Abstract: A semiconductor device of this invention has an LOC (Lead On Chip) structure, and a protective film consisting of a thermoplastic (thermosetting) resin material such as a thermoplastic (thermosetting) polyimide resin or a thermoplastic (thermosetting) polyamide resin is formed on the surface of a semiconductor chip having a DRAM. The lower surface of a lead frame is positioned to the upper surface of the semiconductor chip, on which the protective film is formed, and the upper surface of the semiconductor chip is bonded and fixed to the lower surface of the distal end portion of an inner lead with only the protective film interposed therebetween such that bonding pads appear between opposing bus bars. According to this invention, the protective film serves not only as an &agr;-ray protective film but also as an insulating material and an adhesive material.