a second housing, a signal line electrically connecting a circuit of the first housing and a circuit of the second housing, and a connection portion for connecting the first housing and the second housing so that they can be opened and closed, wherein ends of the housings have openings communicating with interiors of the housings and through which the signal line passed, the second housing houses an electronic circuit including a wireless unit, the electronic circuit has one end of the signal line connected to it, the first housing houses a circuit board including a reference potential layer, and the circuit board has the other and of the signal line connected to it, a conductive part is arranged from the opening of the first housing up to a position of the circuit board where the signal line is connected, and the conductive part is electrically connected to the reference potential layer of the circuit board.

Abstract: A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.

Abstract: A mobile wireless device including: first housing, a second housing, a signal line electrically connecting a circuit of the first housing and a circuit of the second housing, and a connection portion for connecting the first housing and the second housing so that they can be opened and closed, wherein ends of the housings have openings communicating with interiors of the housings and through which the signal line passed, the second housing houses an electronic circuit including a wireless unit, the electronic circuit has one end of the signal line connected to it, the first housing houses a circuit board including a reference potential layer, and the circuit board has the other and of the signal line connected to it, a conductive part is arranged from the opening of the first housing up to a position of the circuit board where the signal line is connected, and the conductive part is electrically connected to the reference potential layer of the circuit board.

Abstract: The present invention provides a semiconductor device having a stacked structure which realizes the miniaturization of a contour size and the reduction of thickness. The present invention also provides a semiconductor device which realizes high performance and high reliability in addition to the miniaturization of the contour size. The semiconductor device uses a package substrate on which bonding leads which are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads are formed. The semiconductor device further includes an address output circuit and a data input/output circuit which are also served for memory access and a signal processing circuit having a data processing function.

Abstract: A semiconductor device uses a package substrate on which bonding leads are formed respectively corresponding to bonding pads for address and data which are distributed to opposing first and second sides of a memory chip and address terminals and data terminals which are connected to the bonding leads. The semiconductor device further includes an address output circuit and a data input/output circuit which also serves for memory access and a signal processing circuit having a data processing function. A semiconductor chip having bonding pads connected to the bonding leads corresponding to the address terminals of the package substrate and bonding pads connected to the bonding leads corresponding to the data terminals of the package substrate and distributed to two sides out of four sides and the above-mentioned memory chip are mounted on the package substrate in a stacked structure.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: An wireless communication apparatus having a first case and a second case connected on each end to be able to open and close. The first case has an antenna element in an end opposite to the connected end, the second case has a first display unit displaying an image on a facing surface facing the first case in a closed state, a first drive unit driving the first display unit, a second display unit displaying an image on a back surface which is behind the facing surface, a second drive unit driving the second display unit, a frame which is provided between the first display unit and the second display unit and touched a back of the first display unit. The frame, the first drive unit and the second drive unit are arranged without overlapping the antenna element in the closed state, the second display unit is layered on the frame to overlap the second display unit and the antenna element in the closed state.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.