Abstract: A wireless communication device includes an antenna and is used for storage as an electrical conductive body. The antenna includes a first conductor and a second conductor, one or more third conductors, a fourth conductor, and a feeding line. The first conductor and the second conductor face each other in a first axis. The one or more third conductors are located between the first conductor and the second conductor and extend in the first axis. The fourth conductor is connected to the first conductor and the second conductor and extends in the first axis. The feeding line is connected to any one of the third conductors. The first conductor and the second conductor are capacitively coupled to each other via the third conductor. The fourth conductor faces a conductor part of the storage.

Abstract: A wireless communication system includes a first wireless communication device installed on an installation surface of a vehicle and a second wireless communication device. The first wireless communication device includes an antenna and a sensor. The antenna includes a first conductor, a second conductor, one or more third conductors, a fourth conductor, and a feeding line. The first wireless communication device transmits a signal from the antenna to the second wireless communication device, based on information detected by the sensor.

Abstract: An example of embodiments of the present disclosure includes a wireless communication bolt. The wireless communication bolt includes a bolt and a wireless communication module. The bolt includes a shaft part and a head part. The wireless communication module includes an antenna. The antenna includes a first conductor, a second conductor, a plurality of third conductors, a fourth conductor, and a feeding line. The second conductor faces the first conductor along a first axis. The plurality of third conductors are positioned between the first conductor and the second conductor. The plurality of third conductors extend along the first axis. The fourth conductor is connected to the first conductor and the second conductor. The fourth conductor extends along the first axis. The feeding line is electromagnetically connected to the third conductor. The fourth conductor faces the head part.

Abstract: A wireless communication system includes a first wireless communication device installed on an installation surface of a vehicle and a second wireless communication device. The first wireless communication device includes an antenna and a sensor. The antenna includes a first conductor, a second conductor, one or more third conductors, a fourth conductor, and a feeding line. The first wireless communication device transmits a signal from the antenna to the second wireless communication device, based on information detected by the sensor.

Abstract: A wireless communication device includes an antenna and is used for storage as an electrical conductive body. The antenna includes a first conductor and a second conductor, one or more third conductors, a fourth conductor, and a feeding line. The first conductor and the second conductor face each other in a first axis. The one or more third conductors are located between the first conductor and the second conductor and extend in the first axis. The fourth conductor is connected to the first conductor and the second conductor and extends in the first axis. The feeding line is connected to any one of the third conductors. The first conductor and the second conductor are capacitively coupled to each other via the third conductor. The fourth conductor faces a conductor part of the storage.

Abstract: An information processing apparatus includes a communication interface and a controller. The communication interface receives, from a sensor container, information indicating an orientation of the sensor container. The controller, based on the information indicating the orientation of the sensor container, calculates a calculated value indicating a remaining amount of contents of the sensor container. The controller determines an estimated value of the remaining amount on the basis of the calculated value. The communication interface transmits the estimated value indicating the remaining amount to an external device. When the calculated value indicating the remaining amount decreases by a first predetermined value or more within a predetermined time period, the controller does not perform the determination of the estimated value on the basis of the calculated value.

Abstract: An information processing apparatus includes a communication interface and a controller. The communication interface receives, from a sensor container, information indicating an orientation of the sensor container. The controller, based on the information indicating the orientation of the sensor container, calculates a calculated value indicating a remaining amount of contents of the sensor container. The controller determines an estimated value of the remaining amount on the basis of the calculated value. The communication interface transmits the estimated value indicating the remaining amount to an external device. When the calculated value indicating the remaining amount decreases by a first predetermined value or more within a predetermined time period, the controller does not perform the determination of the estimated value on the basis of the calculated value.

Abstract: An electronic component has a mounting board, a bump located on a mounting surface of the mounting board, a SAW device located on the bump and connected to the bump. The SAW device has an element substrate, an excitation electrode located on the first primary surface of the element substrate, a pad located on the first primary surface and connected to the excitation electrode, and a cover located above the excitation electrode and formed with a pad exposure portion on the pad. Further, the SAW device makes the top surface of the cover face the mounting surface, makes the bump be located in the pad exposure portion, and makes the pad abut against the bump.

Abstract: A SAW element has a substrate; an IDT electrode located on an upper surface of the substrate and comprises Al or an alloy containing Al; a first film located on an upper surface of the IDT electrode; and a protective layer which covers the IDT electrode provided with the first film and the portion of the substrate exposed from the IDT electrode, which has a thickness from the upper surface of the substrate larger than a total thickness of the IDT electrode and first film, and which contains a silicon oxide. The first film contains a material which has a larger acoustic impedance than the material (Al or the alloy containing Al) of the IDT electrode and the silicon oxide and which has a slower propagation velocity of an acoustic wave than the material of the IDT electrode and the silicon oxide.

Abstract: An electronic component has a mounting board, a bump located on a mounting surface of the mounting board, a SAW device located on the bump and connected to the bump. The SAW device has an element substrate, an excitation electrode located on the first primary surface of the element substrate, a pad located on the first primary surface and connected to the excitation electrode, and a cover located above the excitation electrode and formed with a pad exposure portion on the pad. Further, the SAW device makes the top surface of the cover face the mounting surface, makes the bump be located in the pad exposure portion, and makes the pad abut against the bump.

Abstract: A SAW element has a substrate, electrode fingers on an upper surface of the substrate, and mass-adding films on upper surfaces of the electrode fingers. When viewing the cross-sections perpendicular to the extending directions of the electrode fingers, the mass-adding films have the narrowest widths at an upper sides in the cross-sections. By arranging the mass-adding films having such shape on the upper surfaces of the electrode fingers, the electromechanical coupling factor can be made high.

Abstract: A SAW element has a substrate; an IDT electrode located on an upper surface of the substrate and comprises Al or an alloy containing Al; a first film located on an upper surface of the IDT electrode; and a protective layer which covers the IDT electrode provided with the first film and the portion of the substrate exposed from the IDT electrode, which has a thickness from the upper surface of the substrate larger than a total thickness of the IDT electrode and first film, and which contains a silicon oxide. The first film contains a material which has a larger acoustic impedance than the material (Al or the alloy containing Al) of the IDT electrode and the silicon oxide and which has a slower propagation velocity of an acoustic wave than the material of the IDT electrode and the silicon oxide.

Abstract: Provided is a demultiplexer capable of improving attenuation characteristic and isolation characteristic of a filter having a lower transmission frequency band among two filters having different transmission frequency bands, outside the transmission frequency band of a high-frequency side. A communication device using the demultiplexer is also disclosed. A first spiral wiring portion (55) and a sixth wiring portion (56) are formed so that an angle defined by a direction of a part (L1) of the first spiral wiring portion (55) and a direction of a part (L2) of the sixth spiral wiring portion (56) on a predetermined virtual plane is, for example, 0 degree and the direction of the current flowing in the part (L1) of the first spiral wiring portion (55) is opposite to the direction of the current flowing in the part (L2) if the sixth wiring portion (56).

Abstract: Provided is a demultiplexer capable of improving attenuation characteristic and isolation characteristic of a filter having a lower transmission frequency band among two filters having different transmission frequency bands, outside the transmission frequency band of a high-frequency side. A communication device using the demultiplexer is also disclosed. A first spiral wiring portion (55) and a sixth wiring portion (56) are formed so that an angle defined by a direction of a part (L1) of the first spiral wiring portion (55) and a direction of a part (L2) of the sixth spiral wiring portion (56) on a predetermined virtual plane is, for >example, 0 degree and the direction of the current flowing in the part (L1) of the first spiral wiring portion (55) is opposite to the direction of the current flowing in the part (L2) if the sixth wiring portion (56).

Abstract: Terminal electrodes 9 for carrying a high frequency device 3 are formed on a surface of a circuit board having its reverse surface covered with a reverse surface conductor layer 6, and a plurality of signal lines 2 for exchanging a signal between the high frequency device 3 and an external circuit are formed thereon. The terminal electrode 9 is arranged at the center of the circuit board, and the signal lines 2 radially extends from the terminal electrode 9. Electromagnetic interference between the signal lines 2 can be reduced, so that out-of-band attenuation characteristics and isolation characteristics can be satisfactorily exhibited in a case where the high frequency device 3 is a duplexer.

Abstract: An IDT electrode 2 and an electrode pad 3 are formed on one principal face of a piezoelectric substrate 1 and a circular electrode 4 is formed so as to surround these components. The circular electrode 4 is connected to a radiating conductor 15 formed on a bottom face of a circuit board 11 through a via conductor 14 formed within the circuit board 11. Thus, since heat generated in the IDT electrode 2 is easy to be released to the outside through the circular electrode 4, the via conductor 14 and the radiating conductor 15, adverse effects due to the heat can be prevented, thereby improving high power durability.

Abstract: A conductor layer 10 is provided so as to prevent pyroelectric destruction occurring in the steps of manufacturing a surface acoustic wave element 1 on the other surface opposite to an IDT electrode formation surface of a piezoelectric substrate 2. At this time, the conductor layer 10 is formed, except for a region 5a opposed to an input electrode section 5 in a filter region 9 and/or a region 6a opposed to an output electrode section 6. This allows a coupling amount between the input electrode section 5 and the output electrode section 6 due to a parasitic capacitance formed between the input electrode section 5 and the output electrode section 6 in the filter region 9 to be reduced, thereby allowing the out-of-band attenuation characteristics of a surface acoustic wave device to be improved.

Abstract: In a surface acoustic wave device according to the present invention, a transmitting filter element TX and a receiving filter element RX are formed on one main surface of a piezoelectric substrate 300, and are mounted by face down on an upper surface of a circuit board 200. A ground electrode 322 in the receiving filter element RX is connected to three linear via conductors 221? formed on the circuit board 200, and a ground electrode 312 in the transmitting filter element TX is connected to a crank-shaped via conductor 211? formed on the circuit board 200.

Abstract: Terminal electrodes 9 for carrying a high frequency device 3 are formed on a surface of a circuit board having its reverse surface covered with a reverse surface conductor layer 6, and a plurality of signal lines 2 for exchanging a signal between the high frequency device 3 and an external circuit are formed thereon. The terminal electrode 9 is arranged at the center of the circuit board, and the signal lines 2 radially extends from the terminal electrode 9. Electromagnetic interference between the signal lines 2 can be reduced, so that out-of-band attenuation characteristics and isolation characteristics can be satisfactorily exhibited in a case where the high frequency device 3 is a duplexer.

Abstract: A directivity controllable array antenna with a variable phase shifter is provided which is stable and has a small waveform and intermodulation distortion, excellent high power handling capability and low-loss. In an array antenna with a variable phase shifter, the variable phase shifter has a transmission line, and a variable capacitance capacitor is connected to a terminal of a ground side of the transmission line. In the variable capacitance capacitor, a plurality of variable capacitance elements each using a thin film dielectric layer whose dielectric constant changes in accordance with an applied voltage are connected between an input terminal and an output terminal, in parallel to each other with respect to direct current component and in series with each other with respect to high frequency component.